Royalty Report: Semiconductors, Fabrication, IC – Collection: 367268

$150.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 20

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 20

Primary Industries

  • Semiconductors
  • Fabrication
  • IC
  • RAM
  • Business Method
  • Technical Know How
  • Electrical & Electronics
  • Lithography
  • Coating
  • Circuits
  • Fiber Optics
  • Integrated Circuits

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 367268

License Grant
Included in this Alliance agreement is a Collaborative Development Plan or CDP.  In the CDP, Licensor grants a worldwide, non-exclusive, non-transferable, license under and to the Licensor Independent Technology solely to the extent necessary for Licensee to carry out its obligations under all phases of this CDP, and to the extent that the Alliance Technology infringes any Intellectual Property Rights retained by Licensor in the Licensor Independent Technology or in the Materials Manufacturing Technology, a worldwide, non-exclusive, nontransferable. perpetual, irrevocable license to license and provide Alliance Technology (excluding Products and or Materials Manufacturing Technology) to any Licensee Manufacturers and OEMs solely to the extent necessary for Licensee to carry out its commercialization objectives as set forth in this CDP.
License Property
Licensor is developing and commercializing semiconductor materials products and technologies, and possesses certain novel, proprietary materials, processes and technologies, in the Field.

This CDP is titled Post Cu CMP Clean.

Active Component means a component whose functional characteristics arc determined by the modulation of one or more electronic, photonic, magnetic, or radio frequency inputs.

HPC technology relates to technology used for the simultaneous parallel or rapid serial design, synthesis, processing process sequencing, process integration, device integration, analysis, or characterization of more than 2 compounds, compositions, mixtures, processes, or synthesis conditions, or the structures derived from such.

HPC-Derived Technology means any data, know-how, materials, compounds, sequences of compounds, methods, processes, or other technology derived through the use of HPC Technology, including but not limited to unit processes, process integration, processing equipment, Critical Parameter Sets, Technology Firewall Sets, device architecture and device integration in the Field.

Licensee HPC Systems means any Licensor tool, hardware, or associated technology, including software provided for use therewith, that enables a user to practice HPC Technology.

Field of Use
This CDP Field is Post Cu CMP Clean of semiconductor Integrated Circuits.

This alliance is to develop specific materials and methods of using such materials, and systems and methods for rapid qualification of materials.

IPSCIO Record ID: 362470

License Grant
Included in this Alliance agreement is a Collaborative Development Plan or CDP.  In the CDP, for the License Grants in this CDP, Licensor grants a worldwide, non-transferable, exclusive license, with right of sublicense as set forth below, in the CDP Field set forth herein, under and to the applicable Alliance technology, but excluding HPC Technology, necessary to develop, make, have made, import, export, sell, offer for sale, and/or otherwise commercialize the Post Cu CMP Clean Products that result from execution of the Development Plan.
License Property
Licensor possesses certain novel, proprietary materials, methods, processes, and technologies for the combinatorial preparation and screening of novel materials, novel process integration, and novel device integration.

This CDP is titled Post Cu CMP Clean.

Active Component means a component whose functional characteristics arc determined by the modulation of one or more electronic, photonic, magnetic, or radio frequency inputs.

HPC technology relates to technology used for the simultaneous parallel or rapid serial design, synthesis, processing process sequencing, process integration, device integration, analysis, or characterization of more than 2 compounds, compositions, mixtures, processes, or synthesis conditions, or the structures derived from such.

HPC-Derived Technology means any data, know-how, materials, compounds, sequences of compounds, methods, processes, or other technology derived through the use of HPC Technology, including but not limited to unit processes, process integration, processing equipment, Critical Parameter Sets, Technology Firewall Sets, device architecture and device integration in the Field.

Licensor HPC Systems means any Licensor tool, hardware, or associated technology, including software provided for use therewith, that enables a user to practice HPC Technology.

Field of Use
This CDP Field is Post Cu CMP Clean of semiconductor Integrated Circuits.

This alliance is to develop specific materials and methods of using such materials, and systems and methods for rapid qualification of materials.

IPSCIO Record ID: 362473

License Grant
The Licensor and Licensee of Japan began working on a development program directed at a Dynamic Random Access Memory (DRAM) and Phase Change Memory (PCM) pursuant to the Demonstration Agreement previously executed, the Demonstration Agreement, and continued to work in these areas pursuant to a Letter Agreement executed by the parties on February 27, 2008.

Licensor grants the Licensee of Japan, within the CDP Fields, a worldwide, exclusive, nontransferable license under and to Licensor Inventions and Joint Inventions and any Intellectual Property Rights to use, make, have made, import, offer to sell, sell, lease and otherwise dispose of the Products, to modify or make derivatives of the CDP Developed Technology, and to exercise the limited sublicense rights.

Exclusivity is lost if Licensee and Licensor stop working together pursuant to this Agreement or any extensions thereof in one of the CDP Fields.  Then, the exclusivity for that CDP Field shall expire.

If Licensee does not maintain an exclusive license in accordance with this agreement, Licensor grants to Licensee, within the CDP Fields, a worldwide, non-exclusive, perpetual, non-transferable license under and to Licensor Inventions and any Licensor Intellectual Property Rights to use, make, have made, import, offer to sell, sell, lease and otherwise dispose of the Products, to modify or make derivatives of the CDP Developed Technology, and to exercise the limited sublicense rights.

If Licensee does not maintain an exclusive license in accordance with this agreement, Licensee and Licensor grants to the other a worldwide, non-exclusive, perpetual, non-transferable license, including sublicense rights, without restrictions under and to each party’s Intellectual Property Rights in Joint Inventions without any right of accounting.

Licensor agrees to grant Licensee a world-wide, non-exclusive and non-transferable license under and to Licensor Background IP, for which Licensor has the right to license without payment of a royalty to a Third Party, that is essential for Licensee, and its Affiliate and Third Party Licensees to exploit Licensor Inventions in Products in the CDP Field.

Licensor will provide access, in conjunction with Licensor’s FTE resources and pursuant to the applicable Development Plan, to Licensor’s internal Dry Workflows, Wet Workflows, physical and electrical characterization capabilities, and Informatics Software (Licensor Tools and Software) to perform the CDP Services (HPC Workflow Subscription and Access Fee).

Licensor grants to Licensee a non-exclusive, non-transferable license to use the Informatics Software solely for the purposes of the CDP.

