Royalty Report: Semiconductors, IC, Computers & Office Equipment – Collection: 6600


Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 3


This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 3

Primary Industries

  • Semiconductors
  • IC
  • Computers & Office Equipment

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 6600

License Grant
The Licensor entered into a two-year product supply agreement with the Licensee for the sale of certain chips to the Licensee, including the KeyWave(TM), HDSL and Condor(TM) chips.

Subject to performance criteria and price, the Licensee was entitled to pay most-preferred customer prices. Initially, the Licensee's price was cost plus 10%. Effective January 1, 2001, this agreement was amended, as a result of which, we began generating revenues from royalties.

Field of Use
Field of use relates to the telecommunications market.

IPSCIO Record ID: 5183

License Grant
The Company grants for Permitted Applications only, a worldwide, nontransferable, and nonsublicensable right to use, sell and otherwise incorporate Mobility Technology, including Mobility Split Bridge(TM) Chips and current and future software drivers developed for Mobility Split Bridge(TM) Chips and owned by Mobility.
License Property
'Mobility Technology' shall mean all of Mobility's Split Bridge(TM) Technology (as hereinafter defined), including Mobility's current Split Bridge(TM) ASIC chip commonly known as 'Merlin' and ASIC Split Bridge(TM) chips currently under development by Mobility with LSI Logic or developed in the future ('Mobility Split Bridge(TM) Chips').

This further includes all related intellectual property and Mobility Split Bridge(TM) Chip intellectual property including without limitation software, patents (including, without limitation, the Patent Nos. 6,070,214 and 6,088,752) and patents pending, trade secrets, ASIC chips and related IP blocks, designs, specifications, and any future enhancements, modifications, variations thereto, and all intellectual property associated with the adaptation of cables and connectors adapted for use with Mobility's Split Bridge(TM) Chips and technology and future generations of any of the above .

'Split Bridge Technology' is the technology which allows a main computer PCI bus to be extended to a remote location by connecting two proprietary Mobility Split Bridge(TM) Chips with a high speed cable, and includes all of the above.  Mobility Technology does not include any incorporated 2C Technology.

'Split Bridge(TM) LINK' shall mean two Mobility Split Bridge(TM) Chips, associated connectors, and associated high speed cable which permit the use and implementation of Mobility Technology.

IPSCIO Record ID: 240630

License Grant
The Parties agree to cooperate on Joint Projects for the design of certain Joint Products useful in Transport Layer Applications. Each Joint Project or other development work to be performed by the Parties hereunder shall be the subject of a Statement of Work hereto. Each Statement of Work will establish the specifications for the Joint Product(s), a detailed plan for the conduct of the work and the schedule for task completion, a staffing commitment for each Party, the deliverables, including technology, to be provided by each Party for use in the Joint Project, and the documentation and other output requirement for the Joint Project results. Each Statement of Work will set forth a budget for the Design Costs for the Joint Project described therein.  The actual Design Costs will be shared by the Parties equally. In the event of a conflict between the provisions of a Statement of Work and the provisions of this Joint Development Agreement, the provisions of the Statement of Work will prevail.
License Property
Transport Layer Application means high performance transceivers connecting data communications and telecommunications equipment to a fiber optic infrastructure. Examples include  10Gb Ethernet, OC192 10Gb Sonet, and OC768 40Gb Sonet applications.

Product means a Licensor Licensed Product, Licensee Licensed Product, or Joint Product.

Licensee Licensed Product means any Integrated Circuit, chip set, module, or other item, including packages and control software therefor, having all or any portion of its design based on or derived from Licensor Technology or Joint Technology but which Licensee Licensed Product is not itself a Joint Product.

Licensor Licensed Product means any integrated circuit, chip set, module, or other item, including packages and control software therefor, having all or any portion of its design based on or derived from Licensee Technology or the Joint Technology but which Licensor Licensed Product is not itself a Joint Product.

Joint Product means an Integrated Circuit, chip set, module or board or any other item specified on a Statement of Work to be jointly developed by the Parties hereunder.

Integrated Circuit means an integral unit including a plurality of active and passive circuit elements formed at least in part of semiconductor material arranged on or in a single chip.

Invention means any idea, design, concept, technique, invention, discovery or improvement, whether or not patentable, made solely or jointly by one or more employees or consultants of either Licensor or Licensee, provided that either the conception or reduction to practice occurs in the performance of work under a Joint Project.

Field of Use
This agreement pertains to the semiconductor industry.
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