Royalty Report: Semiconductors, Fabrication, Material Composite – Collection: 480

$150.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 20

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 20

Primary Industries

  • Semiconductors
  • Fabrication
  • Material Composite
  • Coating
  • Machinery
  • Chemicals
  • Laser
  • Technical Know How
  • Electrical & Electronics
  • Metals & Metal Products
  • Device
  • Optical
  • Medical
  • Drugs
  • Scientific & Technical Instruments
  • Biotechnology
  • Coating surface
  • IC

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 480

License Grant
The Licensor  hereby grants a sole and exclusive, worldwide, royalty-bearing right and license under the Licensed Patent Applications and the Licensed Patents to make, have made, use, sell, offer for sale, lease and otherwise dispose of Licensed Products in the Licensed Territory in the Licensed Field of Use.  Licensee accepts the terms and conditions required for sublicensees as outlined in the UC License.
License Property
Licensed Product, singular or plural, shall mean any Atmospheric Pressure Plasma Jet Technology wherein the manufacture, use, offer for sale, sale or importation of Atmospheric Pressure Plasma Jet Technology by Licensee would, but for the rights and license granted herein, constitute an infringement of a valid and enforceable claim of a subsisting Licensed Patent and shall not include Licensee's standard power delivery equipment (i.e., stand alone Licensee's power supplies and match networks) but includes power generation and delivery equipment which is designed specifically as an integral and indivisible part of the Atmospheric Pressure Plasma Jet Technology.

'Deposition Process Technology' means processes for depositing compositions of matter, including Deposition Precursor Technology, onto substrates using Deposition Plasma Jet Technology.  Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks.

Surface cleaning is a fundamental requirement for many industrial processes. It is also important for decontamination of objects. Traditionally, surface cleaning has been accomplished using solvent-based methods, technologies which have been available for more than 100 years. Increasing concerns about ground water and air pollution, greenhouse gases, and related health and safety issues have severely restricted the use of common volatile organic solvents, and even many of the recently-adapted, less hazardous chemical substitutes.  Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks. Plasmas ranging in pressure from high vacuum (<0.1 mTorr) to several Torr are most common, and have been used for film deposition, reactive ion etching, sputtering and other forms of surface modification. The primary advantage of plasma cleaning is that it is an 'all-dry' process, generates minimal effluent, does not require hazardous pressures, and is applicable to a wide variety of vacuum-compatible materials, including silicon, metals, glass, and ceramics.

Field of Use
'Licensed Field of Use shall mean all fields in which Licensee can demonstrate that it is one of the top three leading vendors in market share in each of such fields, as demonstrated by dollar volume of sales in the preceding year, including but not limited to Semiconductor Processing, Data Storage (including but not limited to magnetic and optical), Flat Panel and Electronic Displays, and Architectural Glass, and in any other field mutually agreed upon.

IPSCIO Record ID: 28132

License Grant
The Licensor grants the Licensee an exclusive royalty-bearing, worldwide License, with the right to sub License, under the Licensor's proprietary MPECVD Technology and Improvement Inventions to use the MPECVD Technology and Improvement Inventions and make, use and sell the Products in the Field for the period of time covered by the Exclusivity Period.
License Property
Products shall mean any and all products incorporating one or more multilayered optical coatings in which at least one layer of a multilayer stack is deposited by the Licensor's MPECVD Technology.

ECD Microwave Plasma Enhanced Chemical Vapor Deposition (MPECVD) technology is use to produce other thin film coatings.

Licensor is involved in research, development and commercialization of proprietary technology relating to microwave plasma enhanced chemical vapor deposited multilayered optical coatings and the manufacturer of products that incorporate such coating.

Field of Use
The Field includes Products produced for sale as coatings in display applications (CRT’s, Flat Panel Displays, Digitizers, Touchpanels, etc) and coatings for flexible substrate applied to automotive and building glass and decorative and reflector applications, and for non low emissivity coatings on automotive and building glass, decorative and reflector glass applications.

The Licensee is involved in research, development and manufacture of sputtered multilayered coatings on substrates.