License Property
Product shall mean a product containing one or more semiconductor integrated circuit memory chips manufactured by or for Licensee, a Licensee Affiliate or Third Party Licensee, including through contract manufacturers, utilizing the CDP Developed Technology,

CDP means a Collaborative Development Program.

Critical Parameter Set or CPS shall mean a combination of the material, material stack, process conditions and process integration resulting from the Collaborative Development Program that meet or have the best chance to meet the specification defined by Licensee.

Dry Workflow shall mean physical vapor deposition tools and atomic layer deposition tools using HPC Technology, including, but not limited to, Licensors P-25, P-35, A-30 and AP-30 systems.

Wet Workflows shall mean fluid based processing tools using HPC Technology, including, hut not limited to, Licensees F-10, F-20 and F-30 systems.

HPC Technology shall mean all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof, without reference to any Licensee Confidential Information, used for the simultaneous, parallel, or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis conditions, or the structures derived from such on a single wafer.

Informatics Software shall mean the Licensor software platform enabling the operation of the Dry and Wet Workflows and the gathering and sharing of CDP related information through a web-based interface.

Field of Use
The Field if use for this Development Program Agreement shall mean technologies, methods and embodiments for materials, processes, apparatus, process integration, and device integration, or any combination thereof, used for the research, development, commercialization or manufacturing of integrated circuits.

This CDP field shall mean solid state DRAM semiconductor integrated circuit memory chips.

IPSCIO Record ID: 367357

License Grant
The parties entered into discussions in March 2007 and signed an LOI in May 2007 to align their interests with respect to the development and sale by Licensor of a workflow for Wets Processing as contemplated in this Agreement.  The Parties entered into the Alliance Agreement and began working on a collaborative development program directed at a cleans application.

This Agreement sets forth terms and conditions under which Licensee may sell to Licensor one or more Wets Workflows, and the terms and conditions under which Licensor may provide related Services.

Licensor grants to Licensee all right, title, and interest in and to Licensee Technology.

License Property
As between the Parties, Licensor shall be the sole owner of all right, title, and interest in and to
– the Licensor Independent Technology,
– Intellectual Property Rights; relating to Materials or Products and methods of using Materials or Products,
– Metrology/Characterization Technology that is not HPC Technology, and
– Materials Manufacturing Technology, and improvements to any of the foregoing (Licensor Technology) derived through Licensors use of the Wets Workflow purchased herein.

As between the Parties, Licensee shall he the sole owner of the Licensee Independent IP, Metrology/ Characterization Technology that is HPC Technology, HPC Technology, and any improvements to any of the foregoing (Licensee Technology).

Agreement WF Compound means any Lead WF Compound or Derivative WF Compound.  Lead WF Compound means a compound or material identified, first synthesized, or discovered in whole or in part through use of any Wets Workflow provided through this Agreement.

Product means a Material that incorporates an Agreement WP Compound or utilizes an Agreement WF Compound in its manufacture and/or methods of using the same.

Equipment means Wets Workflow hardware tools (excluding Informatics Hardware) that may be sold pursuant to this Agreement, conforming to the Specifications set forth in the Purchase Documentation.

HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques)
–  subject to or covered by any Intellectual Property Right owned by Licensee or licensed to Licensee,
–  provided by Licensee to Licensor and
–  used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis; conditions, or the structures derived from such.

Field of Use
The field of use applications include Post-CMP Cleans (Cu); Post Etch Dielectric Contact Clean; TDDB Dielectric Enhancement Layers; All wet solution for HDIS; Reclaim (SiC); HDA replacement, and other related Wets workflow opportunities in the semiconductor industry.

Wets Processing means a set of operations for the development or application of liquid or fluid-based Materials, which Materials are used in semiconductor manufacturing for cleaning, etching, or electro less deposition.

Wets Work flow means the combination of one or more of the following as described in the applicable Quote Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 362471

License Grant
The parties entered into discussions in March 2007 and signed an LOI in May 2007 to align their interests with respect to the development and sale by Licensor of a workflow for Wets Processing as contemplated in this Agreement.  The Parties entered into the Alliance Agreement and began working on a collaborative development program directed at a cleans application.

This Agreement sets forth terms and conditions under which Licensor may sell to Licensee one or more Wets Workflows, and the terms and conditions under which Licensor may provide related Services.

Licensor will grant and hereby grants to Licensee all right, title, and interest in and to said Licensee Technology.  For the Proprietary Rights, between Licensee and Licensor, Licensee shall be the sole owner of all right, title, and interest in and to
–    the Licensee Independent Technology,
–    Intellectual Property Rights; relating to Materials or Products and methods of using Materials or
Products,
–   Metrology/Characterization Technology that is not HPC Technology, and
–   Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

For the License Grant for Informatics Software; HPC Site License, Licensor grants a nonexclusive, nontransferable, license, without the right to sublicense, to use the Equipment and install and execute the Informatics Software identified in the Purchase Documentation on the Equipment and/or Informatics Hardware for which it was purchased and upon which it was installed, for use by Named Users, for the term specified in the Purchase Documentation, solely at the Site, and solely for the purpose of developing and commercializing Materials, Wets Processing, Products, and Materials Manufacturing Technologies in the Field.

For Licensee Improvements Licensor grants a non-exclusive license to Licensee to use any Improvement, other than an Licensor Improvement, on or with any Wets Workflow for which Licensee continues to pay the HPC Site License fee and continues to license the HPC-Enabled Informatics Software.

License Property
As between the Parties, Licensee shall be the sole owner of all right, title, and interest in and to
– the Licensee Independent Technology,
– Intellectual Property Rights; relating to Materials or Products and methods of using Materials or Products,
– Metrology/Characterization Technology that is not HPC Technology, and
– Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

As between the Parties, Licensor shall he the sole owner of the Licensor Independent IP, Metrology/ Characterization Technology that is HPC Technology, HPC Technology, and any improvements to any of the foregoing (Licensor Technology).

Agreement WF Compound means any Lead WF Compound or Derivative WF Compound.  Lead WF Compound means a compound or material identified, first synthesized, or discovered in whole or in part through use of any Wets Workflow provided through this Agreement.

Product means a Material that incorporates an Agreement WP Compound or utilizes an Agreement WF Compound in its manufacture and/or methods of using the same.

