Category: Technology Licenses
Created On: 2022-04-28
Record Count: 20
- Material Composite
- Technical Know How
- Electrical & Electronics
- Metals & Metal Products
- Scientific & Technical Instruments
- Coating surface
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 480
'Deposition Process Technology' means processes for depositing compositions of matter, including Deposition Precursor Technology, onto substrates using Deposition Plasma Jet Technology. Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks.
Surface cleaning is a fundamental requirement for many industrial processes. It is also important for decontamination of objects. Traditionally, surface cleaning has been accomplished using solvent-based methods, technologies which have been available for more than 100 years. Increasing concerns about ground water and air pollution, greenhouse gases, and related health and safety issues have severely restricted the use of common volatile organic solvents, and even many of the recently-adapted, less hazardous chemical substitutes. Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks. Plasmas ranging in pressure from high vacuum (<0.1 mTorr) to several Torr are most common, and have been used for film deposition, reactive ion etching, sputtering and other forms of surface modification. The primary advantage of plasma cleaning is that it is an 'all-dry' process, generates minimal effluent, does not require hazardous pressures, and is applicable to a wide variety of vacuum-compatible materials, including silicon, metals, glass, and ceramics.
IPSCIO Record ID: 28132
ECD Microwave Plasma Enhanced Chemical Vapor Deposition (MPECVD) technology is use to produce other thin film coatings.
Licensor is involved in research, development and commercialization of proprietary technology relating to microwave plasma enhanced chemical vapor deposited multilayered optical coatings and the manufacturer of products that incorporate such coating.
The Licensee is involved in research, development and manufacture of sputtered multilayered coatings on substrates.
IPSCIO Record ID: 5826
US Patent No. Filed Date Title
5,209,803 5/11/93 Parallel plate reactor and method of use
5,015,331 8/10/90 Method of plasma etching with parallel plate reactor having a grid
4,971,653 11/20/90 Temperature controlled chuck for elevated temperature etch processing
IPSCIO Record ID: 153750
Licensor Industrial Property Rights shall mean all Confidential Information and, whether or not the following constitute Confidential Information, all of Licensors patents, licenses, trademarks, trade names, inventions, inventors notes, copyrights, formulea know-how, trade secrets, drawings and designs relating to the Business represented by the Licensed Technology.
Licensed Technology shall mean all of Licensors proprietary technology relating to the Business which has been licensed to Licensee hereunder including, but not limited to, the Patents and the Marks.
The Marks means the trademark 'Licensor Materials' and all trade or service mark registrations (and any applications therefor) associated therewith.
Patents shall mean the following patents (i) U.S. Patent 4,535,029 dated 8/13/85, (ii) U.S. Patent 4,426,423 dated 11/17/84, (iii) U.S. Patent 4,358,506 dated 11/9/82, (iv) U.S. Patent 4,376,806 dated 3/15/83 and (v) U.S. Patent 4,396,677 dated 8/2/83.
4,535,029 – Method of catalyzing metal depositions on ceramic substrates
4,426,423 – Ceramic, cermet or metal composites
4,358,506 – Metal and carbon composites thereof
4,376,806 – Highly adhesive coatings for beryllia
4,396,677 – Metal, carbon, carbide and other composites thereof
The Intragene-TM- process is a proprietary methodology developed by metallurgists and materials scientists at the Company and has been granted six U.S. patents as well as national phase patents based on two European patent applications and three Japanese patents. The Intragene-TM- process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals.
The materials division product line consists of Intragene-TM–based sputtering target assemblies and electromagnet systems. The sputtering target assemblies have been sold into the rigid disk market since 1986 and are considered one of the most reliable such assemblies in the market today. Sputtering target assemblies are sold to end-users as source materials for coating other materials via a vacuum-based process called sputtering. Sputtering is employed as the primary method for depositing thin film functional and protective layers on rigid magnetic media (hard disks), as well as in many semiconductor-manufacturing operations. Once a target is made, it must usually be incorporated into the sputtering apparatus by joining it to a backing plate to make sound electrical, thermal and mechanical contact. The bonding of a target to the backing plate, which is usually made of copper, forms what is known as the 'bonded target assembly.'
IPSCIO Record ID: 28059
IPSCIO Record ID: 27456
IPSCIO Record ID: 286101
Licensor will sell, and Licensee will purchase, all of Licenseeâ€™s worldwide requirements for Ceria Particles for applications in the Field. In addition, if, pursuant to Licenseeâ€™s request, Licensor develops and produces Other Particles for applications in the Field that meet Licenseeâ€™s performance and pricing criteria, Licensor will sell, and Licensee will purchase, all of Licenseeâ€™s worldwide requirements for such Other Particles for applications in the Field at a price to be negotiated and agreed by the parties and otherwise on the terms and conditions set forth herein.
