Royalty Report: Semiconductors, Fabrication, Scientific & Technical Instruments – Collection: 6873

$150.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 18

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 18

Primary Industries

  • Semiconductors
  • Fabrication
  • Scientific & Technical Instruments
  • IC
  • Test/Monitoring
  • Business Method
  • RAM
  • Lithography
  • Computers & Office Equipment
  • Consumer Electronics
  • Electrical & Electronics
  • Machinery
  • Circuits

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 6873

License Grant
The Company of Israel  signed a technology-License Agreement, whereby the Company received a patent usage right as well as equipment from an undisclosed Licensor.
License Property
Metrology systems measure various thin film properties, critical circuit dimensions and layer-to-layer circuit alignment, known as overlay, during various steps in the semiconductor manufacturing process, allowing semiconductor manufacturers to increase quality, productivity and yields, lower their manufacturing costs and increase their profitability
Field of Use
The Licensee is a worldwide leading designer, developer and producer of integrated process control metrology systems used in the manufacture of semiconductors and a leading designer, manufacturer and producer of stand-alone process control metrology systems.

IPSCIO Record ID: 286021

License Grant
University hereby grants to Licensee, subject to the terms herein recited, the exclusive, nontransferable (except as provided in Agreement herein) perpetual, royalty bearing, worldwide right and license under the Patent Rights with the right to grant sublicenses, to make, have made, use, sell and distribute (directly or indirectly through third parties) Licensed Products.
License Property
Patent Rights shall mean
(a)  U.S. Patent 4,710,030, Optical generator and detector of stress pulses.
(b)  U.S. Patent 5,706,094, Ultrafast optical technique for the characterization of altered materials
(c)  U.S. Patent 5,864,393, Optical method for the determination of stress in thin films.
(d)  U.S. Patent 5,748,317, Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector.
(e)  U.S. Patent 5,748,318, Optical stress generator and detector.
(f)  U. S. Patent 5,844,684, Optical method for determining the mechanical properties of a material.

Licensed Product shall not, however, include (i) replacement parts provided or sold to end-users after the initial system is delivered; (ii) all software provided after delivery which does not provide additional  functional capabilities which incorporates the claims of the Patent Rights; (iii) software upgrades or revisions which do not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iv) service and maintenance of hardware and/or software and peripherals to the system.  For purposes of this Agreement, a product shall be deemed a Licensed Product if such product is covered, in whole or in part, by at least one Patent Right in one country, whether or not that product is made, used or sold within that country.  For example, an instrument system that incorporates one of the claims of U.S. Patent 4,710,030 would be a Licensed Product and would be subject to a royalty payment if sold in Japan, even though there is no issued patent in Japan.

Field of Use
This agreement pertains to the semiconductor industry relating to the measurement of the properties of thin films and surface characteristics; and semiconductor metrology automation platforms (FE-III, FE-IV) including, an automatic microscope, auto height, tilt optics platform, automated wafer handling robotics and control system with proprietary software, operation interface, pattern recognition system SECS-II/GEM system, data mapping system, data review system and recipe system, with attendant know-how, process technology and related software; and technology to industry of instruments for the measurement of surface characteristics.

Metal and Opaque Thin Film Measurement Solutions. Licensee's MetaPULSE family of metrology systems incorporates our proprietary technology for optical acoustic metrology, which allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non- contact manner on product wafers. By minimizing the need for test wafers, MetaPULSE enables Licensee's customers to achieve significant cost savings. Licensee believe that Licensee currently offer the only systems that can non-destructively measure up to six metal film layers with the degree of accuracy semiconductor device manufacturers demand. Licensee's MetaPULSE systems use ultra-fast lasers to generate sound waves that pass down through a stack of metal or opaque films such as copper and aluminum, sending back to the surface an echo which is detected and analyzed. These systems precisely measure the films with Angstrom accuracy and sub-Angstrom repeatability at high throughputs. This accuracy and repeatability is critical to semiconductor device manufacturers' ability to achieve higher manufacturing yields with the latest fabrication processes.