Equipment means Wets Workflow hardware tools (excluding Informatics Hardware) that may be sold pursuant to this Agreement, conforming to the Specifications set forth in the Purchase Documentation.

HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques)
–  subject to or covered by any Intellectual Property Right owned by Licensor or licensed to Licensor,
–  provided by Licensor to Licensee and
–  used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis; conditions, or the structures derived from such.

Field of Use
The field of use applications include Post-CMP Cleans (Cu); Post Etch Dielectric Contact Clean; TDDB Dielectric Enhancement Layers; All wet solution for HDIS; Reclaim (SiC); HDA replacement, and other related Wets workflow opportunities in the semiconductor industry.

Wets Processing means a set of operations for the development or application of liquid or fluid-based Materials, which Materials are used in semiconductor manufacturing for cleaning, etching, or electro less deposition.

Wets Work flow means the combination of one or more of the following as described in the applicable Quote Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 362472

License Grant
Licensor grants to Customer all right, title, and interest in and to said Customer Technology, unless otherwise set forth in a separate agreement related to the use of the Dry Workflow purchased hereunder for a customer program that is signed by Customer, Licensor and such customer.

For the License Grant for Informatics Software and HPC Site License, Licensor grants to Customer a non-exclusive, non-transferable, license, without the right to sublicense, to use the Equipment and to use the Informatics Software identified in the Quote on the Equipment and/or Informatics Hardware for which it was purchased and upon which it was installed, for use by Named Users solely for the purpose of developing and commercializing Products in the Field.

For Customer Improvements, Licensor grants a non-exclusive license to Customer to use any Improvement, other than a Licensor Improvement, on or with any Dry Workflow for which Customer continues to pay the HPC Site License fee and continues to license the HPC-Enabled Informatics Software.

License Property
Licensor has developed proprietary tools to enable high productivity combinatorial experimentation and is in the business of selling, leasing and/or licensing such technology.

Product means a compound or material (or composition of compounds and materials) identified, first synthesized, or discovered in whole or in part through use of the Equipment and/or Informatics Software provided through this Agreement and any derivative thereof whether or not the derivative is identified, first synthesized, modified or discovered in whole or in part through use of any Dry Workflow, but does not include materials or compounds developed independent of use of the Dry Workflow and/or methods of using the same.

Customer Independent Technology means all Intellectual Property Rights that is owned, licensed or otherwise controlled by Customer on or prior to the Effective Date; or created, conceived or reduced to practice by Customer employees, contractors or agents without reliance upon, use of or benefit of the Dry HPC Technology, Dry HPC Technology derivatives, Licensor independent IP, or any technology, know-how or technical information provided by or obtained from an Licensor employee, contractor or agent, directly and or indirectly.

Dry HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques) subject to or covered by any Intellectual Property Right owned by Licensor or licensed to Licensor, provided by Licensor to Customer and Licensor used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than 2 compounds, compositions, mixtures, processes, or synthesis conditions, or the structures derived from such. Dry HPC Technology does not include any of the foregoing Techniques to the extent they were used by Customer prior to the Effective Date, created, conceived or reduced to practice by Customer independent of this Agreement, without reliance on or use or benefit of Alliance Technology, Licensor Independent IP, or any technology, know-how or information provided by or obtained from an Licensor employee, contractor or agent, directly and or indirectly.

HPC-Enabled Informatics Software means Informatics Software and Equipment control software that enables Equipment to use Dry HPC Technology. Non-HPC-Enabled Informatics Software means Informatics Software and Equipment control software that operates Equipment without enabling it to utilize Dry HPC Technology. Use of HPC-Enabled Informatics Software at a Site requires an HPC Site License, in addition to a license to use the software.

Licensor Independent IP means all Intellectual Property Rights that are owned, licensed or otherwise solely controlled by Licensor as of the Effective Date; or created, conceived or reduced to practice by Licensor employees, contractors or agents without reliance, use or benefit of Customer Independent Technology or technology, know-how or technical information provided by or obtained from a Customer employee, contractor or agent, directly and or indirectly and including the Dry HPC Technology.

Informatics Software means machine readable object code versions of the software licensed to be used with the Informatics Hardware, and related documentation, together with any Informatics Updates, if any, that may be provided by Licensor to Customer during its license term. Informatics Software may consist of either HPC-Enabled Informatics Software or Non-HPC-Enabled Informatics Software. Informatics Software does not include Third Party Software.

Metrology/Characterization Technology means technology relating to measurements, systems, methods, techniques, test vehicles, synthetic procedures or combination thereof, used to measure materials or processing characteristics or parameters of wafers, wafer samples or other substrates.

Field of Use
The Field means technologies, methods and embodiments for materials, processes, apparatus, process integration, and device integration, or any combination thereof, used for the research, development, commercialization or manufacturing of integrated circuits and photovoltaic cells.

Dry Workflow means the combination of one or more of the following Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 362476

License Grant
The Licensor and Licensee of the Russian Federation are entering a joint development program or JDP,  in which joint development teams from both Parties will utilize Licensor facilities, Dry Equipment, Wet Equipment and Informatics software to speed technology development and dramatically reduce time to market new, high-value products.

All Intellectual Property Rights and Know-How rights arising out of the sole activities of Licensor personnel and not Licensee personnel, on Licensee Projects shall be owned by Licensor.

Licensor grants a non-exclusive, worldwide, perpetual license under such rights to practice such rights in the Field.

As part of the CDP activities, Licensee will provide to Third Party the use of its R&D platform, including the Equipment, and the services of its personnel, collectively CDP Services.  Additionally, in each instance, Licensee will grant licenses to Third Party under certain Intellectual Property Rights or Know-How and may sell, assign or transfer certain Intellectual Property Rights or Know-How, collectively CDP Licenses.

License Property
Licensor is engaged in, among other things, research, design, experimentation, development and commercialization in the area of and using HPC Technology.

CDP means an engagement between Licensee as provider of technology and/or services and Licensor or Third Party as customer and recipient of such technology and/or services, regardless of whether or not Licensee is paid for such engagement in which Licensee will use HPC Technology including Dry Equipment and Wet Equipment, in the Field in any way to test, screen, develop or evaluate technologies or intellectual property pertaining to the deposition, cleaning, stripping, etching, or patterning of chemistries, thin films, coatings or other materials on a stand-alone basis or in integrated devices.