IPSCIO Record ID: 5826

License Grant
Licensor hereby grants to the Licensee and its Affiliates a worldwide, exclusive, non-sublicensable or transferable, irrevocable, license to utilize Licensed Technology to manufacture, use, sell, maintain and service the Products.
License Property
Products as used herein shall mean certain dry strip semiconductor manufacturing equipment under the trade names System One and System Ten, including software, components and parts therefor.  

  US Patent No.      Filed Date                   Title

    5,209,803          5/11/93     Parallel plate reactor and method of use

    5,015,331          8/10/90     Method of plasma etching with parallel plate reactor having a grid

    4,971,653         11/20/90     Temperature controlled chuck for elevated temperature etch processing

Field of Use
The rights granted apply to dry strip semiconductor manufacturing equipment.

IPSCIO Record ID: 153750

License Grant
Licensor grants to Licensee an exclusive, nontransferable, worldwide right and License to use the Licensor Industrial Property Rights solely for the  manufacture, sale, lease, or other disposition of products incorporating the Licensed Technology.  Licensor further grants to Licensee an exclusive, nontransferable right to (i) modify and make derivative works from the Licensor Industrial Property and (ii) subject to the prior written consent of Licensor, which shall not be unreasonably withheld, sublicense the Licensor Industrial Property rights solely for the purposes of manufacture, product development, distribution or related uses.
License Property
The Business shall mean the Intragene and related coating business acquired by Licensee pursuant to the terms of the Purchase Agreement and now operated by Licensee.

Licensor Industrial Property Rights shall mean all Confidential Information and, whether or not the following constitute Confidential Information, all of Licensors patents, licenses, trademarks, trade names, inventions, inventors notes, copyrights, formulea know-how, trade secrets, drawings and designs relating to the Business represented by the Licensed Technology.

Licensed Technology shall mean all of Licensors proprietary technology relating to the Business which has been licensed to Licensee hereunder including, but not limited to, the Patents and the Marks.

The Marks means the trademark 'Licensor Materials' and all trade or service mark registrations (and any applications therefor) associated therewith.

Patents shall mean the following patents (i) U.S. Patent 4,535,029 dated 8/13/85, (ii) U.S. Patent 4,426,423 dated 11/17/84, (iii) U.S. Patent 4,358,506 dated 11/9/82, (iv) U.S. Patent 4,376,806 dated 3/15/83 and (v) U.S. Patent 4,396,677 dated 8/2/83.

4,535,029 – Method of catalyzing metal depositions on ceramic substrates
4,426,423 – Ceramic, cermet or metal composites
4,358,506 – Metal and carbon composites thereof
4,376,806 – Highly adhesive coatings for beryllia
4,396,677 – Metal, carbon, carbide and other composites thereof

The Intragene-TM- process is a proprietary methodology developed by metallurgists and materials scientists at the Company and has been granted six U.S. patents as well as national phase patents based on two European patent applications and three Japanese patents. The Intragene-TM- process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals.

The materials division product line consists of Intragene-TM–based sputtering target assemblies and electromagnet systems. The sputtering target assemblies have been sold into the rigid disk market since 1986 and are considered one of the most reliable such assemblies in the market today. Sputtering target assemblies are sold to end-users as source materials for coating other materials via a vacuum-based process called sputtering. Sputtering is employed as the primary method for depositing thin film functional and protective layers on rigid magnetic media (hard disks), as well as in many semiconductor-manufacturing operations. Once a target is made, it must usually be incorporated into the sputtering apparatus by joining it to a backing plate to make sound electrical, thermal and mechanical contact. The bonding of a target to the backing plate, which is usually made of copper, forms what is known as the 'bonded target assembly.'

Field of Use
This agreement pertains to the chemical industry relating to the coating technology.

IPSCIO Record ID: 28059

License Grant
In this agreement, Licensor grants an exclusive Worldwide License, with the right to sub license, under proprietary MPECVD Technology and Improvement Inventions to use the MPECVD Technology and Improvement Inventions and make, use and sell the Products.
License Property
The proprietary technology is relating to microwave plasma enhanced chemical vapor deposited or MPECVD, multi-layered optical coatings.
Field of Use
The Products produced for sale as coatings in display applications (CRT’s, Flat Panel Displays, Digitizers, Touch panels, etc) and coatings for flexible substrate applied to automotive and building glass and decorative and reflector applications, and for non low emissivity coatings on automotive and building glass, decorative and reflector glass applications.