IPSCIO Record ID: 6727

License Grant
The Parties have agreed to the joint development of semiconductor apparatus and processes relating to plating technology for advanced packaging and integration solutions in semiconductor processing and manufacturing. The Licensor has granted a license under its intellectual property rights to develop, make, have made and sell certain products.
License Property
Packaging Technology means any process, procedure, software, or hardware tools used in the packaging of Integrated Circuit products into single-chip packages, multi-chip packages, or any other higher levels of assembly.

IPSCIO Record ID: 27456

License Grant
The Company licensed certain trademarks and technology, and granted to a company headquartered in Kanagawa Prefecture, Japan the exclusive right to manufacture and sell in Japan, Korea, Taiwan, Hong Kong, China, India, the Philippines, Thailand, Vietnam, Malaysia, Singapore and Indonesia, and such other countries as the parties may agree to from time to time, products similar to those manufactured and distributed by the Company.
License Property
The Company designs, develops, manufactures, markets and services chemical mechanical planarization, or CMP, systems used in the fabrication of semiconductor devices as well as other high throughput precision surface processing systems used in the fabrication of thin film memory disk media, semiconductor wafers and general industrial components; products include polishing, grinding and lapping equipment and systems; cleaning systems; other high precision surface processing equipment; and certain other products used in its customers’ manufacturing process, including slurries.

IPSCIO Record ID: 211882

License Grant
Licensor grants to the Singapore Licensee a non-exclusive license under the Licensors Licensed Patents
– to make Licensees Licensed Products only in Singapore and one Licensee Elected Country;
– to use, import, and lease, offer for sale, sell or otherwise transfer Licensees Licensed Products worldwide;
– to use any apparatus in the manufacture or testing of Licensee Licensed Products and to practice any method or process in such manufacture or testing of Licensees Licensed Products; and
– to have Licensees Licensed Products made in whole or in part by another manufacturer for the use and/or lease, offer for sale, sale or other transfer by Licensee only when the designs and specifications for such Licensees Licensed Products were provided by Licensee to the other manufacturer, whether developed by Licensee or received by Licensee from customers to whom the Licensed Products are to be sold.
License Property
The Licensed Products shall mean Semiconductor Apparatus.

Semiconductor Apparatus shall mean Semiconductor Material, Semiconductor Device, Semiconductor Circuit, Integrated Circuit and/or Semiconductor Memories and any combination of such apparatus with other such apparatus.

'Integrated Circuit' shall mean an integral unit including a plurality of active and/or passive circuit elements formed at least in part of Semiconductor Material and associated on, or in, one substrate comprising the first level of packaging for such elements; such unit forming or contributing to the formation of a circuit for performing electrical or electronic functions.

'Semiconductor Circuit' shall mean a circuit in which one or more Semiconductor Devices are interconnected in one or more paths (including passive circuit elements, if any) for performing fundamental electrical or electronic functions and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Device' shall mean a device and any material therefor, including but not limited to device structures such as transistors, diodes, capacitors, resistors, conductors and dielectrics, comprising a body of one or more Semiconductor Materials and one or more electrodes associated therewith and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Material' shall mean any material whose conductivity is intermediate to that of metals and insulators at room temperature and whose conductivity, over some temperature range, increases with increases in temperature. Such materials shall include, but not be limited to, refined products, reaction products, reduced products, mixtures and compounds.

'Semiconductor Memory' shall mean any instrumentality or aggregate of instrumentalities, which instrumentality or aggregate is designed only for storing digital information, intelligence or data by selectively setting or presetting detectable states in Semiconductor Material forming at least a part of such instrumentality or aggregate, such instrumentality or aggregate may include powering means and auxiliary and/or support circuits (such as regeneration means, true-complement generations means, address decoding means, sensing means and selection means) to control the flow of such information, intelligence or data into and out of such Semiconductor Memory.

Field of Use
This agreement is for the semiconductor industry.