HPC Technology means Intellectual Property Rights and Know-How related to techniques, methodologies, processes, test vehicles, synthetic procedures, technologies, systems, tools, tool configurations, tool designs or combination thereof, used for the simultaneous parallel or rapid serial design, discovery, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of two or more compounds, compositions, mixtures, processes, or conditions, or the structures derived from such.

Field of Use
Field means the field of glass coatings, photovoltaics, power electronics and display.

The Licensee is focused on developing innovative thin-film solutions for the following applications glass coatings, PV, power electronics and displays.

IPSCIO Record ID: 230774

License Grant
The Parties agree to jointly develop semiconductor manufacturing process technology based on Licensor’s “S” high performance technology roadmap on commercially available wafers that meet the requirements (referred to as Strategic Technology Objectives) in accordance with the schedule (hereinafter referred to as Development Schedule). The Parties agree that the process technology so developed, shall be high performance, leading edge technology and, to the extent consistent with the Strategic Technology Objectives, shall be cost efficient. Any modification to such Strategic Technology Objectives or Development Schedule requires the mutual agreement of the Parties. For the avoidance of doubt, none of the Process Development Projects shall include the development of i) Proprietary Tools, ii) Packaging Technology, iii) Mask Fabrication and Photoresist Technology, iv) Memory, v) SiGe Technology, vi) Chip Designs, or vii) Post-Silicon Devices.
License Property
Semiconductor Product means a component that contains an Integrated Circuit on a single or multichip module that incorporates a means of connecting those Integrated Circuits with other electronic elements (active or passive) and/or means to make external electrical connections to such elements, but which excludes any means for a user to operate the functions therein (e.g., buttons, switches, sensors).

Licensed Product means Integrated Circuits that include Bulk CMOS Information, Industry Standard Information, High Performance Device Information, SOI Device Information, or any combination thereof, other than Foundry Products.

Integrated Circuit means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, Integrated Circuit shall include charge-coupled devices (“CCDs”).

Bulk CMOS Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, and/or (ii) selected by Licensor either for incorporation into an Licensor Bulk CMOS process or otherwise pursuant to this agreement.

Industry Standard Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, or (ii) applicable to Industry Standard CMOS and selected by Licensor either for incorporation into an Licensor Industry Standard CMOS process or otherwise selected pursuant to this agreement.

High Performance Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on substrates, not including SOI Device Information. Bulk CMOS Information or Industry Standard Information.

SOI Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on commercially available SOI Wafers other than Bulk CMOS or Industry Standard Information.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 286116

License Grant
For Evaluation, Licensor grants to the Licensee of the Netherlands a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to the Evaluation Software, Specifications and Evaluation Circuit Designs, to use and reproduce the Evaluation Software and Specifications solely to conduct evaluation testing of the Products; and use the Evaluation Circuit Designs solely to conduct evaluation testing of the Products.

For Manufacturing, Licensor grants a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to the IC Designs, IC Design Files, Mask Tooling Sets, Manufacturing Test Circuit Designs and Manufacturing Test Software, to make and have made the Products solely for sale to Customers pursuant to this Agreement;  use and reproduce the IC Design Files to manufacture and have manufactured the Mask Tooling Sets solely for use in accordance with this Agreement; use the Mask Tooling Sets to manufacture and have manufactured Products solely for sale, either on a standalone basis or bundled with other Licensee semiconductor products, to Customers solely in accordance with this Agreement, use the Manufacturing Test Circuit Designs solely to test the functionality of Products manufactured in accordance with this Agreement, and use and reproduce the Manufacturing Test Software solely to test the functionality of Products manufactured in accordance with this Agreement.

For Sales by Licensee,  Licensor grants a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to IC Design and IC Design File, to offer for sale, sell, and import Products, either on a standalone basis or bundled with other Licensor semiconductor products, solely in accordance with this Agreement.

License Property
Licensor will design the foregoing integrated circuits and develop certain hardware and software to help bring such integrated circuits into production, and will deliver and license a GDSII design file for the same to  Licensee of the Netherlands for Licensee to manufacture and sell such integrated circuits to customers of Licensee.

Licensor is a fabless semiconductor company that designs, builds, or has built on its behalf, and sells complex, highly integrated systems-on-a-chip radio frequency integrated circuits for consumer broadband and entertainment markets.

IC Design means the integrated circuit design developed by Licensor pursuant to this Agreement.

IC Design File means the GDSII database file containing the IC Design information necessary to manufacture the Mask Tooling Set.

Mask Tooling Set means the collection of masks used to manufacture the layers of Products, or any portion of a Product.

Product means a radio frequency integrated circuit Manufactured by Licensee, or on behalf of Licensee, that conforms to the IC Design.

Evaluation Software means the software developed by Licensor pursuant to this Agreement to evaluate the functionality of Products relative to the Specifications, in object code only.

Reference Design means the system level circuit board design, including a Product, a demodulator and an MPEG decoder, developed by Licensee pursuant to this Agreement to demonstrate the functionality of the Products.

Field of Use
The field of use is for a radio frequency integrated circuit to be incorporated into a Satellite Single Tuner.

Licensee is a global independent semiconductor company which designs, develops, manufactures and markets a broad Satellite Single Tuner means a device that enables the selection and frequency conversion of one stream of information that is disseminated electro-magnetically via radio frequency transmissions from a satellite after block frequency conversion to the frequency range of 9 50MHz to 2150 MHz range of integrated circuits and discrete devices based on semiconductors used in a wide variety of microelectronic applications, including telecommunication systems, computer systems, consumer products, automotive products and industrial automation and control systems.

IPSCIO Record ID: 204349

License Grant
Licensor grants under their respective trade secret/know-how rights in and to Background Know-How that becomes part of Specific Results a non-exclusive, perpetual, worldwide, irrevocable license, to use such Background Know-How for the purpose of researching, developing, engineering, manufacturing, using, marketing, selling, servicing and otherwise disposing of SOI Integrated Circuits other than Foundry Products, Integrated Circuits that combine Bulk CMOS and SOI Device Information other than Foundry Products, or Bulk CMOS products other than Foundry Products. AMD shall have no obligation under this Agreement to pay any royalty for the licenses set forth.