IPSCIO Record ID: 27456

License Grant
The Company licensed certain trademarks and technology, and granted to a company headquartered in Kanagawa Prefecture, Japan the exclusive right to manufacture and sell in Japan, Korea, Taiwan, Hong Kong, China, India, the Philippines, Thailand, Vietnam, Malaysia, Singapore and Indonesia, and such other countries as the parties may agree to from time to time, products similar to those manufactured and distributed by the Company.
License Property
The Company designs, develops, manufactures, markets and services chemical mechanical planarization, or CMP, systems used in the fabrication of semiconductor devices as well as other high throughput precision surface processing systems used in the fabrication of thin film memory disk media, semiconductor wafers and general industrial components; products include polishing, grinding and lapping equipment and systems; cleaning systems; other high precision surface processing equipment; and certain other products used in its customers’ manufacturing process, including slurries.

IPSCIO Record ID: 286101

License Grant
Licensor grants to Licensee, effective upon (and only upon) a Triggering Event, an exclusive, royalty bearing, transferable license to make, have made, use, offer to sell, sell or import Particles for applications in the Field under U.S. patent no. 6,669,823 and all corresponding foreign patents and patent applications, and any trade secrets or other intellectual property owned or controlled by Licensor or its principals relevant to manufacture of Particles in the Field.

Licensor will sell, and Licensee will purchase, all of Licensee’s worldwide requirements for Ceria Particles for applications in the Field. In addition, if, pursuant to Licensee’s request, Licensor develops and produces Other Particles for applications in the Field that meet Licensee’s performance and pricing criteria, Licensor will sell, and Licensee will purchase, all of Licensee’s worldwide requirements for such Other Particles for applications in the Field at a price to be negotiated and agreed by the parties and otherwise on the terms and conditions set forth herein.

For Ceria Particles, the purchase and sale obligations set forth shall be mutually exclusive; i.e., except as specifically otherwise provided herein, for the term of this Agreement,

In consideration of the foregoing premises and the mutual covenants and promises hereinafter set forth, the parties agree as follows
(a)

Licensor and Licensee mutually agree to use all commercially reasonable efforts to cooperate with one another to develop one or more commercial slurry products incorporating the Particles for applications in the Field (the Development Product(s)).
(b)

Without limiting Licensee’s general obligation of cooperation under subsection (a), above, Licensee undertakes to (i) provide Licensor with target specifications, performance data and analytical assistance as may be agreed to characterize Development Product performance, (ii) test and evaluate Development Product samples provided by Licensor and provide feedback as to the results thereof to Licensor in a timely manner, (iii) keep Licensor regularly advised of the general market situation applicable to the Development Products, and (iv) include Licensor business and technical personnel in meetings with business and technical personnel at customers, as appropriate, to discuss and promote the Particles and the Development Products.
(c)

Without limiting Licensor’s general obligation of cooperation under subsection (a), above, Licensor undertakes to (i) provide Licensee with reasonable research samples of the Development Product for testing and evaluation as may be agreed, together with related physical, chemical and other information, (ii) devote sufficient resources (including equipment and personnel) as may be agreed to provide for the development effort, and (iii) provide agreed technical support to Licensee and its customers as to the use of the Particles and the Development Products.

License Property
Particles are cerium oxides particles (ceria) and/or dispersions of Ceria using Licensor’s proprietary processes.

6,669,823 – Process for preparing nanostructured materials of controlled surface chemistry

Other particles and/or dispersions (nanocrystalline or otherwise) developed and manufactured by Licensor using its proprietary processes for use in the Field (such other particles and/or dispersions developed and manufactured by Licensor for use in the Field being hereinafter referred to as Other Particles, and Ceria Particles and Other Particles developed and manufactured by Licensor being hereinafter together referred to as the Particles)

Field of Use
The Field is for potential use by Licensee in products for chemical mechanical planarization (CMP) for semiconductor wafers.