IPSCIO Record ID: 134397

License Grant
The Licensor released the non-compete clause in the agreement for a royalty payment in the field of pre-owned equipment sales through January 2002.
License Property
The pre-owned equipment is semiconductor production equipment relating to semiconductor manufacturing tools and systems.
Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 29174

License Grant
The Licensor granted the Japanese Licensee, an exclusive, royalty bearing, nontransferable right and license during the term of this Agreement in the territory of Japan, to use Licensor's patents, copyrights, mask work rights and proprietary information with respect to the Product, a excimer laser, the primary market for which is for use in DUV photolithography equipment for manufacturing deep-submicron semiconductor devices.

Licensor hereby grants to Licensee the right to use Licensor's trademarks, provided that any use of Licensor's trademarks by Licensee shall be subject to prior approval of Licensor. Any use by Licensee shall be subject to revocation by Licensor if Licensor determines that the quality of Product manufactured by Licensee is not as good or better than that manufactured by Licensor.

License Property
The Licensor is the world's leading supplier of excimer laser illumination sources, the essential light source for deep ultraviolet (DUV) photolithography systems used in the manufacture of semiconductors.
Field of Use
Licensee is granted rights for use in DUV photolithography equipment for manufacturing deep-submicron semiconductor devices.

IPSCIO Record ID: 553

License Grant
Licensor grants to Japanese Licensee a non-exclusive, except during the Exclusivity Period of ten years from the transaction date, transferable, perpetual license to use the Licensee Technology in the FPD Field to make and have made, use, sell, offer for sale and import FPD Film Thickness Measurements Systems and to provide technical support and service (including the sale and for such FPD Film Thickness Measurement Systems.
License Property
Licensed IP means the Nanometrics Technology, the Nanometrics Software and the Licensed Marks.

Licensed Marks means the trademarks of Nanometric.

Licensor designs, develops, manufactures, sells and supports a Film Thickness Measurement System optimized and specially adapted for the measurement of thin films on FPD, including its “NanoSpec” series of products (“FPD Film Thickness Measurement System”).  â€œFPD” means a liquid crystal display, plasma display, field emission display, electroluminescent display, LTPS, HTPS, LCOS or other like flat panel display. FPD excludes devices and technologies other than FPD, including without limitation any and all semiconductor devices.

Field of Use
FPD Field means the development, manufacture, marketing, distribution and sale of Film Thickness Measurement Systems and enhancements thereto for application to FPDs.

IPSCIO Record ID: 293482

License Grant
The Parties wish to settle, dismiss, and terminate the Pending Proceedings and grant each other certain rights and releases under their respective patents pursuant to the terms and conditions of this Agreement.

The Dutch Licensor grants to the Japanese Licensee, under the Licensor Licensed Patents, retroactive to the Effective Application Date of each Licensor Licensed Patent, a non-exclusive, non-sublicensable, non-transferable license, only during the Term, to (a) make, use, including use with patterns or masks for processing substrates such as wafers, Sell, offer to Sell, import and export Licensee Licensed Products anywhere in the world, (b) have Licensee Licensed Products made by its manufacturers anywhere in the world, provided that, solely for purposes of this clause (b) and such have made right is conditioned upon (i) such manufacturers making the Licensee Licensed Products in accordance with specifications provided by a Licensee Grantee Entity, and (ii) such Licensee Licensed Products not being off the shelf products offered for Sale by or on behalf of such manufacturer to Persons other than Licensee Grantee Entities, (c) practice any method or process anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold, and (d) make, have made, and use, including use with patterns or masks for processing substrates such as wafers, any tool, software, machine, or other apparatus anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold.

License Property
Licensee Licensed Products means
(a) Lithography Equipment and Lithography Components, and, in each case, all applications therefor, and
(b) Digital Cameras and all applications therefor; provided, however, that Licensee Licensed Products exclude (i) Licensee Excluded Products and (ii) Components that are solely for use in Licensee Excluded Products. For the avoidance of doubt, Lithography Equipment, Lithography Components, and Digital Cameras are licensed in their entirety, including any Third Party Components thereof. Without limiting the generality of the foregoing, as of the Effective Date, Licensee Licensed Products include Licensee’s and its Grantee Entities’ products within the following product lines NSR series, FX series, LithoBooster, D series, Z series, COOLPIX series, and KeyMission series.

