Category: Technology Licenses
Created On: 2022-04-28
Record Count: 20
- Material Composite
- Electrical & Electronics
- Computers & Office Equipment
- Consumer Electronics
- Coating surface
- Metals & Metal Products
- Liquid Crystals
- Scientific & Technical Instruments
- Technical Know How
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 5328
IPSCIO Record ID: 166414
'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.
IPSCIO Record ID: 153750
Licensor Industrial Property Rights shall mean all Confidential Information and, whether or not the following constitute Confidential Information, all of Licensors patents, licenses, trademarks, trade names, inventions, inventors notes, copyrights, formulea know-how, trade secrets, drawings and designs relating to the Business represented by the Licensed Technology.
Licensed Technology shall mean all of Licensors proprietary technology relating to the Business which has been licensed to Licensee hereunder including, but not limited to, the Patents and the Marks.
The Marks means the trademark 'Licensor Materials' and all trade or service mark registrations (and any applications therefor) associated therewith.
Patents shall mean the following patents (i) U.S. Patent 4,535,029 dated 8/13/85, (ii) U.S. Patent 4,426,423 dated 11/17/84, (iii) U.S. Patent 4,358,506 dated 11/9/82, (iv) U.S. Patent 4,376,806 dated 3/15/83 and (v) U.S. Patent 4,396,677 dated 8/2/83.
4,535,029 – Method of catalyzing metal depositions on ceramic substrates
4,426,423 – Ceramic, cermet or metal composites
4,358,506 – Metal and carbon composites thereof
4,376,806 – Highly adhesive coatings for beryllia
4,396,677 – Metal, carbon, carbide and other composites thereof
The Intragene-TM- process is a proprietary methodology developed by metallurgists and materials scientists at the Company and has been granted six U.S. patents as well as national phase patents based on two European patent applications and three Japanese patents. The Intragene-TM- process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals.
The materials division product line consists of Intragene-TM–based sputtering target assemblies and electromagnet systems. The sputtering target assemblies have been sold into the rigid disk market since 1986 and are considered one of the most reliable such assemblies in the market today. Sputtering target assemblies are sold to end-users as source materials for coating other materials via a vacuum-based process called sputtering. Sputtering is employed as the primary method for depositing thin film functional and protective layers on rigid magnetic media (hard disks), as well as in many semiconductor-manufacturing operations. Once a target is made, it must usually be incorporated into the sputtering apparatus by joining it to a backing plate to make sound electrical, thermal and mechanical contact. The bonding of a target to the backing plate, which is usually made of copper, forms what is known as the 'bonded target assembly.'
IPSCIO Record ID: 282935
to make or manufacture LEP Devices, which devices may implement the TMA architecture and/or use the TMA algorithm (but not to manufacture or have manufactured LEP material or Total Matrix Addressing Driver Chips, or any other semiconductor device).
to make or manufacture Finished Products incorporating LEP Devices manufactured under the licensed rights granted;
to use, sell and otherwise deal in the LEP Devices and Finished Products made or manufactured in accordance with the licensed rights granted and (b) in any and all countries of the world;
to sublicense (either in whole or in part) its licensed rights to manufacture LEP Devices (as granted to a sub-contractor, for the sole purpose of having LEP Devices manufactured on Licenseeâ€™s behalf, provided that, in respect of those sub-contractors which are located outside the geographical region of Japan.
Electroluminescent Polymer means any material deposited by solution processing that is electroluminescent and where at least one ingredient is a polymer.
LEP Device means an electronic device (which device is covered by one or more Valid Claim) in which light is generated by LEP to produce (i) a visible representation comprising Glass, a Passive Matrix Module or an Active Matrix Module, as the case may be, and (ii) backlighting to, and solely to the extent the same is necessary for, such visible representation (but excluding any lighting device intended for use primarily as a source of area illumination), which devices may be driven by a TMA Driver Chip and shall be of any resolution and shall have a viewable diagonal dimension which is either (a) equal to or in excess of Ten (10') inches, or (b) equal to less than Twenty Seven (27') inches, whichever the Licensee shall have elected prior to entering into Commercial Production, by serving prior written election on CDT in accordance with this agreement.
TMA means Total Matrix Addressing.
Patent means the patents and patent applications listed; all future patents and patent applications that may be filed by or on behalf of Licesor or a Licensor Group member which are related to LEP display architecture and/or manufacture and which Licensor or a Licensor Group member exclusively owns or jointly owns, has an unrestricted right and ability to grant licenses thereto and such right to grant licences is not conditional upon Licensor or a Licensor Group member making any form of payment or other form of compensation to any relevant third party; and any extension of any such patent and any patent obtained in pursuance of any such application.
4,923,288 – Optical modulators based on polymers
5,247,190 – Electroluminescent devices
5,399,502 – Method of manufacturing of electrolumineschent devices
Finished Product means any article (whether or not complete) produced by or for the Licensee or any member of the Licenseeâ€™s Group which incorporates an LEP Device and additional components.