Licensor grants to Licensee, and Licensee grants to Licensor, under their respective copyright rights in and to Background Know-How that becomes part of Specific Results, a non-exclusive, perpetual, worldwide, irrevocable license to copy documentation and other written expression, to make derivative works of such written expression, to distribute such documentation and derivatives, and to execute, display, and perform.

Licensor grants to Licensee, and Licensee grants to Licensor, under their respective mask work rights in and to Background Know-How that becomes part of Specific Results, a non-exclusive, perpetual, worldwide, irrevocable license to use any process-related mask design information provided to a Process Development Project and create derivative works thereof, as reasonably necessary for the licensed Parties to carry out the license rights. Unless otherwise authorized, this right shall not include any rights to utilize any product design information in such masks.

License Property
Licensor has been developing leading edge semiconductor manufacturing processes with other parties.

The Foundry Product shall mean an SOI. Integrated Circuit wherein all the following conditions are met
– the design, or masks and/or mask build data, for such SOI Integrated Circuit product are provided to a Party from a Third Party;
– such Party played no substantial role in any phase of the design of such product; and
– such Party is contractually bound to manufacture such product solely for, and to sell such product solely to, such Third Party or its distributor or other recipient solely for the benefit of such Third Party.

Field of Use
This agreement is for the integrated circuit industry.

IPSCIO Record ID: 211882

License Grant
Licensor grants to the Singapore Licensee a non-exclusive license under the Licensors Licensed Patents
– to make Licensees Licensed Products only in Singapore and one Licensee Elected Country;
– to use, import, and lease, offer for sale, sell or otherwise transfer Licensees Licensed Products worldwide;
– to use any apparatus in the manufacture or testing of Licensee Licensed Products and to practice any method or process in such manufacture or testing of Licensees Licensed Products; and
– to have Licensees Licensed Products made in whole or in part by another manufacturer for the use and/or lease, offer for sale, sale or other transfer by Licensee only when the designs and specifications for such Licensees Licensed Products were provided by Licensee to the other manufacturer, whether developed by Licensee or received by Licensee from customers to whom the Licensed Products are to be sold.
License Property
The Licensed Products shall mean Semiconductor Apparatus.

Semiconductor Apparatus shall mean Semiconductor Material, Semiconductor Device, Semiconductor Circuit, Integrated Circuit and/or Semiconductor Memories and any combination of such apparatus with other such apparatus.

'Integrated Circuit' shall mean an integral unit including a plurality of active and/or passive circuit elements formed at least in part of Semiconductor Material and associated on, or in, one substrate comprising the first level of packaging for such elements; such unit forming or contributing to the formation of a circuit for performing electrical or electronic functions.

'Semiconductor Circuit' shall mean a circuit in which one or more Semiconductor Devices are interconnected in one or more paths (including passive circuit elements, if any) for performing fundamental electrical or electronic functions and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Device' shall mean a device and any material therefor, including but not limited to device structures such as transistors, diodes, capacitors, resistors, conductors and dielectrics, comprising a body of one or more Semiconductor Materials and one or more electrodes associated therewith and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Material' shall mean any material whose conductivity is intermediate to that of metals and insulators at room temperature and whose conductivity, over some temperature range, increases with increases in temperature. Such materials shall include, but not be limited to, refined products, reaction products, reduced products, mixtures and compounds.

'Semiconductor Memory' shall mean any instrumentality or aggregate of instrumentalities, which instrumentality or aggregate is designed only for storing digital information, intelligence or data by selectively setting or presetting detectable states in Semiconductor Material forming at least a part of such instrumentality or aggregate, such instrumentality or aggregate may include powering means and auxiliary and/or support circuits (such as regeneration means, true-complement generations means, address decoding means, sensing means and selection means) to control the flow of such information, intelligence or data into and out of such Semiconductor Memory.

Field of Use
This agreement is for the semiconductor industry.

IPSCIO Record ID: 211905

License Grant
Licensor grants to Licensee a non-transferable, non-exclusive, worldwide right and license under Licensors applicable trade secret, know-how and copyrights in the Licensed Products and Update(s)
to do any or all of the following
-Use the Licensed Products and Updates to develop, derive or otherwise create one or more Designs and mask sets that embody such Designs, including but not limited to the right to execute, distribute internally, and reproduce the Licensed Products and Updates in support of such use, provided such Designs are manufactured at Licensees Manufacturing Site(s);
– lease, sell, or otherwise transfer semiconductor products instantiating such Designs in any form or level of assembly (by way of example, in wafer or single chip form as bare die, in chip packages, or on printed circuit boards) to third parties;
– Use the Licensed Products and Updates as reasonably necessary to carry out the activities set forth;
– distribute the Front-End Views/Back-End Views to third party entities to internally use the Front-End Views and internally use the Back-End Views.
License Property
Licensed Product(s) means the products described in the Product Schedule, and any Updates thereto, whether in object code, reconfigurable binary, ASCII data, binary data or any other form. Licensed Product(s) includes the Back-End Views, Front-End Views and Internal Use Documentation.

Required Data means semiconductor manufacturing processes.

Wafer shall mean a combination of die produced from a single manufactured semiconductor wafer, which die in whole or in part are made up of, incorporate or are based upon any portion of a Design.

Licensor is a leading developer of high performance, high density and low power embedded memory, standard cell and input/output intellectual property components used for the design and manufacture of complex integrated circuits.

Field of Use
This agreement is for the semiconductor and related device industry.

IPSCIO Record ID: 203510

License Grant
Licensor grants a non-exclusive, perpetual, worldwide, irrevocable license to use the Bulk CMOS Information and portions of Specific Results other than those portions which Licensee uses exclusively to produce the highest performing thirty percent (30%} of wafers manufactured in the applicable technology generation (e.g. 45nm, 32nm) in any given quarter for the purpose of researching, developing, engineering and manufacturing up to one thousand (1000) 300mm wafers, other than SOI Wafers, per week in 65nm, 45nm and/or 32 nm technology, including the right to sell, market, distribute or otherwise dispose of such wafers to Third Parties, provided that such licensed wafers manufactured using the aforementioned portions of Specific Results shall not include high performance microprocessors intended for use in high performance enterprise Servers.