IPSCIO Record ID: 328

License Grant
Japanese Licensor hereby grants to Licensee the exclusive License under the Patents, Technical Information and Intellectual Property Rights to manufacture, use, offer for sale, sell, import and/or lease the Products in the territory; provided, however, Licensee agrees not to manufacture any of the three Products listed in this Agreement at any time on or prior to June 30, 2006; provided further, however, that Licensee may start on the effective date to manufacture, use, offer for sale, sell, import and/or lease in the territory all subsystems related to any Products, including, but not limited to, the Nison Vesper submodule. For the avoidance of doubt, Licensor acknowledges and agrees that the License granted to Licensee under this Agreement includes the right of the Licensee to subLicense to any purchaser of the Products the right to use (but not manufacture) the Patents, Technical Information and Intellectual Property Rights.
License Property
Licensor was incorporated to, among other things, manufacture and distribute certain products and systems of Licensee in Japan in accordance with a Shareholders Agreement dated June 5, 1991.  This license is a result of Licensor buying a portion of the business of a semiconductor manufacturing equipment business and licensing back rights to Licensee.

The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers.  Three products are covered by this agreement Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.

Patent

Title
No.
number

number
Country

1
Method of recirculation of high temperature etching solution
63–248757
02–096334

1653241
Japan

2
Cleaning/ rinsing vessel for semiconductor wafer
03–350731
05–166787

2013691
Japan

3
Method for refinig etchant
05–253672
07–086260

3072876
Japan

4
Single wafer spin etching method
07–104581
08–279485

3459137
Japan

5
Etching method with hot phosphoric acid
07–216528
09–045660

3459141
Japan

6
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
07–163075
08–334461

N/A
Japan

7
Regeneration treatment apparatus for etchant and etching apparatus using the same
10–095836
11–293479

N/A
Japan

8
Cleaning apparatus
11–199868
2001–028356

N/A
Japan

9
Filter device with bellows damper and chemical–circulation treatment device for semiconductor wafer using the same
11–222204
2001–046815

N/A
Japan

10
Semiconductor wafer cleaning system
11–234855
2001–060574

N/A
Japan

11
Method of etching semiconductor wafer
11–271065
2001–093876

N/A
Japan

12
Device and method for etching semiconductor wafer
11–314794
2001–135611

N/A
Japan

13
Scrub cleaning device
2000–044343
2001–237209

N/A
Japan

14
Cleaning Equipment of wafer
2000–274592
2002–093764

N/A
Japan

15
Equipment and method for processing solution for semiconductor wafer
2001–009915
2002–217165

N/A
Japan

16
Wafer–cleaning device
2001–158580
2002–353183

N/A
Japan

17
The apparatus and the method of etching wafer
2002–42120
2003–243353

N/A
Japan

18
The apparatus of reclaiming etching liquid and method and apparatus of etching
2002–269405
N/A

N/A
Japan

19
The method of controlling the boiling chemical
2002–318730
2004–153164

N/A
Japan

20
The apparatus and the method of floating wafer chuck
2002–108651
2003–303871

N/A
Japan

21
The apparatus of wafer treatment and shaft
2003–47148
N/A

N/A
Japan

22
Etching method and equipment
2002–324795
2004–158746

N/A
Japan

23
Processing method and processing device before wafer inspection
2001–266653
2003–75312

N/A
Japan

24
Processing method and processing device before wafer inspection
2002–156835
2003–344243

N/A
Japan

25
Method for recirculating high–temperature etching soluthin
412444
N/A

4980017
USA

26
Method for purification of etching solution
305334
N/A

5470421
USA

Trademarks

Class of

NO
Trademark
goods
Designated goods

1 NISON
7
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments

2 NISON
9
Automatic fluid– composition control machines and instruments

3 CENOTE
7
The apparatus of wafer etching, chemical machines and instruments

4 Stelna
7
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.

Remark An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.