For Ceria Particles, the purchase and sale obligations set forth shall be mutually exclusive; i.e., except as specifically otherwise provided herein, for the term of this Agreement,
In consideration of the foregoing premises and the mutual covenants and promises hereinafter set forth, the parties agree as follows
Licensor and Licensee mutually agree to use all commercially reasonable efforts to cooperate with one another to develop one or more commercial slurry products incorporating the Particles for applications in the Field (the Development Product(s)).
Without limiting Licenseeâ€™s general obligation of cooperation under subsection (a), above, Licensee undertakes to (i) provide Licensor with target specifications, performance data and analytical assistance as may be agreed to characterize Development Product performance, (ii) test and evaluate Development Product samples provided by Licensor and provide feedback as to the results thereof to Licensor in a timely manner, (iii) keep Licensor regularly advised of the general market situation applicable to the Development Products, and (iv) include Licensor business and technical personnel in meetings with business and technical personnel at customers, as appropriate, to discuss and promote the Particles and the Development Products.
Without limiting Licensorâ€™s general obligation of cooperation under subsection (a), above, Licensor undertakes to (i) provide Licensee with reasonable research samples of the Development Product for testing and evaluation as may be agreed, together with related physical, chemical and other information, (ii) devote sufficient resources (including equipment and personnel) as may be agreed to provide for the development effort, and (iii) provide agreed technical support to Licensee and its customers as to the use of the Particles and the Development Products.
6,669,823 – Process for preparing nanostructured materials of controlled surface chemistry
Other particles and/or dispersions (nanocrystalline or otherwise) developed and manufactured by Licensor using its proprietary processes for use in the Field (such other particles and/or dispersions developed and manufactured by Licensor for use in the Field being hereinafter referred to as Other Particles, and Ceria Particles and Other Particles developed and manufactured by Licensor being hereinafter together referred to as the Particles)
IPSCIO Record ID: 328
The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers. Three products are covered by this agreement Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.
Method of recirculation of high temperature etching solution
Cleaning/ rinsing vessel for semiconductor wafer
Method for refinig etchant
Single wafer spin etching method
Etching method with hot phosphoric acid
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
Regeneration treatment apparatus for etchant and etching apparatus using the same
Filter device with bellows damper and chemicalâ€“circulation treatment device for semiconductor wafer using the same
Semiconductor wafer cleaning system
Method of etching semiconductor wafer
Device and method for etching semiconductor wafer
Scrub cleaning device
Cleaning Equipment of wafer
Equipment and method for processing solution for semiconductor wafer
The apparatus and the method of etching wafer
The apparatus of reclaiming etching liquid and method and apparatus of etching
The method of controlling the boiling chemical
The apparatus and the method of floating wafer chuck
The apparatus of wafer treatment and shaft
Etching method and equipment
Processing method and processing device before wafer inspection
Processing method and processing device before wafer inspection
Method for recirculating highâ€“temperature etching soluthin
Method for purification of etching solution
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments
Automatic fluidâ€“ composition control machines and instruments
The apparatus of wafer etching, chemical machines and instruments
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.
Remark An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.
Spin Processor CENOTE
Single Wafer Wet Station
Wafer Backside Etcher
Immersion Process System
IPSCIO Record ID: 166414
'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.
IPSCIO Record ID: 89738
Licensed Claims shall mean any and all non-Equipment claims entitled to priority to U.S. Serial No. 09/227,679 and/or 60/070,991, including, without limitation, non-Equipment claims in U.S. Patent Nos. 6,749,687 and 7,105,055.
6,749,687 – In situ growth of oxide and silicon layers
7,105,055 – In situ growth of oxide and silicon layers
The lead technology, named Mears Silicon Technologyâ„¢, or MSTÂ®, is a thin film of reengineered silicon, typically 100 to 300 angstroms (or approximately 20 to 60 silicon atomic unit cells) thick. MSTÂ® can be applied as a transistor channel enhancement to CMOS-type transistors, the most widely used transistor type in the semiconductor industrry.
IPSCIO Record ID: 27927
Atmospheric Plasma technology therefore minimizes the need for special equipment, reduces operating costs, and, in turn, increases the applicability of plasma. Such plasma is the fourth state of matter and is a technology in its infancy. As a fundamental science unto itself, Atmospheric Plasma is a potential source for a multitude of applications and products. Fundamental technology forms such as transistors, lasers, and related innovations have provided a basis for revolutionary advancements in applications and products.
The patent portfolio protects the plasma platform technology as well as specific applications that include air filtration and purification, DNA extraction, decontamination and sterilization, aerodynamics, materials surface cleaning and textile processing. The breakthrough plasma technology electrically breaks down air creating highly reactive chemical species. This resulting unique plasma generated chemistry is then used to produce the desired effects such as alteration of material properties, destruction of microorganisms, and destruction of odor-causing chemicals.
IPSCIO Record ID: 280974
With this interim patent license, the Licensor grants to the German Licensee a non-exclusive, non transferable worldwide license under the Patent Rights, without the right to grant sublicenses, to make, have made, use, sell, offer for sale, and import Licensed Products during the Term of this Agreement.