After September 30, 2003, Licensee may exercise the sublicensing option. If Bump Technology is established as a Process Development Project,  Licensor grants Licensee the right to disclose and sublicense the process technology developed by Licensor and Licensee under this Agreement including SOI Device Information, High Performance Device Information and Bulk CMOS and Industry Standard CMOS Information and Pre-TO Information, subject to the following AMO may sublicense no more than two (2) JMP for a maximum of a total of two (2) joint manufacturing facilities with a combined maximum of 20,000 300 mm wafers per month for such technology consumed by, or supplied to the Joint Manufacturing Partners (JMP).

License Property
The technology is leading edge semiconductor manufacturing processes.

The Licensed Product means Integrated Circuits that include Bulle CMOS Information, Industry Standard Information, High Performance Device Information (excluding eDRAM Technology), SOI Device Information (excluding eDRAM Technology), or any combination thereof, other than Foundry Products.

“Chip Design(s)” means any design of one or more Integrated Circuits and/or Semiconductor Products, including (by way of example and not limitation) random access memory (RAM)s, read only memory (ROM)s, microprocessors, ASICs and other logic designs, and analog circuitry; provided, however, that “Chip Designs” shall not include (i) alignment marks or test structures and associated layout and data used in the Process Development Projects for process development, (ii) process kerf test structures, layout, and data of the test chip(s) (including SRAM macro cells and eDRAM macros) as well as such test chips themselves used for the development work of the Process Development Projects unless specifically excluded (for the avoidance of doubt, this phrase means that such structures or macros that are specifically designated as owner proprietary shall not be considered Specific Results), (iii) other product designs (including eDRAM macros) as mutually agreed by the Parties to be used as qualification vehicles in the Process Development Projects, or (iv) ESD protection devices as used in the Project Test Sites and ESD groundrules and models as defined in the Design Manual. For the avoidance of doubt, all of (i) through (iv) above shall be treated as Specific Results to the extent utilized in a Process Development Project.

“CMOS 10S” means a 90 nanometer CMOS logic fabrication process.

“Embedded DRAM” or “eDRAM” means a device that either (i) primarily carries out logic functions, and includes one or more dynamic random access memory (DRAM) cells embedded within logic circuitry on the same semiconductor substrate, or (ii) primarily carries out memory functions, and includes one or more DRAM cells in combination with a static random access memory (SRAM) array on the same semiconductor substrate (including an array of SRAM cells linked with bit lines, word lines, sense amplifiers and decoders).

“Integrated Circuit” means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, “Integrated Circuit” shall include charge-coupled devices (“CCDs”).

“Lithography” shall mean those aspects of Background Know-How and Specific Results directed to (a) process technology-dependent ground rules or process technology-dependent special rules for shapes replication as developed by the Parties for the generation of photomasks used for development and qualification of a semiconductor process technology in the Process Development Projects, (b) resolution enhancement techniques specifically created pursuant to the Process Development Projects to generate mask build data, (c) such photomasks themselves and the data files used therefor as are used in the Process Development Projects, (d) lithography process sequence as utilized in the Process Development Projects, and (e) mask data generation sequence as utilized in the Process Development Projects.

Field of Use
This agreement is for semiconductor industry.

IPSCIO Record ID: 215252

License Grant
For the technology, Licensor shall grant a worldwide, personal, non-exclusive, non-transferable, non-assignable and revocable right and license to use, without the right to sublicense, transfer or convey such rights, in whole or in part, Licensors Technology, for the purposes of designing, modifying,   manufacturing, having manufactured, marketing, selling and otherwise disposing of integrated circuits which embody or are based upon part or all of Licensor Technology licensed by Licensor to Licensee and implemented in Designated Process Technology and which are not pin-compatible with Licensor Chips, in Licensee products, as components or Modules.

For the software, Licensor shall grant a world-wide, personal, non-exclusive, non-transferable, non-sublicenseable, non-assignable and revocable right and license, without any right to market, sublicense or distribute, to use, copy, and modify for Internal Use only and only with Licensor Chips in Designated Process Technology and/or Licensor Systems,  certain Licensor Source Code Software as set forth on the Source Code Use License Agreement.

Licensor shall grant a world-wide, personal, non-exclusive, non-transferable, fee-bearing, non assignable and revocable right and license to use for Internal Use and for sublicensing, copy for  Internal Use and for sublicensing, market, grant non-exclusive sublicenses for use and distribute  certain Licensor Binary Software,  as set forth on the Binary Software License Agreement all for use  only with Licensee Chips in Designated Process Technology and/or Licensor-based Systems.

For the Architecture License Software, Licensor shall grant a worldwide, personal, non-exclusive, non-transferable, non-sublicenseable, non-assignable and revocable right and license without any right to market, distribute or sublicense, to use, copy and modify, all for Internal Use only and only with Licensor Systems, certain Licensor Architecture License Software.

For Documentation rights, Licensor shall  grant a worldwide, personal, non-exclusive, fully-paid, non-transferable, non-assignable and revocable right and license, to use, modify, copy and distribute,  all for Internal Use only, without any right to market, copy or distribute outside of Licensee, Licensee Architecture License Documentation as set forth.

License Property
The Designate Process Technology means any technology for the design and manufacture of integrated circuit products that incorporates a type of circuit structure containing both p-channel and  n-channel MOS devices on the same silicon substrate (CMOS OR Bi-CMOS).

The licensed property includes Instruction Set and System Performance Simulator (SABLE), and Architecture Specification (superscalar) R4000 and R5000.

MIPS ARCHITECTURE – means the organization, structure, and content of any CPU or CPU support chips, or portions thereof, as designed and enhanced by MIPS, including but not limited to, MIPS Instruction Set (for example, the architecture set forth in the book entitled, MIPS RISC ARCHITECTURE) and interface specifications.

Field of Use
This agreement is for the integrated circuit industry.

IPSCIO Record ID: 286107

License Grant
Licensor hereby grants to Chinese Licensee a personal, royalty-bearing, internal, non-transferable, non-sublicensable, license under Licensors Intellectual Property Rights in and to the Licensor Product Technology to
(a) make (but not have made), in each case solely at the Licensee Facility, Licensed Products;
(b) sell and offer for sale Licensed Products, and deliver such Licensed Products solely to customers in Greater China for end use in products solely for sale and use in Greater China;
(c) make a reasonable number of copies of the Licensor Product Technology, other than the Licensor Maskworks, as necessary to exercise the license above and to test the Licensed Products; and
(d) Subject to Licensors prior written approval to use, copy and distribute certain non-confidential Licensor documents in connection with the marketing and sale by Licensee of Licensed Products.
License Property
Licensor Product Technology means the Licensor Maskworks, and copies of any Licensor Product information and specifications, testing requirements and procedures and any other Technology, in each case provided by Licensor to Licensee under this Agreement for purposes of Product Qualification, or the manufacturing and testing of Licensor Products and/or Licensed Product under the Product License Agreement.