Licensor Licensed Products means Lithography Equipment and Lithography Components, and, in each case, all applications therefor; provided, however, that Licensor Licensed Products exclude (a) Licensor Excluded Products and (b) Components that are solely for use in Licensor Excluded Products.

Lithography Components means, individually and collectively, Components for use in Lithography Equipment, including (a) separately installed Components of any Lithography Equipment, (b) any optical elements, modules and systems, including illumination optical systems, projection optical systems, manipulation devices and mounting means of any Lithography Equipment, (c) any Components integrated in any Lithography Equipment, (d) materials for use in, and solely to the extent they are for use in, the operation of any Lithography Equipment, such as fluids and gases, (e) any software installed in such Lithography Equipment that is used to operate or control such Lithography Equipment, solely to the extent it is for use in the operation or control of Lithography Equipment; including where such Lithography Equipment uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers; and (f) processes, materials and devices for designing, manufacturing, assembling, adjusting and qualifying any of the items described above; provided, however, that Lithography Components shall not include masks, resists, or substrates themselves. Notwithstanding the foregoing, Lithography Components include any entire standalone assembly of a tool or machine, where a standalone assembly of a tool or machine means an assembly that is not included in any Lithography Equipment, solely for (i) measuring either or both alignment marks on a wafer and the topography of a wafer, and (ii) using such measurements solely to calculate feedforward corrections for wafer stage positioning in an Immersion Lithography System, which, for the avoidance of doubt, includes Licensee’s LithoBooster Standalone Alignment Station as and in the form marketed by Licensee as of the Effective Date. For the avoidance of doubt, Lithography Components does not include, by way of examples only, the products of Licensor’s Applications Business Lines, including Licensor’s Yieldstar line of products and including the products of Licensor’s HMI and Brion businesses, in each case, as and in the form such products are marketed by Licensor and its Grantee Entities as of the Effective Date.

Lithography Equipment means any tool or machine for forming or transferring a pattern on or onto a substrate by Lithography for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements to any of the foregoing, including where such tool or machine uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers, or performs maskless Lithography; provided, however, that Lithography Equipment shall not include masks, resists, or substrates themselves. For the avoidance of doubt, except where expressly indicated otherwise in this Agreement, Lithography Equipment includes EUV Lithography Equipment and FPD/Large Area Substrate Equipment.

“Digital Camera” means a complete digital camera or digital camera body for personal or professional photography (including video) use. “Digital Camera” does not include microscopes, medical imaging equipment, or stand-alone lenses.

“EUV Lithography Equipment” means Lithography Equipment that performs Lithography using radiation with wavelengths of 20 nanometers or less, and all Components thereof.

“FPD/Large Area Substrate Equipment” means Lithography Equipment (a) for the manufacture of flat panel displays, or (b) for exposing large area substrates, other than semiconductor wafers, having a dimension greater than 500 mm along any dimension.

Field of Use
The field of use is Lithography and optical equipment  for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements.

IPSCIO Record ID: 286116

License Grant
For Evaluation, Licensor grants to the Licensee of the Netherlands a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to the Evaluation Software, Specifications and Evaluation Circuit Designs, to use and reproduce the Evaluation Software and Specifications solely to conduct evaluation testing of the Products; and use the Evaluation Circuit Designs solely to conduct evaluation testing of the Products.

For Manufacturing, Licensor grants a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to the IC Designs, IC Design Files, Mask Tooling Sets, Manufacturing Test Circuit Designs and Manufacturing Test Software, to make and have made the Products solely for sale to Customers pursuant to this Agreement;  use and reproduce the IC Design Files to manufacture and have manufactured the Mask Tooling Sets solely for use in accordance with this Agreement; use the Mask Tooling Sets to manufacture and have manufactured Products solely for sale, either on a standalone basis or bundled with other Licensee semiconductor products, to Customers solely in accordance with this Agreement, use the Manufacturing Test Circuit Designs solely to test the functionality of Products manufactured in accordance with this Agreement, and use and reproduce the Manufacturing Test Software solely to test the functionality of Products manufactured in accordance with this Agreement.

