Royalty Report: Semiconductors, Fabrication, IC – Collection: 6110

$150.00

Curated Royalty Rate Report
Created On: 2020-07-15, Record Count: 6

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Created On: 2020-07-15
Record Count: 6

Primary Industries

  • Semiconductors
  • Fabrication
  • IC

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 6110

License Grant
In connection with the Verteq acquisition, the Japanese Licensee entered into a Royalty Agreement with under which we agreed to make payments to the English Licensor for sales of certain single-wafer products by us for five years from the date of the acquisition in March 2004, subject to certain setoffs and with an aggregate minimum royalty payment of $2.0 million for the first two years following the closing of the acquisition. The royalty is a percentage of single-wafer product sales in the first year following the closing, with decreasing percentages through the fifth year.
License Property
Intellectual Property shall mean: (a) all patents and patents pending owned by Verteq, Inc. (Verteq) and transferred to Newco as part of the Newco Purchase which relate to single wafer wet cleaning systems employing megasonics or single wafer wet cleaning chambers employing megasonics;
(b) all trademarks, service marks, trade dress, logos and trade names, together with all translations, adaptations, derivations and combinations thereof, and all applications, registrations and renewals in connection therewith as set forth hereto;
(c) all copyrights, derivative works and applications, registrations and renewals in connection therewith as specifically set forth hereto; and
(d) all patent and copyright rights in logical extensions of the currently existing Goldfinger technology based on engineering projects that are currently underway at Verteq. For purposes of the definition of Goldfinger Products (as defined below), the patent claims will be given their broadest possible interpretation.
Field of Use
The rights granted relate to wet cleaning systems.

IPSCIO Record ID: 328

License Grant
Japanese Licensor hereby grants to Licensee the exclusive License under the Patents, Technical Information and Intellectual Property Rights to manufacture, use, offer for sale, sell, import and/or lease the Products in the territory; provided, however, Licensee agrees not to manufacture any of the three Products listed in this Agreement at any time on or prior to June 30, 2006; provided further, however, that Licensee may start on the effective date to manufacture, use, offer for sale, sell, import and/or lease in the territory all subsystems related to any Products, including, but not limited to, the Nison Vesper submodule. For the avoidance of doubt, Licensor acknowledges and agrees that the License granted to Licensee under this Agreement includes the right of the Licensee to subLicense to any purchaser of the Products the right to use (but not manufacture) the Patents, Technical Information and Intellectual Property Rights.
License Property
Licensor was incorporated to, among other things, manufacture and distribute certain products and systems of Licensee in Japan in accordance with a Shareholders Agreement dated June 5, 1991.  This license is a result of Licensor buying a portion of the business of a semiconductor manufacturing equipment business and licensing back rights to Licensee.

The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers.  Three products are covered by this agreement: Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.

Patent:

Title
No.
number

number
Country

1
Method of recirculation of high temperature etching solution
63–248757
02–096334

1653241
Japan

2
Cleaning/ rinsing vessel for semiconductor wafer
03–350731
05–166787

2013691
Japan

3
Method for refinig etchant
05–253672
07–086260

3072876
Japan

4
Single wafer spin etching method
07–104581
08–279485

3459137
Japan

5
Etching method with hot phosphoric acid
07–216528
09–045660

3459141
Japan

6
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
07–163075
08–334461

N/A
Japan

7
Regeneration treatment apparatus for etchant and etching apparatus using the same
10–095836
11–293479

N/A
Japan

8
Cleaning apparatus
11–199868
2001–028356

N/A
Japan

9
Filter device with bellows damper and chemical–circulation treatment device for semiconductor wafer using the same
11–222204
2001–046815