Licensed Products means those semiconductor devices manufactured by Licensee using the Licensor Maskworks and other Licensor Product Technology that are sold in wafer, die or packaged form as part of a Licensee product, excluding in all cases any Licensor Product.

Licensor Maskworks means those specific Maskworks sets provided or to be provided by Licensor to Licensee as set forth in this agreement to include but not limited to Ultratech-based Mask Sets and Nilon-based Mask Sets.

Intellectual Property Rights means the United States and foreign rights associated with the following (i) patents and patent applications (Patent Rights); (ii) copyrights, copyright registrations and applications therefor (Copyrights); (iii) Maskworks, Maskwork registrations and applications therefor (Maskwork Rights); (iv) trade-secret rights and all other trade secret or similar proprietary rights in confidential business or technical information (Trade Secret Rights); and (v) any similar, corresponding or equivalent rights to any of the foregoing any where in the world. For purposes of this Agreement, Intellectual Property Rights excludes any United States and foreign rights associated with Trademarks.

Licensor is engaged in the business of designing, manufacturing and marketing high performance, analog integrated circuits that are used primarily by original equipment manufacturers operating in the computing, consumer electronics, communications and networking infrastructure markets.

Field of Use
This agreement covers foundry manufacturing, product licenses, process technology transfers and fab equipment sales.

Licensee is an integrated circuit design company focused on integrated circuits used in audio/video equipment and other consumer products in China.

IPSCIO Record ID: 248877

License Grant
Licensor hereby grants to Licensee under Licensor Technology an irrevocable, worldwide, nonexclusive, nontransferable (except to Licensee Affiliates) license to make, have made, use, lease and sell Joint Products and Licensee Licensed Products.

Licensor hereby grants to Licensee and its Affiliates a non-exclusive, nontransferable, irrevocable license under the Licensor Licensed Patent Claims to make, have made, use, lease, sell, offer for sale, import, and otherwise transfer Joint Products and Licensee Licensed Products, solely to the extent necessary to exercise its licensed rights as set forth.

Licensor hereby grants to Licensee under the Licensor Tools, an irrevocable, nonexclusive, worldwide and royalty-free license to use, execute, display and perform such Licensee Tools or Licensor Tools, as the case may be, only for the purpose of developing, maintaining, or implementing a deliverable in a Statement of Work and for developing, maintaining and implementing Joint Products, Licensee Licensed Products and Licensor Licensed Products, as the case may be, subject to the obligations with respect to Confidential Information as set forth in this Agreement.

The Parties agree to cooperate on Joint Projects for the design of certain Joint Products useful in Transport Layer Applications. Each Joint Project or other development work to be performed by the Parties hereunder shall be the subject of a Statement of Work hereto. Each Statement of Work will establish the specifications for the Joint Product(s), a detailed plan for the conduct of the work and the schedule for task completion, a staffing commitment for each Party, the deliverables, including technology, to be provided by each Party for use in the Joint Project, and the documentation and other output requirement for the Joint Project results. Each Statement of Work will set forth a budget for the Design Costs for the Joint Project described therein.  The actual Design Costs will be shared by the Parties equally. In the event of a conflict between the provisions of a Statement of Work and the provisions of this Joint Development Agreement, the provisions of the Statement of Work will prevail.

License Property
Licensee Licensed Product means any integrated circuit, chip set, module, or other item, including packages and control software therefor, having all or any portion of its design based on or derived from Licensor Technology or the Joint Technology but which Licensee Licensed Product is not itself a Joint Product.

Joint Product means an Integrated Circuit, chip set, module or board or any other item specified on a Statement of Work to be jointly developed by the Parties hereunder.

Integrated Circuit means an integral unit including a plurality of active and passive circuit elements formed at least in part of semiconductor material arranged on or in a single chip.

Transport Layer Application means high performance transceivers connecting data communications and telecommunications equipment to a fiber optic infrastructure. Examples include  10Gb Ethernet, OC192 10Gb Sonet, and OC768 40Gb Sonet applications.

Invention means any idea, design, concept, technique, invention, discovery or improvement, whether or not patentable, made solely or jointly by one or more employees or consultants of either Licensor or Licensee, provided that either the conception or reduction to practice occurs in the performance of work under a Joint Project.

Field of Use
This agreement pertains to the telecommunication industry relating in silicon germanium technology design and production and in microcontroller designs and technologies for Transport Layer Applications.

IPSCIO Record ID: 293482

License Grant
The Parties wish to settle, dismiss, and terminate the Pending Proceedings and grant each other certain rights and releases under their respective patents pursuant to the terms and conditions of this Agreement.

The Dutch Licensor grants to the Japanese Licensee, under the Licensor Licensed Patents, retroactive to the Effective Application Date of each Licensor Licensed Patent, a non-exclusive, non-sublicensable, non-transferable license, only during the Term, to (a) make, use, including use with patterns or masks for processing substrates such as wafers, Sell, offer to Sell, import and export Licensee Licensed Products anywhere in the world, (b) have Licensee Licensed Products made by its manufacturers anywhere in the world, provided that, solely for purposes of this clause (b) and such have made right is conditioned upon (i) such manufacturers making the Licensee Licensed Products in accordance with specifications provided by a Licensee Grantee Entity, and (ii) such Licensee Licensed Products not being off the shelf products offered for Sale by or on behalf of such manufacturer to Persons other than Licensee Grantee Entities, (c) practice any method or process anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold, and (d) make, have made, and use, including use with patterns or masks for processing substrates such as wafers, any tool, software, machine, or other apparatus anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold.

License Property
Licensee Licensed Products means
(a) Lithography Equipment and Lithography Components, and, in each case, all applications therefor, and
(b) Digital Cameras and all applications therefor; provided, however, that Licensee Licensed Products exclude (i) Licensee Excluded Products and (ii) Components that are solely for use in Licensee Excluded Products. For the avoidance of doubt, Lithography Equipment, Lithography Components, and Digital Cameras are licensed in their entirety, including any Third Party Components thereof. Without limiting the generality of the foregoing, as of the Effective Date, Licensee Licensed Products include Licensee’s and its Grantee Entities’ products within the following product lines NSR series, FX series, LithoBooster, D series, Z series, COOLPIX series, and KeyMission series.