For Sales by Licensee,  Licensor grants a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to IC Design and IC Design File, to offer for sale, sell, and import Products, either on a standalone basis or bundled with other Licensor semiconductor products, solely in accordance with this Agreement.

License Property
Licensor will design the foregoing integrated circuits and develop certain hardware and software to help bring such integrated circuits into production, and will deliver and license a GDSII design file for the same to  Licensee of the Netherlands for Licensee to manufacture and sell such integrated circuits to customers of Licensee.

Licensor is a fabless semiconductor company that designs, builds, or has built on its behalf, and sells complex, highly integrated systems-on-a-chip radio frequency integrated circuits for consumer broadband and entertainment markets.

IC Design means the integrated circuit design developed by Licensor pursuant to this Agreement.

IC Design File means the GDSII database file containing the IC Design information necessary to manufacture the Mask Tooling Set.

Mask Tooling Set means the collection of masks used to manufacture the layers of Products, or any portion of a Product.

Product means a radio frequency integrated circuit Manufactured by Licensee, or on behalf of Licensee, that conforms to the IC Design.

Evaluation Software means the software developed by Licensor pursuant to this Agreement to evaluate the functionality of Products relative to the Specifications, in object code only.

Reference Design means the system level circuit board design, including a Product, a demodulator and an MPEG decoder, developed by Licensee pursuant to this Agreement to demonstrate the functionality of the Products.

Field of Use
The field of use is for a radio frequency integrated circuit to be incorporated into a Satellite Single Tuner.

Licensee is a global independent semiconductor company which designs, develops, manufactures and markets a broad Satellite Single Tuner means a device that enables the selection and frequency conversion of one stream of information that is disseminated electro-magnetically via radio frequency transmissions from a satellite after block frequency conversion to the frequency range of 9 50MHz to 2150 MHz range of integrated circuits and discrete devices based on semiconductors used in a wide variety of microelectronic applications, including telecommunication systems, computer systems, consumer products, automotive products and industrial automation and control systems.

IPSCIO Record ID: 27303

License Grant
TWI hereby grants to Japanese company the exclusive right and license, without right of sublicense, to use the TWI Intellectual Property Rights to manufacture, use and sell Products (including those incorporating Improvements) to customers for use in non-semiconductor applications, such as flat panel display.
License Property
OP-LCD System is film measurement system for customers for use in non-semiconductor applications using Beam Profile Reflectometry technology and consisting of (1) Measurement Optics, (2) Sample Stage, (3) Control System and (4) Software, details of which are as follows Patent No. 4,999,014  Method and apparatus for measuring thickness of thin films; 5,042,951  High-resolution ellipsometric apparatus; 5,159,412  Optical Measurement Device with enhanced sensitivity; 5,181,080  Method and apparatus for evaluating the thickness of thin films.

(1)  Measurement Optics

     a. Optics for Beam Profile Reflectometry

     b. Optics for Spectrometry (optional)

     c. Optics for Ellipsometry (optional)

(2)  Sample Stage

     a. XY-0 Stage System

     b. Isolation Unit

(3)  Control System

     a. Main Control System

     b. Auto-focus System

     c. Video Monitoring System

     d. Pattern Recognition System

(4)  Software

     a.   TFMS

     b.   IOPT

Licensed Trademarks
1. Therma-Wave
2. Opti-Probe

IPSCIO Record ID: 6726

License Grant
In connection with the development agreement Grantee is given a nonexclusive and worldwide license under Grantor Licensed Patents.  Parties have agreed to the joint development of semiconductor apparatus and processes relating to plating technology for advanced packaging and integration solutions in semiconductor processing and manufacturing.
License Property
IHS Product shall mean an Information Handling System or any instrumentality or aggregate of instrumentalities (including, without limitation, any component, subassembly, computer program or supply) designed for incorporation in an Information Handling System. Any instrumentality or aggregate of instrumentalities primarily designed for use in the fabrication (including testing) of an IHS Product shall not be considered to be an IHS Product.