Total Matrix Addressing Driver Chips means row and column driver chips interfacing with either a separate or integrated processor chip capable of running any non-negative matrix factorisation algorithm (or any other algorithm that gives positive values) such that the said row and column driver chips can drive more than one row and column at a time within one subframe. (â€œTMA Driver Chipsâ€ shall be construed accordingly). Total Matrix Addressing is a a form of passive matrix driving where more than one row is addressed at a time, resulting in reduced power consumption and extended panel lifetime.
IPSCIO Record ID: 368510
Licensed Products means any of Liquid Crystal Display Panels and Liquid Crystal Display Modules.
Liquid Crystal Display Panel means any display panel comprising a substrate of Amorphous Silicon TFTs, liquid crystal and an opposite substrate; specifically excluded from the Liquid Crystal Display Panel are
– any liquid crystal display panel utilizing Poly Silicon TFTs only, both Poly Silicon TFTs and Amorphous Silicon TFTs; TFTs, any portion of which are made of poly silicon;
– any liquid crystal display panel and semiconductor devices utilizing Continuous Grain Silicon; and
– any display panel utilizing any organic or inorganic light emitting diode or light emitting organic or inorganic materials.
Liquid Crystal Display Module means any display module consisting of a Liquid Crystal Display Panel, driver circuits, back lighting system and other like parts; specifically excluded from the Liquid Crystal Display Module is any display module (except for its back lighting system) utilizing any organic or inorganic light emitting diode or light emitting organic or inorganic materials.
Amorphous Silicon TFTs means thin film transistors, the channel regions of which are made of amorphous silicon.
IPSCIO Record ID: 215209
For the non-exclusive license, Licensor grants a nonexclusive, nonsublicensable, perpetual license under its Proprietary Rights in Licensors Technology for magnetic quadrapole and magnetic sensing applications for underwater and underground object detection applications, including patent(s), to use, make, have made, market and sell Licensed Products only to the Permitted Market.
The Permitted Market will mean the U.S. government or any state, local or foreign government or any agency, department, bureau or other subdivision or instrumentality thereof, except that the foreign market will be limited to military, intelligence and law enforcement entities.
Cryoelectronics or cryolectronics is the study of superconductivity under cryogenic conditions and its applications.
Patent No. Title Rights of Others
———- —– —————-
5,090,819 Superconducting Bolometer
5,157,466 Grain Boundary Junctions in HTS Films
5,207,884 Superconductor Deposition System
5,219,826 Superconducting Junctions and Method of Making Same
5,241,828 Cryogenic Thermoelectric Cooler
5,280,013 Method of Preparing HTS Films on Opposite Sides of a Substrate
5,449,659 Method of Bonding Multilayer Structures of Crystalline Materials
5,130,294 High Temperature Superconductor – Calcium Titanate Sapphire Structures
5,131,282 High Temperature Superconductor – Strontium Titanate Sapphire Structures
5,233,500 Package for Cascaded Microwave Devices
5,651,016 Ultrahigh Speed Laser
5,696,392 Improved Barrier Layers for Oxide Superconductor Devices and Circuits
5,831,278 Three-Terminal Devices with Wide Josephson Junctions and asymmetric Control Lines
IPSCIO Record ID: 27303
(1) Measurement Optics
a. Optics for Beam Profile Reflectometry
b. Optics for Spectrometry (optional)
c. Optics for Ellipsometry (optional)
(2) Sample Stage
a. XY-0 Stage System
b. Isolation Unit
(3) Control System
a. Main Control System
b. Auto-focus System
c. Video Monitoring System
d. Pattern Recognition System
IPSCIO Record ID: 26388
The license also grants the Company the right to issue exclusive or nonexclusive sublicenses to third parties.
IPSCIO Record ID: 286021
(a) U.S. Patent 4,710,030, Optical generator and detector of stress pulses.
(b) U.S. Patent 5,706,094, Ultrafast optical technique for the characterization of altered materials
(c) U.S. Patent 5,864,393, Optical method for the determination of stress in thin films.
(d) U.S. Patent 5,748,317, Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector.
(e) U.S. Patent 5,748,318, Optical stress generator and detector.
(f) U. S. Patent 5,844,684, Optical method for determining the mechanical properties of a material.
Licensed Product shall not, however, include (i) replacement parts provided or sold to end-users after the initial system is delivered; (ii) all software provided after delivery which does not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iii) software upgrades or revisions which do not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iv) service and maintenance of hardware and/or software and peripherals to the system. For purposes of this Agreement, a product shall be deemed a Licensed Product if such product is covered, in whole or in part, by at least one Patent Right in one country, whether or not that product is made, used or sold within that country. For example, an instrument system that incorporates one of the claims of U.S. Patent 4,710,030 would be a Licensed Product and would be subject to a royalty payment if sold in Japan, even though there is no issued patent in Japan.