N/A
Japan

10
Semiconductor wafer cleaning system
11–234855
2001–060574

N/A
Japan

11
Method of etching semiconductor wafer
11–271065
2001–093876

N/A
Japan

12
Device and method for etching semiconductor wafer
11–314794
2001–135611

N/A
Japan

13
Scrub cleaning device
2000–044343
2001–237209

N/A
Japan

14
Cleaning Equipment of wafer
2000–274592
2002–093764

N/A
Japan

15
Equipment and method for processing solution for semiconductor wafer
2001–009915
2002–217165

N/A
Japan

16
Wafer–cleaning device
2001–158580
2002–353183

N/A
Japan

17
The apparatus and the method of etching wafer
2002–42120
2003–243353

N/A
Japan

18
The apparatus of reclaiming etching liquid and method and apparatus of etching
2002–269405
N/A

N/A
Japan

19
The method of controlling the boiling chemical
2002–318730
2004–153164

N/A
Japan

20
The apparatus and the method of floating wafer chuck
2002–108651
2003–303871

N/A
Japan

21
The apparatus of wafer treatment and shaft
2003–47148
N/A

N/A
Japan

22
Etching method and equipment
2002–324795
2004–158746

N/A
Japan

23
Processing method and processing device before wafer inspection
2001–266653
2003–75312

N/A
Japan

24
Processing method and processing device before wafer inspection
2002–156835
2003–344243

N/A
Japan

25
Method for recirculating high–temperature etching soluthin
412444
N/A

4980017
USA

26
Method for purification of etching solution
305334
N/A

5470421
USA

Trademarks:

Class of

NO
Trademark
goods
Designated goods

1 NISON
7
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments

2 NISON
9
Automatic fluid– composition control machines and instruments

3 CENOTE
7
The apparatus of wafer etching, chemical machines and instruments

4 Stelna
7
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.

Remark: An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.

Product:
Product Name

Description

Spin Processor CENOTE
Single Wafer Wet Station

Best

                Wafer Backside Etcher

Wet Station

Immersion Process System

Field of Use
Products means any and all products, systems and subsystems now or hereafter produced by or under control of Licensee based upon the Technical Information given under this Agreement which are in the field of surface conditioning, cleaning, etch and stripping technology such as the Technical Information used in the products to this Agreement and any products, systems and subsystems to be used in the Field which will be developed, designed or invented, or otherwise acquired by Licensor in the future during the term of this Agreement.

IPSCIO Record ID: 227276

License Grant
The Parties have agreed to transfer and to license certain patents relating to wafer and/or reticle containers, Ports, material handling systems and/or Tracking Systems.  

Licensor hereby sells, assigns, transfers and otherwise conveys to Licensee Cayman the entire right, title and interest in and to the specific Patents and Applications identified and any foreign counterparts, and all other patents or applications that now or in the future claim priority to any Patent or Application identified.

Licensee and Licensee Cayman grant to Licensor and Licensors Subsidiaries a world-wide, fully paid, exclusive, non-transferable license, including the right to grant sublicenses, under all Exclusive Rights Patents owned or licensable by Licensee Cayman or Licensee to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, all products except Acquired Products.

Licensor grants to Licensee Cayman a a world-wide, fully paid, exclusive, non-transferable license, including the right to grant sublicenses, under all Combined Pod and Port Patents owned or licensable by Licensor to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, Acquired Products.

Licensee Cayman and Licensee grant to Licensor and Licensors Subsidiaries a a world-wide, fully paid, nonexclusive, non-transferable license under Pod and Carrier Patents owned or licensable by Licensee Cayman or Licensee to (a) conduct development, research, testing, or demonstration of Acquired Products, provided that Licensor does not transfer Acquired Products to third parties for purposes other than development, research, testing, or demonstration, and (b) to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, Non-Plastic Flat Panel Display Products.

Licensee Cayman and Licensee grant to Licensor and Licensors Subsidiaries a a world-wide, fully paid, nonexclusive, non-transferable license under all Port Patents, MHS Patents, Environmental Control Patents, and AutoID/Lot Tracking Patents owned or licensable by Licensee Cayman or Licensee to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, all products except Acquired Products.

Licensor grants to Licensee Cayman a a world-wide, fully paid, nonexclusive, non-transferable license under Pod and Carrier Patents, MHS Patents, Environmental Control Patents, and AutoID/Lot Tracking Patents owned or licensable by Licensor to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, Acquired Products.

License Property
Licensed Trademarks means the marks ASYST(R), A S Y S T(R), and A(R).

Pod and Carrier Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to sealable, transportable containers, wafer and/or reticle carriers and containers, or components of wafer and/or reticle carriers and containers, including, but not limited to, the patents identified below.

US 4,739,882 – Container having disposable liners
US 4,815,912 – Box door actuated retainer
US 4,995,430 – Sealable transportable container having improved latch mechanism

Combined Pod and Port Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to (a) the combined structure of a wafer or reticle container and a Port or (b) the operation of a wafer or reticle container and a Port, including, but not limited to, the patents identified.

