Description
This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 7
Primary Industries
- Semiconductors
- Fabrication
- Material Composite
- Coating
- Chemicals
- Metals & Metal Products
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 667
License Grant
The Licensor licensed to the Licensee certain patents and other technology associated with the purchased assets, meaning certain specified assets associated with the Licensor's carbon target assembly manufacturing and related materials coating.
License Property
The technology relates to the Intragene-TM- process which is a proprietary methodology developed by metallurgists and materials scientists at the Company. The Intragene-TM-process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals. The materials division also manufactures electromagnet systems which produce very accurate and high level electromagnet fields. These products are sold to magnetic recording head manufacturers who often utilize these systems for wafer plating.
IPSCIO Record ID: 158524
License Grant
Pursuant to a Stock Purchase and Reorganization Agreement the Licensor and Licensee, a wholly-owned subsidiary, shall enter into a license agreement under which Licensor grants the exclusive right to produce, use and sell Licensors Intragene(TM) technology.
License Property
The Licensor is an advanced materials technology company focusing on surge protection technology and specialized materials. The Intragene system is for joining engineering materials.
The Intragene-TM-process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals. The materials division also manufactures electromagnet systems which produce very accurate and high level electromagnet fields. These products are sold to magnetic recording head manufacturers who often utilize these systems for wafer plating.
Field of Use
The parties are in the electrical industrial apparatus industry.
IPSCIO Record ID: 153750
License Grant
Licensor grants to Licensee an exclusive, nontransferable, worldwide right and License to use the Licensor Industrial Property Rights solely for the manufacture, sale, lease, or other disposition of products incorporating the Licensed Technology. Licensor further grants to Licensee an exclusive, nontransferable right to (i) modify and make derivative works from the Licensor Industrial Property and (ii) subject to the prior written consent of Licensor, which shall not be unreasonably withheld, sublicense the Licensor Industrial Property rights solely for the purposes of manufacture, product development, distribution or related uses.
License Property
The Business shall mean the Intragene and related coating business acquired by Licensee pursuant to the terms of the Purchase Agreement and now operated by Licensee.
Licensor Industrial Property Rights shall mean all Confidential Information and, whether or not the following constitute Confidential Information, all of Licensors patents, licenses, trademarks, trade names, inventions, inventors notes, copyrights, formulea know-how, trade secrets, drawings and designs relating to the Business represented by the Licensed Technology.
Licensed Technology shall mean all of Licensors proprietary technology relating to the Business which has been licensed to Licensee hereunder including, but not limited to, the Patents and the Marks.
The Marks means the trademark 'Licensor Materials' and all trade or service mark registrations (and any applications therefor) associated therewith.
Patents shall mean the following patents (i) U.S. Patent 4,535,029 dated 8/13/85, (ii) U.S. Patent 4,426,423 dated 11/17/84, (iii) U.S. Patent 4,358,506 dated 11/9/82, (iv) U.S. Patent 4,376,806 dated 3/15/83 and (v) U.S. Patent 4,396,677 dated 8/2/83.
4,535,029 – Method of catalyzing metal depositions on ceramic substrates
4,426,423 – Ceramic, cermet or metal composites
4,358,506 – Metal and carbon composites thereof
4,376,806 – Highly adhesive coatings for beryllia
4,396,677 – Metal, carbon, carbide and other composites thereof
The Intragene-TM- process is a proprietary methodology developed by metallurgists and materials scientists at the Company and has been granted six U.S. patents as well as national phase patents based on two European patent applications and three Japanese patents. The Intragene-TM- process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals.
The materials division product line consists of Intragene-TM–based sputtering target assemblies and electromagnet systems. The sputtering target assemblies have been sold into the rigid disk market since 1986 and are considered one of the most reliable such assemblies in the market today. Sputtering target assemblies are sold to end-users as source materials for coating other materials via a vacuum-based process called sputtering. Sputtering is employed as the primary method for depositing thin film functional and protective layers on rigid magnetic media (hard disks), as well as in many semiconductor-manufacturing operations. Once a target is made, it must usually be incorporated into the sputtering apparatus by joining it to a backing plate to make sound electrical, thermal and mechanical contact. The bonding of a target to the backing plate, which is usually made of copper, forms what is known as the 'bonded target assembly.'
Field of Use
This agreement pertains to the chemical industry relating to the coating technology.
IPSCIO Record ID: 291104
License Grant
The Parties previously entered into three (3) technology license agreements relating to a technology known as C-4 plating technology in which certain license rights were granted to Licensee. The Parties desire to extend the license rights previously granted.
Licensor extends the license rights granted in the C-4 Agreements for Licensee to perform Bumping on 300mm semiconductor wafers solely for Licensee only in the Dresden Facility, manufacture Licensed Products solely for Licensee only in the Dresden Facility using Bumping on 300mm semiconductor wafers, use solely for Licensee Licensed Products only in the Dresden Facility using Bumping on 300mm semiconductor wafers, sell and have sold worldwide solely under the Licensee brand name Licensed Products manufactured using Bumping on 300mm semiconductor wafers, and manufacture only in the Dresden Facility and have manufactured by Another Manufacturer for Licensee’s internal use only, any apparatus designed or modified to implement Bumping of 300mm semiconductor wafers.
Licensor grants the right to use the Licensed Technology to perform Bumping of 200mm semiconductor wafers for third parties.
The license rights extended to Licensee are nonexclusive, nontransferable and revocable.
License Property
Bumping shall have the meaning in the C-4 Plating Technology Transfer and Licensing Agreement. Typically, Wafer bumping is an essential to flipchip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where “bumps†or “balls†made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips.
Field of Use
The agreement relates to the semiconductor industry.
IPSCIO Record ID: 27127
License Grant
The Company hereby grants to Japanese company the exclusive right and license, with no right to sublicense, to use the Information to manufacture, use and sell NTC Product.
License Property
NTC Product shall be any nanocrystalline materials made using the Information. Applications are all applications except cosmetics, skin care and chemical/mechanical planarization of metal layers on semiconductor wafers. Information shall mean US patent Nos. 5,460,701 and 5,514,349 and any foreign counterpart applications (hereinafter collectively called Patents).
IPSCIO Record ID: 2756
License Grant
The Company entered into a License Agreement to license certain of the Company’s proprietary wafer production process technologies subject to certain restrictions. The parties also entered into an Asset Purchase Agreement for certain wafer fabrication equipment.
IPSCIO Record ID: 27206
License Grant
The Company agrees to grant to a Korean company the right to a processes involving technology, equipment design, and other intangible assets and property rights of value, all of which are useful with respect to the manufacture of Silicon Wafers.
License Property
The Company has developed over the years and possesses processes involving technology, equipment design, and other intangible assets and property rights of value, all of which are useful with respect to the manufacture of Silicon Wafers (as hereinafter defined) and certain value added features such as epitaxial layers.
Field of Use
Field of this Agreement means Silicon Wafers and processes, apparatus, equipment, and materials useful in producing Silicon Wafers consistent with the commercial requirements of PHC.
The Field of this Agreement shall not include processes, apparatus, equipment, and materials useful in producing polycrystal Silicon.
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