Product
Product Name

Description

Spin Processor CENOTE
Single Wafer Wet Station

Best

                Wafer Backside Etcher

Wet Station

Immersion Process System

Field of Use
Products means any and all products, systems and subsystems now or hereafter produced by or under control of Licensee based upon the Technical Information given under this Agreement which are in the field of surface conditioning, cleaning, etch and stripping technology such as the Technical Information used in the products to this Agreement and any products, systems and subsystems to be used in the Field which will be developed, designed or invented, or otherwise acquired by Licensor in the future during the term of this Agreement.

IPSCIO Record ID: 166414

License Grant
Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents to make, use, import, offer to sell, sell and otherwise transfer Products.  Additionally, Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents the right to have Licensees Products made by another manufacturer for the use and/or lease, sale or other transfer only by Licensee and its Subsidiaries.  Such license shall further include the right to incorporate Products as components, subassemblies or subsystems in other products manufactured and/or sold by Licensee and its Subsidiaries.
License Property
The patents relate to coherent semiconductor injection laser array.  The invention relates to optical devices and more particularly relates to solid state lasers.

'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.

Field of Use
Licensee is in the semiconductor industry.

IPSCIO Record ID: 89738

License Grant
Licensor and their Netherlands Affiliate hereby grants to Licensee and its Affiliates for the Term a nonexclusive license, with the right to sublicense, under the Licensed Claims to develop, make, have made, use, sell, offer to sell, lease, and import Licensed Products in the Territory and to develop and perform Licensed Processes in the Territory. Nothing in this Agreement is intended to grant a license to anyone to make, use, sell, offer to sell, lease, or import Equipment that infringes any patent owned by Licensor.
License Property
Licensed Product shall mean products comprising Permitted Structures that absent the license granted hereunder, would infringe one or more Licensed Claims.

Licensed Claims shall mean any and all non-Equipment claims entitled to priority to U.S. Serial No. 09/227,679 and/or 60/070,991, including, without limitation, non-Equipment claims in U.S. Patent Nos. 6,749,687 and 7,105,055.

6,749,687 –  In situ growth of oxide and silicon layers
7,105,055 – In situ growth of oxide and silicon layers

The lead technology, named Mears Silicon Technology™, or MST®, is a thin film of reengineered silicon, typically 100 to 300 angstroms (or approximately 20 to 60 silicon atomic unit cells) thick. MST® can be applied as a transistor channel enhancement to CMOS-type transistors, the most widely used transistor type in the semiconductor industrry.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 27927

License Grant
The Company has licenses for the patented One Atmospheric Uniform Glow Discharge Plasma (OAUGDP or Atmospheric Plasma) technology developed by scientists at the University. The Company current patent portfolio includes (a) six patents that are exclusively licensed (with sub-license rights) for commercial purposes from the University.
License Property
The OAUGDP platform technology generates plasma, the fourth state of matter, in air under standard pressures at ambient temperatures without the need for either a vacuum or non-atmospheric gas (e.g., compressed helium or argon).  

Atmospheric Plasma technology therefore minimizes the need for special equipment, reduces operating costs, and, in turn, increases the applicability of plasma.  Such plasma is the fourth state of matter and is a technology in its infancy.  As a fundamental science unto itself, Atmospheric Plasma is a potential source for a multitude of applications and products.  Fundamental technology forms such as transistors, lasers, and related innovations have provided a basis for revolutionary advancements in applications and products.  

The patent portfolio protects the plasma platform technology as well as specific applications that include air filtration and purification, DNA extraction, decontamination and sterilization, aerodynamics, materials surface cleaning and textile processing.  The breakthrough plasma technology electrically breaks down air creating highly reactive chemical species. This resulting unique plasma generated chemistry is then used to produce the desired effects such as alteration of material properties, destruction of microorganisms, and destruction of odor-causing chemicals.

Field of Use
OAUGDP technology lends itself to the development of products in a number of areas.  These areas include (1) air filtration;  (2) biotechnology;  (3) chemical and biological decontamination;  (4) sterilization technology;  (5) disinfection of food, beverage, and pharmaceutical fermentation processes; and  (6) reduction of hydrocarbon based pollutants and volatile organic compounds (such as diesel soot) to substances such as water and carbon dioxide.

IPSCIO Record ID: 280974

License Grant
Licensor and German Licensee are parties to certain litigation involving the 761 patent.