Port Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to the structure and/or operation of a Port.

MHS Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to the structure and/or operation of a material handling system for transporting, storing, delivering and/or loading wafer and/or reticle containers or individual wafers in the manufacture of semiconductor devices, or components of such a system.

Environmental Control Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to environmental control features of Ports for controlling the environment inside of wafer and/or reticle containers, including purging systems, including, but not limited to, the patents identified in this Agreement; provided, however, that Environmental Control Patents do not include patents with claims principally directed to environmental control features within wafer and/or reticle containers.

Autoid/Lot Tracking Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims principally directed to systems or components of systems used to track, identify, manage, control and route lots, carriers, wafers and/or reticlesduring the manufacture of semiconductors or semiconductor wafers, including, but not limited to, the patents identified.

Licensed Patents means Pod and Carrier Patents, Port Patents, Combined Pod and Port Patents, MHS Patents, Environmental Control Patents, and AutoID/Lot Tracking Patents.

Exclusive Rights Patents means the Patents and Applications identified in this Agreement and all foreign equivalents and counterparts, divisions, continuations, continuations-in-part, reexaminations, and reissues of such Patents and Applications.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 280974

License Grant
Licensor and German Licensee are parties to certain litigation involving the 761 patent.

With this interim patent license, the Licensor grants to the German Licensee a non-exclusive, non transferable worldwide license under the Patent Rights, without the right to grant sublicenses, to make, have made, use, sell, offer for sale, and import Licensed Products during the Term of this Agreement.

License Property
Licensor is the owner of patents relating to wet processing of semiconductors.

Licensed Products shall mean drying equipment, wet bench products, and replacement parts .

Dryer Module shall mean drying equipment in an enclosed, self-contained, physically separate unit which performs rinsing and drying but no chemical treatment operation.

Field of Use
The field of use is the semiconductor wet processing business.

IPSCIO Record ID: 227244

License Grant
The Licensor and Chinese Licensee agree to amend the License Agreement to provide for a different royalty payment calculation and to add and/or clarify certain additional terms and conditions.
License Property
The parties confirm and clarify that LIC/Wafer shall mean any single integrated circuit die and/or piece of silicon wafer designed and/or manufactured.  

0.25(micron) LIC/Wafers means all LIC/Wafers that are manufactured for any of the TSMC 0.25(micron) processes and TSMC 0.25(micron) derivative processes.

0.18(micron) LIC/Wafers means those LIC/Wafers that are manufactured for any of the TSMC 0.18(micron) processes and TSMC 0.18(micron) derivative processes.

0.15(micron) LIC/Wafers means those LIC/Wafers that are manufactured for any of the TSMC 0.15(micron) processes and TSMC 0.15(micron) derivative processes.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 29127

License Grant
Licensee of England acquired its intellectual property from Licensor of Korea in March 2004 in the thermal management industry.  The product portfolio is based on registered and pending patents in micro fluidic technology, a technology that enables higher performance than current cooling systems, with no noise or vibrations, and can be commercially manufactured using well-known processes at a cost less than traditional cooling products. The technologies are designed to be used as a stand-alone cooling solution, or as part of a cooling system.
License Property
This nanocooling intellectual property is anticipated to replace older technology such as heat-pipes/heat-sinks to cool PC processors.
Field of Use
The Licensee wants to become a world leader in developing and commercializing next-generation cooling solutions for the personal computer, flat panel display, LED-lighting, and communications industries. We develop, manufacture, market, sell and/or license our patented thermal management cooling devices. We believe that our wafer-thin products absorb, transport and dissipate heat more rapidly than current heat-pipe/heat-sink cooling solutions. Our unique cooling device uses microfluidic physics to move liquid at very high speeds through micro-channels within thin panels.
Disclaimer: The information gathered from RoyaltySource® database was sourced from the U.S. Securities and Exchange Commission EDGAR Filings and other public records. While we believe the sources to be reliable, this does not guarantee the accuracy or completeness of the information provided. Further, the information is supplied as general guidance and is not intended to represent or be a substitute for a detailed analysis or professional judgment. This information is for private use only and may not be resold or reproduced without permission.