Information Handling System shall mean any instrumentality or aggregate of instrumentalities primarily designed to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, measure, detect, record, reproduce, handle or utilize any form of information, intelligence or data for business, scientific, control or other purposes.

IPSCIO Record ID: 367357

License Grant
The parties entered into discussions in March 2007 and signed an LOI in May 2007 to align their interests with respect to the development and sale by Licensor of a workflow for Wets Processing as contemplated in this Agreement.  The Parties entered into the Alliance Agreement and began working on a collaborative development program directed at a cleans application.

This Agreement sets forth terms and conditions under which Licensee may sell to Licensor one or more Wets Workflows, and the terms and conditions under which Licensor may provide related Services.

Licensor grants to Licensee all right, title, and interest in and to Licensee Technology.

License Property
As between the Parties, Licensor shall be the sole owner of all right, title, and interest in and to
– the Licensor Independent Technology,
– Intellectual Property Rights; relating to Materials or Products and methods of using Materials or Products,
– Metrology/Characterization Technology that is not HPC Technology, and
– Materials Manufacturing Technology, and improvements to any of the foregoing (Licensor Technology) derived through Licensors use of the Wets Workflow purchased herein.

As between the Parties, Licensee shall he the sole owner of the Licensee Independent IP, Metrology/ Characterization Technology that is HPC Technology, HPC Technology, and any improvements to any of the foregoing (Licensee Technology).

Agreement WF Compound means any Lead WF Compound or Derivative WF Compound.  Lead WF Compound means a compound or material identified, first synthesized, or discovered in whole or in part through use of any Wets Workflow provided through this Agreement.

Product means a Material that incorporates an Agreement WP Compound or utilizes an Agreement WF Compound in its manufacture and/or methods of using the same.

Equipment means Wets Workflow hardware tools (excluding Informatics Hardware) that may be sold pursuant to this Agreement, conforming to the Specifications set forth in the Purchase Documentation.

HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques)
–  subject to or covered by any Intellectual Property Right owned by Licensee or licensed to Licensee,
–  provided by Licensee to Licensor and
–  used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis; conditions, or the structures derived from such.

Field of Use
The field of use applications include Post-CMP Cleans (Cu); Post Etch Dielectric Contact Clean; TDDB Dielectric Enhancement Layers; All wet solution for HDIS; Reclaim (SiC); HDA replacement, and other related Wets workflow opportunities in the semiconductor industry.

Wets Processing means a set of operations for the development or application of liquid or fluid-based Materials, which Materials are used in semiconductor manufacturing for cleaning, etching, or electro less deposition.

Wets Work flow means the combination of one or more of the following as described in the applicable Quote Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 296450

License Grant
Licensor sells all assets related to our former tensile stage product line to Licensee.
License Property
Licensors core business is a supplier of precision linear displacement sensors, instruments and system solutions, vibration measurement and system balancing solutions, precision tensile measurement systems, and wafer inspection tools, serving markets that require 1) the precise measurements and control of products and processes in automated manufacturing, assembly, and consistent operation of complex machinery, 2) engine balancing and vibration analysis systems for both military and commercial aircraft, and 3) metrology tools for semiconductor and solar wafer characterization.

IPSCIO Record ID: 211905

License Grant
Licensor grants to Licensee a non-transferable, non-exclusive, worldwide right and license under Licensors applicable trade secret, know-how and copyrights in the Licensed Products and Update(s)
to do any or all of the following
-Use the Licensed Products and Updates to develop, derive or otherwise create one or more Designs and mask sets that embody such Designs, including but not limited to the right to execute, distribute internally, and reproduce the Licensed Products and Updates in support of such use, provided such Designs are manufactured at Licensees Manufacturing Site(s);
– lease, sell, or otherwise transfer semiconductor products instantiating such Designs in any form or level of assembly (by way of example, in wafer or single chip form as bare die, in chip packages, or on printed circuit boards) to third parties;
– Use the Licensed Products and Updates as reasonably necessary to carry out the activities set forth;
– distribute the Front-End Views/Back-End Views to third party entities to internally use the Front-End Views and internally use the Back-End Views.
License Property
Licensed Product(s) means the products described in the Product Schedule, and any Updates thereto, whether in object code, reconfigurable binary, ASCII data, binary data or any other form. Licensed Product(s) includes the Back-End Views, Front-End Views and Internal Use Documentation.