With this interim patent license, the Licensor grants to the German Licensee a non-exclusive, non transferable worldwide license under the Patent Rights, without the right to grant sublicenses, to make, have made, use, sell, offer for sale, and import Licensed Products during the Term of this Agreement.

License Property
Licensor is the owner of patents relating to wet processing of semiconductors.

Licensed Products shall mean drying equipment, wet bench products, and replacement parts .

Dryer Module shall mean drying equipment in an enclosed, self-contained, physically separate unit which performs rinsing and drying but no chemical treatment operation.

Field of Use
The field of use is the semiconductor wet processing business.

IPSCIO Record ID: 189170

License Grant
The University and Licensee entered an exclusive license to make, have made, use, sell, or any combination of the Licensed Products and Licensed Processes in the Field of Use and the Licensed Territory.  Additionally Licensor granted to Licensee a limited exclusive eighteen month option to license Optioned Technologies Patent Rights.
License Property
The Licensed Technologies Patent Rights are for Compounds Containing Tetra-deca-chloro-cyclo-hexasilane Dianion; Method of Forming Functionalized Silanes; Method of Producing Polyalkylated Oligoalkylenepolyamines; and Method of Producing Cyclohexasilane Compounds.

The Optioned Technologies Patent Rights are for Liquid Silane-Based Compositions and Methods for Producing Silicon-Based Materials; Liquid Silane-Based Compositions and Methods of Fabrication; Method and Apparatus for Aerosol Direct Write Printing; Synthesis of Silicon Containing Materials Using Liquid Hydrosilane; Compositions through Direct Injection; Silicon Materials from the Processing of Liquid Silanes and Heteroatom Additives; Synthesis of SI-Based Nano-Materials using Liquid Silanes; Production of 1-Dimensional Supramolecular Assemblies Comprised of Cyclopentasilane and  Cyclohexasilane Rings Linked by Atoms, Molecules, and Ions; and Surface Modified Silicon Quantum Dots.

Field of Use
Licensee creates technology based solutions, products and services, that address energy-related market needs globally.  Licensees underlying technology is based on the production of a high value liquid silicon precursor, cyclohexasilane, CHS, for materials commonly used for manufacturing silicon-based semiconductors and solar cells.

IPSCIO Record ID: 28220

License Grant
We entered into a license agreement with the University granting us exclusive worldwide rights relating to aluminum free high power semiconductor diode lasers under patent rights of the University.
License Property
The patent rights and the license with University cover all production methods, including, but not limited to Molecular Beam Epitaxy and Metal Organic Chemical Vapor Deposition.
Field of Use
The Licensee produces high power semiconductor diode laser wafers and bars or HPDLs, and to market these products worldwide.

IPSCIO Record ID: 368499

License Grant
Licensor of England, grants
—  an exclusive license under Licensed Patents to make, have made, use, sell and import PolyFluorene Based Materials in any and all countries of the world. This license includes process technology relating to the Suzuki Coupling reaction;

—  a non-exclusive license under Licensed Patents for all process technology relating to the Suzuki coupling reaction for use in making materials other than PolyFluorene Based Materials in any and all countries of the world;

—  a non-exclusive license under Licensor Patents to make, have made, use, sell and import PF Ink Jet Formulations in any and all countries of the world, provided that such Intellectual Property is wholly-owned and free to be licensed as of the date of this Agreement, or for later made inventions, as of the date of the invention;

—  a non-exclusive license under Licensor Patents relating to Spiro and IndenoFluorones to make, have made, use, sell or import LEPs containing spiro and indenofluorenes in any and all countries of the world, provided that those patents are wholly-owned and free to be sublicensed as of the date of this Agreement, or for later made inventions, as of the date of the invention; and

—  a non-exclusive license under Licensors intellectual property to make test devices for screening and developing new materials.

License Property
Licensor has the right to grant licenses under certain patents and Know-how relating to polyfluorene-based materials.

LEP means light emitting polymer relating to large molecule organic electroluminescent material.

Polyfluorene-Based Material means Polyfluorenes;  solid compositions containing Polyfluorenes in an amount of at least 1% by weight; and solutions containing Polyfluorenes not including formulations for ink jetting.