Licensed Products shall mean drying equipment, wet bench products, and replacement parts .
Dryer Module shall mean drying equipment in an enclosed, self-contained, physically separate unit which performs rinsing and drying but no chemical treatment operation.
IPSCIO Record ID: 189170
The Optioned Technologies Patent Rights are for Liquid Silane-Based Compositions and Methods for Producing Silicon-Based Materials; Liquid Silane-Based Compositions and Methods of Fabrication; Method and Apparatus for Aerosol Direct Write Printing; Synthesis of Silicon Containing Materials Using Liquid Hydrosilane; Compositions through Direct Injection; Silicon Materials from the Processing of Liquid Silanes and Heteroatom Additives; Synthesis of SI-Based Nano-Materials using Liquid Silanes; Production of 1-Dimensional Supramolecular Assemblies Comprised of Cyclopentasilane and Cyclohexasilane Rings Linked by Atoms, Molecules, and Ions; and Surface Modified Silicon Quantum Dots.
IPSCIO Record ID: 28220
IPSCIO Record ID: 368499
— an exclusive license under Licensed Patents to make, have made, use, sell and import PolyFluorene Based Materials in any and all countries of the world. This license includes process technology relating to the Suzuki Coupling reaction;
— a non-exclusive license under Licensed Patents for all process technology relating to the Suzuki coupling reaction for use in making materials other than PolyFluorene Based Materials in any and all countries of the world;
— a non-exclusive license under Licensor Patents to make, have made, use, sell and import PF Ink Jet Formulations in any and all countries of the world, provided that such Intellectual Property is wholly-owned and free to be licensed as of the date of this Agreement, or for later made inventions, as of the date of the invention;
— a non-exclusive license under Licensor Patents relating to Spiro and IndenoFluorones to make, have made, use, sell or import LEPs containing spiro and indenofluorenes in any and all countries of the world, provided that those patents are wholly-owned and free to be sublicensed as of the date of this Agreement, or for later made inventions, as of the date of the invention; and
— a non-exclusive license under Licensors intellectual property to make test devices for screening and developing new materials.
LEP means light emitting polymer relating to large molecule organic electroluminescent material.
Polyfluorene-Based Material means Polyfluorenes; solid compositions containing Polyfluorenes in an amount of at least 1% by weight; and solutions containing Polyfluorenes not including formulations for ink jetting.
PF Ink Jet Formulations Means solutions containing Polyfluorenes for ink jet application.
OLED displays are expected to be deployed in instrument panels and portable electronics such as mobile phones and personal digital assistants, and eventually larger displays for personal computers and consumer products, where they could overtake liquid-crystal display (LCD) technology in the future.
As an emissive display, LEPs need no backlight, which means they can be thinner and lighter than LCDs, as well as more power-efficient. LEP displays are also brighter with richer color, offering sharp, high-contrast images that can easily be viewed from acute angles. Additionally, LEPs in liquid form are unique in that they can be ink-jet printed on glass and plastic, which is a technology advantage that could significantly change the way displays are produced and open new markets and opportunities.
The field of use is semiconductors and related devices.
IPSCIO Record ID: 203471
Licensed product shall mean a cryogenic receiver front-end device for wireless communications networks which contains a thin film radio frequency filter manufactured using high-temperature superconducting materials and either pulsed energy deposition or pulsed laser deposition. A list of the current Licensed products of Licensee, is set forth. Additional Licensed products may be added to this list by Licensee upon written notice to Licensor.
Licensed equipment shall mean an apparatus performing pulsed energy deposition and/or pulsed laser deposition claimed in the Licensed patent.
IPSCIO Record ID: 5328
IPSCIO Record ID: 3598
IPSCIO Record ID: 230774
Licensed Product means Integrated Circuits that include Bulk CMOS Information, Industry Standard Information, High Performance Device Information, SOI Device Information, or any combination thereof, other than Foundry Products.
Integrated Circuit means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, Integrated Circuit shall include charge-coupled devices (â€œCCDsâ€).
Bulk CMOS Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, and/or (ii) selected by Licensor either for incorporation into an Licensor Bulk CMOS process or otherwise pursuant to this agreement.
Industry Standard Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, or (ii) applicable to Industry Standard CMOS and selected by Licensor either for incorporation into an Licensor Industry Standard CMOS process or otherwise selected pursuant to this agreement.
High Performance Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on substrates, not including SOI Device Information. Bulk CMOS Information or Industry Standard Information.
SOI Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on commercially available SOI Wafers other than Bulk CMOS or Industry Standard Information.
IPSCIO Record ID: 26338
Metals as used in this Agreement include, without limitation, copper, aluminum, chrome and lithium, and composites of one or more metals.
Products as used in this Agreement include, without limitation, flexible composites of metals and films, flexible printed circuits, Multichip Modules, single and several chip packages, batteries and displays for use within the electrical interconnect industry.