Required Data means semiconductor manufacturing processes.

Wafer shall mean a combination of die produced from a single manufactured semiconductor wafer, which die in whole or in part are made up of, incorporate or are based upon any portion of a Design.

Licensor is a leading developer of high performance, high density and low power embedded memory, standard cell and input/output intellectual property components used for the design and manufacture of complex integrated circuits.

Field of Use
This agreement is for the semiconductor and related device industry.

IPSCIO Record ID: 3598

License Grant
The Company entered into an additional Agreement acquiring an Exclusive License to manufacture, sell and provide services and parts support for certain reactive ion etch semiconductor manufacturing equipment for wafer sized up to 200mm now marketed under the ASI trade names Arista and Arista Dual.
License Property
Products as used herein shall mean certain reactive ion etch semiconductor manufacturing equipment for wafer sizes up to 200mm under the trade names Bobcat 209 or Cheetah (limited to such equipment that includes at least one reactive ion etch chamber) including software, components and parts therefor.
Field of Use
Dry strip semiconductor manufacturing equipment As part of the chip creation process, a light sensitive, polymer-based liquid, called photoresist, is spread in a uniformly thin film on the wafer in pattern creating a stencil effect. Photostabilization uses ultraviolet light to harden, or cure, the photoresist so that it is more effective in maintaining the desired pattern during the subsequent implant processes and etch steps (in which the top layer of the surface of the wafer not covered by photoresist is removed). After these steps, the photoresist is no longer.

IPSCIO Record ID: 169072

License Grant
Licensor hereby grants to Licensee under Licensor patents, copyrights, mask work rights, necessary to manufacture the licensed products, and technical information, a worldwide, non-exclusive license, without the right to grant sublicenses, to (i) make, have made and use semiconductor processes, including the Eprom process, and (ii) make, have made, use, sell, have sold, and otherwise dispose of semiconductor products, including the licensed products.
License Property
Licensed Products any of the following with respect to which technical information has been transferred by one party to the other party under the terms of this agreement

Licensed Products                            Delivery Deadline
1.   27C256LS                                120 days from Agreement date
2.   27C512LS                                60 days for Agreement date
3.   27C010LS(1)                             Delivered prior to Agreement date
4.   27C020LS(2)                             90 days from Agreement date
5.   27C040LS(3)                             60 days from Agreement date

Technical Information

For each licensed product, the following technical information shall be transferred
General Product Information.
    Information on the process required to manufacture licensed products.
          Starting Material Specifications
          Process Flow Description
          Final Critical Dimensions
          Critical Dimensions in Database
          Thickness of Conducting and Insulating Layers
          Processing Temperatures for Critical Steps
          Threshold and Breakdown Voltages Required for Licensed Products
          Sheet and Bulk Resistivities of Conducting Layers
  Parametric Test Structure Information
          Test Structure Database
          Test Device Descriptions and Dimensions
          Process Target Values for Tested Parameters
General Product Design Information
          Design Rule Information
          Layout Design Rule Package
          Description of relationship between drawn and final dimensions
          Design rule checking algorithms
  Electrical Design Information
          Simulation models used for simulating active devices and parasitic areas
          Current density design rules
  Specific Product Design Information
          Schematic diagram of licensed product including device sizes, and explanation of all operating modes of device.
          Simulation netlists.
          Graphical database of licensed product, in hierarchical form, in mutually agreed, computer readable format. All information required to
          interpret and utilize the database for mask making and circuit debugging.
          LVS netlist corresponding to graphical database.
          Explanations of all special structures, and their operating modes.
          Full explanation of test methods and test modes of the Licensed Products.
          Characterization data of Licensed Products.