PF Ink Jet Formulations Means solutions containing Polyfluorenes for ink jet application.

Field of Use
The Parties are developing polymers for use in LEP displays, which are organic light-emitting displays (OLEDs).
OLED displays are expected to be deployed in instrument panels and portable electronics such as mobile phones and personal digital assistants, and eventually larger displays for personal computers and consumer products, where they could overtake liquid-crystal display (LCD) technology in the future.

As an emissive display, LEPs need no backlight, which means they can be thinner and lighter than LCDs, as well as more power-efficient. LEP displays are also brighter with richer color, offering sharp, high-contrast images that can easily be viewed from acute angles. Additionally, LEPs in liquid form are unique in that they can be ink-jet printed on glass and plastic, which is a technology advantage that could significantly change the way displays are produced and open new markets and opportunities.

The field of use is semiconductors and related devices.

IPSCIO Record ID: 203471

License Grant
Licensors hereby grant to Licensee, for the term of this Agreement, a worldwide and nonexclusive license under the method claims of the licensed patent to make, have made, use, lease, offer to sell, sell, distribute, import or otherwise dispose of licensed products and to use licensed equipment to manufacture licensed products.
License Property
Licensed patent shall mean (i) U.S. Patent No. 5,015,492 titled 'Method and Apparatus for Pulsed Energy Induced Vapor Deposition';

Licensed product shall mean a cryogenic receiver front-end device for wireless communications networks which contains a thin film radio frequency filter manufactured using high-temperature superconducting materials and either pulsed energy deposition or pulsed laser deposition. A list of the current Licensed products of Licensee, is set forth.   Additional Licensed products may be added to this list by Licensee upon written notice to Licensor.

Licensed equipment shall mean an apparatus performing pulsed energy deposition and/or pulsed laser deposition claimed in the Licensed patent.

Field of Use
This agreement pertains to the superconductor industry.

IPSCIO Record ID: 5328

License Grant
Pursuant to the Assignment Agreement entered for Patent No. 5,254,237 which is entitled, Plasma Arc Apparatus for Producing Thin Film Diamond Coatings, was granted on October 19, 1993 to Licensor, the inventor of the original titanium nitride and thin film diamond coating processes.
License Property
The Diamond Coating Process includes, but is not necessarily limited to, low temperature titanium nitride, cobalt nitride, chromium nitride, ferroelectric coatings, piezoelectric coatings, diamond hard coatings and diamond semi-conductor substrates.  Thus there has been disclosed a unique plasma arc deposition system for producing diamond, doped diamond or diamond-like coatings on a substrate by pulsed plasma technique.  These techniques do not require or produce temperature rise at the substrate, allowing normally temperature sensitive substrates to be utilized.  Typical of substrates which bond readily to the thin film diamond coatings without degradation are zinc sulfide (ZnS) or zinc selenide (ZnSe), which are useful in infrared windows or laser components.  The system disclosed and described can be used in the development of products and materials such as producing on junction diodes of crystalline carbon, so that rectifiers able to withstand temperatures in the neighborhood of 1000 to 1500 degrees Fahrenheit are also possible. Insulated gate field effect transistors that can handle high source to drain potentials and provide high gain without seriously loading the signal source, while operating at elevated temperatures beyond those achievable with silicon devices, can be produced with the system described.  Many other diamond-like integrated circuit chips, such as light emitting diodes or diodes used in solid state lasers are possible. Since thick diamond layers of good optical clarity can be produced by the process described herein, among the new devices that have become possible is an optical modulator that depends upon the polarizing effects of electric fields upon light beams through the crystal lattice.  This property leads to the entirely new family of high-power, opto-electronic coupling, modulating, scanning and/or sensing devices based upon diamond semiconductors.  Many other semiconductor devices that can utilize the enhanced properties of diamond-like films can be produced with the invention disclosed and described herein.
Field of Use
The rights granted apply for producing diamond-like coatings.