Metal and Opaque Thin Film Measurement Solutions. Licensee's MetaPULSE family of metrology systems incorporates our proprietary technology for optical acoustic metrology, which allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non- contact manner on product wafers. By minimizing the need for test wafers, MetaPULSE enables Licensee's customers to achieve significant cost savings. Licensee believe that Licensee currently offer the only systems that can non-destructively measure up to six metal film layers with the degree of accuracy semiconductor device manufacturers demand. Licensee's MetaPULSE systems use ultra-fast lasers to generate sound waves that pass down through a stack of metal or opaque films such as copper and aluminum, sending back to the surface an echo which is detected and analyzed. These systems precisely measure the films with Angstrom accuracy and sub-Angstrom repeatability at high throughputs. This accuracy and repeatability is critical to semiconductor device manufacturers' ability to achieve higher manufacturing yields with the latest fabrication processes.
IPSCIO Record ID: 161592
Yttrium-barium-copper oxide (YBCO) patents and patent applications are fundamental to the high temperature superconductor (HTS) industry.
The patents on HTS compounds include YBCO 123, barium-strontium-calcium-copper-oxide (BSCCO) 2212 and BSCCO 2223. The portfolio also contains patents on wire manufacturing methods, including the oxide-powder-in-tube (OPIT) technology and end-use applications ranging from communications and power generation to medical imaging and magnetic levitation.
IPSCIO Record ID: 26302
IPSCIO Record ID: 28221
IPSCIO Record ID: 89738
Licensed Claims shall mean any and all non-Equipment claims entitled to priority to U.S. Serial No. 09/227,679 and/or 60/070,991, including, without limitation, non-Equipment claims in U.S. Patent Nos. 6,749,687 and 7,105,055.
6,749,687 – In situ growth of oxide and silicon layers
7,105,055 – In situ growth of oxide and silicon layers
The lead technology, named Mears Silicon Technologyâ„¢, or MSTÂ®, is a thin film of reengineered silicon, typically 100 to 300 angstroms (or approximately 20 to 60 silicon atomic unit cells) thick. MSTÂ® can be applied as a transistor channel enhancement to CMOS-type transistors, the most widely used transistor type in the semiconductor industrry.
IPSCIO Record ID: 5826
US Patent No. Filed Date Title
5,209,803 5/11/93 Parallel plate reactor and method of use
5,015,331 8/10/90 Method of plasma etching with parallel plate reactor having a grid
4,971,653 11/20/90 Temperature controlled chuck for elevated temperature etch processing
IPSCIO Record ID: 223115
Licensor grants a worldwide, indivisible, non-exclusive license under Licensors Licensed Patent Rights, without the right to grant sublicenses, to manufacture, to use and to sell or otherwise dispose of Products in any and all countries of the world.
The Licensed Patent Rights of either Party shall mean Patent Rights other than Basic Patent Rights relating to the manufacture, structure and operation of polymer electroluminescent devices and entitled to receive the benefit of a priority date before January 1, 2001.
The term Remuneration Products shall mean Products covered by any claim of the Basic Patent Rights.
The Products mean complete polymer electroluminescent devices and arrays of such devices in the form of layers or layer structures incorporating at least a light emitting polymer layer and electrode layers and further optionally incorporating other layers such as for example substrate and supporting layers or protective layers. The term Products excludes devices which are High Information Content Displays. High Information Content Displays are displays with more than 100,000 picture elements (pixels).
IPSCIO Record ID: 7494
Gallium arsenide (GaAs) is a compound of the elements gallium and arsenic. It is a III/V semiconductor, and is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells and optical windows.
IPSCIO Record ID: 480
'Deposition Process Technology' means processes for depositing compositions of matter, including Deposition Precursor Technology, onto substrates using Deposition Plasma Jet Technology. Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks.
Surface cleaning is a fundamental requirement for many industrial processes. It is also important for decontamination of objects. Traditionally, surface cleaning has been accomplished using solvent-based methods, technologies which have been available for more than 100 years. Increasing concerns about ground water and air pollution, greenhouse gases, and related health and safety issues have severely restricted the use of common volatile organic solvents, and even many of the recently-adapted, less hazardous chemical substitutes. Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks. Plasmas ranging in pressure from high vacuum (<0.1 mTorr) to several Torr are most common, and have been used for film deposition, reactive ion etching, sputtering and other forms of surface modification. The primary advantage of plasma cleaning is that it is an 'all-dry' process, generates minimal effluent, does not require hazardous pressures, and is applicable to a wide variety of vacuum-compatible materials, including silicon, metals, glass, and ceramics.
IPSCIO Record ID: 2425
IPSCIO Record ID: 26338
Metals as used in this Agreement include, without limitation, copper, aluminum, chrome and lithium, and composites of one or more metals.
Products as used in this Agreement include, without limitation, flexible composites of metals and films, flexible printed circuits, Multichip Modules, single and several chip packages, batteries and displays for use within the electrical interconnect industry.
IPSCIO Record ID: 28132
ECD Microwave Plasma Enhanced Chemical Vapor Deposition (MPECVD) technology is use to produce other thin film coatings.
Licensor is involved in research, development and commercialization of proprietary technology relating to microwave plasma enhanced chemical vapor deposited multilayered optical coatings and the manufacturer of products that incorporate such coating.
The Licensee is involved in research, development and manufacture of sputtered multilayered coatings on substrates.