EPROM a semiconductor memory device which is capable of being programmed after manufacture by the application of specified voltages and/or codes to the device pins, which is capable of retaining the programmed information indefinitely, and which is capable of being erased by ultraviolet radiation if assembled in a package having a quartz window.

EPROM Process the CMOS process to be used by Licensee in production of the licensed products, which process was developed at Licensees Salt Lake City plant incorporating the overlapping gate, self-aligned implant and tungsten silicide polysilicon wordlines required to realize virtual ground EPROMS.

Field of Use
This agreement pertains to the semiconductor industry relating integrated circuits in the general field of high performance programmable VLSI memory products where a semiconductor memory device which is capable of being programmed after manufacture by the application.

IPSCIO Record ID: 362471

License Grant
The parties entered into discussions in March 2007 and signed an LOI in May 2007 to align their interests with respect to the development and sale by Licensor of a workflow for Wets Processing as contemplated in this Agreement.  The Parties entered into the Alliance Agreement and began working on a collaborative development program directed at a cleans application.

This Agreement sets forth terms and conditions under which Licensor may sell to Licensee one or more Wets Workflows, and the terms and conditions under which Licensor may provide related Services.

Licensor will grant and hereby grants to Licensee all right, title, and interest in and to said Licensee Technology.  For the Proprietary Rights, between Licensee and Licensor, Licensee shall be the sole owner of all right, title, and interest in and to
–    the Licensee Independent Technology,
–    Intellectual Property Rights; relating to Materials or Products and methods of using Materials or
Products,
–   Metrology/Characterization Technology that is not HPC Technology, and
–   Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

For the License Grant for Informatics Software; HPC Site License, Licensor grants a nonexclusive, nontransferable, license, without the right to sublicense, to use the Equipment and install and execute the Informatics Software identified in the Purchase Documentation on the Equipment and/or Informatics Hardware for which it was purchased and upon which it was installed, for use by Named Users, for the term specified in the Purchase Documentation, solely at the Site, and solely for the purpose of developing and commercializing Materials, Wets Processing, Products, and Materials Manufacturing Technologies in the Field.

For Licensee Improvements Licensor grants a non-exclusive license to Licensee to use any Improvement, other than an Licensor Improvement, on or with any Wets Workflow for which Licensee continues to pay the HPC Site License fee and continues to license the HPC-Enabled Informatics Software.

License Property
As between the Parties, Licensee shall be the sole owner of all right, title, and interest in and to
– the Licensee Independent Technology,
– Intellectual Property Rights; relating to Materials or Products and methods of using Materials or Products,
– Metrology/Characterization Technology that is not HPC Technology, and
– Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

As between the Parties, Licensor shall he the sole owner of the Licensor Independent IP, Metrology/ Characterization Technology that is HPC Technology, HPC Technology, and any improvements to any of the foregoing (Licensor Technology).

Agreement WF Compound means any Lead WF Compound or Derivative WF Compound.  Lead WF Compound means a compound or material identified, first synthesized, or discovered in whole or in part through use of any Wets Workflow provided through this Agreement.

Product means a Material that incorporates an Agreement WP Compound or utilizes an Agreement WF Compound in its manufacture and/or methods of using the same.

Equipment means Wets Workflow hardware tools (excluding Informatics Hardware) that may be sold pursuant to this Agreement, conforming to the Specifications set forth in the Purchase Documentation.

HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques)
–  subject to or covered by any Intellectual Property Right owned by Licensor or licensed to Licensor,
–  provided by Licensor to Licensee and
–  used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis; conditions, or the structures derived from such.

Field of Use
The field of use applications include Post-CMP Cleans (Cu); Post Etch Dielectric Contact Clean; TDDB Dielectric Enhancement Layers; All wet solution for HDIS; Reclaim (SiC); HDA replacement, and other related Wets workflow opportunities in the semiconductor industry.

Wets Processing means a set of operations for the development or application of liquid or fluid-based Materials, which Materials are used in semiconductor manufacturing for cleaning, etching, or electro less deposition.

Wets Work flow means the combination of one or more of the following as described in the applicable Quote Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

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