IPSCIO Record ID: 3598

License Grant
The Company entered into an additional Agreement acquiring an Exclusive License to manufacture, sell and provide services and parts support for certain reactive ion etch semiconductor manufacturing equipment for wafer sized up to 200mm now marketed under the ASI trade names Arista and Arista Dual.
License Property
Products as used herein shall mean certain reactive ion etch semiconductor manufacturing equipment for wafer sizes up to 200mm under the trade names Bobcat 209 or Cheetah (limited to such equipment that includes at least one reactive ion etch chamber) including software, components and parts therefor.
Field of Use
Dry strip semiconductor manufacturing equipment As part of the chip creation process, a light sensitive, polymer-based liquid, called photoresist, is spread in a uniformly thin film on the wafer in pattern creating a stencil effect. Photostabilization uses ultraviolet light to harden, or cure, the photoresist so that it is more effective in maintaining the desired pattern during the subsequent implant processes and etch steps (in which the top layer of the surface of the wafer not covered by photoresist is removed). After these steps, the photoresist is no longer.

IPSCIO Record ID: 230774

License Grant
The Parties agree to jointly develop semiconductor manufacturing process technology based on Licensor’s “S” high performance technology roadmap on commercially available wafers that meet the requirements (referred to as Strategic Technology Objectives) in accordance with the schedule (hereinafter referred to as Development Schedule). The Parties agree that the process technology so developed, shall be high performance, leading edge technology and, to the extent consistent with the Strategic Technology Objectives, shall be cost efficient. Any modification to such Strategic Technology Objectives or Development Schedule requires the mutual agreement of the Parties. For the avoidance of doubt, none of the Process Development Projects shall include the development of i) Proprietary Tools, ii) Packaging Technology, iii) Mask Fabrication and Photoresist Technology, iv) Memory, v) SiGe Technology, vi) Chip Designs, or vii) Post-Silicon Devices.
License Property
Semiconductor Product means a component that contains an Integrated Circuit on a single or multichip module that incorporates a means of connecting those Integrated Circuits with other electronic elements (active or passive) and/or means to make external electrical connections to such elements, but which excludes any means for a user to operate the functions therein (e.g., buttons, switches, sensors).

Licensed Product means Integrated Circuits that include Bulk CMOS Information, Industry Standard Information, High Performance Device Information, SOI Device Information, or any combination thereof, other than Foundry Products.

Integrated Circuit means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, Integrated Circuit shall include charge-coupled devices (“CCDs”).

Bulk CMOS Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, and/or (ii) selected by Licensor either for incorporation into an Licensor Bulk CMOS process or otherwise pursuant to this agreement.

Industry Standard Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, or (ii) applicable to Industry Standard CMOS and selected by Licensor either for incorporation into an Licensor Industry Standard CMOS process or otherwise selected pursuant to this agreement.

High Performance Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on substrates, not including SOI Device Information. Bulk CMOS Information or Industry Standard Information.

SOI Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on commercially available SOI Wafers other than Bulk CMOS or Industry Standard Information.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 26338

License Grant
The Latvian Licensor further hereby grants to Licensee a nontransferable, exclusive, perpetual license to use Licensor's technical information and other technology existing at the date hereof to put metals with a thickness of 0.1 microns to 5 microns on flexible polymeric substrates in order to produce and sell products, including without limitation the ability to put active and passive electronic components on thin substrates.
License Property
The Licensor, has over a period of years developed and patented valuable technology for depositing various metals onto metal foils, films and fabrics in a vacuum.  The Licensor has developed technology for the deposition of various metals on metal foils and onto films. This technology which employs innovative equipment developed by the Licensor can be used in the production of copper laminates and foils.

Metals as used in this Agreement include, without limitation, copper, aluminum, chrome and lithium, and composites of one or more metals.

Products as used in this Agreement include, without limitation, flexible composites of metals and films, flexible printed circuits, Multichip Modules, single and several chip packages, batteries and displays for use within the electrical interconnect industry.

Field of Use
The Licensee, a leading maker and supplier of ceramics and metal coated foils, films, and fabrics desires to be licensed under the Licensor's patented technology for depositing various metals on metal foils and on polyester film in a vacuum in order to further develop the technology and to market products generated by this technology according to the terms of this Agreement.
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