Licensor Licensed Products means Lithography Equipment and Lithography Components, and, in each case, all applications therefor; provided, however, that Licensor Licensed Products exclude (a) Licensor Excluded Products and (b) Components that are solely for use in Licensor Excluded Products.

Lithography Components means, individually and collectively, Components for use in Lithography Equipment, including (a) separately installed Components of any Lithography Equipment, (b) any optical elements, modules and systems, including illumination optical systems, projection optical systems, manipulation devices and mounting means of any Lithography Equipment, (c) any Components integrated in any Lithography Equipment, (d) materials for use in, and solely to the extent they are for use in, the operation of any Lithography Equipment, such as fluids and gases, (e) any software installed in such Lithography Equipment that is used to operate or control such Lithography Equipment, solely to the extent it is for use in the operation or control of Lithography Equipment; including where such Lithography Equipment uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers; and (f) processes, materials and devices for designing, manufacturing, assembling, adjusting and qualifying any of the items described above; provided, however, that Lithography Components shall not include masks, resists, or substrates themselves. Notwithstanding the foregoing, Lithography Components include any entire standalone assembly of a tool or machine, where a standalone assembly of a tool or machine means an assembly that is not included in any Lithography Equipment, solely for (i) measuring either or both alignment marks on a wafer and the topography of a wafer, and (ii) using such measurements solely to calculate feedforward corrections for wafer stage positioning in an Immersion Lithography System, which, for the avoidance of doubt, includes Licensee’s LithoBooster Standalone Alignment Station as and in the form marketed by Licensee as of the Effective Date. For the avoidance of doubt, Lithography Components does not include, by way of examples only, the products of Licensor’s Applications Business Lines, including Licensor’s Yieldstar line of products and including the products of Licensor’s HMI and Brion businesses, in each case, as and in the form such products are marketed by Licensor and its Grantee Entities as of the Effective Date.

Lithography Equipment means any tool or machine for forming or transferring a pattern on or onto a substrate by Lithography for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements to any of the foregoing, including where such tool or machine uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers, or performs maskless Lithography; provided, however, that Lithography Equipment shall not include masks, resists, or substrates themselves. For the avoidance of doubt, except where expressly indicated otherwise in this Agreement, Lithography Equipment includes EUV Lithography Equipment and FPD/Large Area Substrate Equipment.

“Digital Camera” means a complete digital camera or digital camera body for personal or professional photography (including video) use. “Digital Camera” does not include microscopes, medical imaging equipment, or stand-alone lenses.

“EUV Lithography Equipment” means Lithography Equipment that performs Lithography using radiation with wavelengths of 20 nanometers or less, and all Components thereof.

“FPD/Large Area Substrate Equipment” means Lithography Equipment (a) for the manufacture of flat panel displays, or (b) for exposing large area substrates, other than semiconductor wafers, having a dimension greater than 500 mm along any dimension.

Field of Use
The field of use is Lithography and optical equipment  for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements.

IPSCIO Record ID: 293178

License Grant
The Parties wish to settle, dismiss, and terminate the Pending Proceedings and grant each other certain rights and releases under their respective patents pursuant to the terms and conditions of this Agreement.

The Licensor of Japan grants to the Dutch Licensee, under the Licensor Licensed Patents, retroactive to the Effective Application Date of each Licensor Licensed Patent, a non-exclusive, non-sublicensable, non-transferable license, only during the Term, to make, use, including use with patterns or masks for processing substrates such as wafers, Sell, offer to Sell, import and export Licensee Licensed Products anywhere in the world,  have Licensee Licensed Products made by its manufacturers anywhere in the world, provided that, solely for purposes of this clause,  such manufacturers making the Licensee Licensed Products in accordance with specifications provided by a Licensee Grantee Entity, and such Licensee Licensed Products not being “off the shelf” products offered for Sale by or on behalf of such manufacturer to Persons other than Licensee Grantee Entities or Zeiss Grantee Entities,  practice any method or process anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold, and make, have made, and use,  including use with patterns or masks for processing substrates such as wafers any tool, software, machine, or other apparatus anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold.

License Property
Licensor Licensed Products means
(a) Lithography Equipment and Lithography Components, and, in each case, all applications therefor, and
(b) Digital Cameras and all applications therefor; provided, however, that Licensor Licensed Products exclude (i) Licensor Excluded Products and (ii) Components that are solely for use in Licensor Excluded Products. For the avoidance of doubt, Lithography Equipment, Lithography Components, and Digital Cameras are licensed in their entirety, including any Third Party Components thereof. Without limiting the generality of the foregoing, as of the Effective Date, Licensor Licensed Products include Licensor’s and its Grantee Entities’ products within the following product lines NSR series, FX series, LithoBooster, D series, Z series, COOLPIX series, and KeyMission series.

Licensee Licensed Products means Lithography Equipment and Lithography Components, and, in each case, all applications therefor; provided, however, that Licensee Licensed Products exclude (a) Licensee Excluded Products and (b) Components that are solely for use in Licensee Excluded Products.

Lithography Components means, individually and collectively, Components for use in Lithography Equipment, including (a) separately installed Components of any Lithography Equipment, (b) any optical elements, modules and systems, including illumination optical systems, projection optical systems, manipulation devices and mounting means of any Lithography Equipment, (c) any Components integrated in any Lithography Equipment, (d) materials for use in, and solely to the extent they are for use in, the operation of any Lithography Equipment, such as fluids and gases, (e) any software installed in such Lithography Equipment that is used to operate or control such Lithography Equipment, solely to the extent it is for use in the operation or control of Lithography Equipment; including where such Lithography Equipment uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers; and (f) processes, materials and devices for designing, manufacturing, assembling, adjusting and qualifying any of the items described above; provided, however, that Lithography Components shall not include masks, resists, or substrates themselves. Notwithstanding the foregoing, Lithography Components include any entire standalone assembly of a tool or machine, where a standalone assembly of a tool or machine means an assembly that is not included in any Lithography Equipment, solely for (i) measuring either or both alignment marks on a wafer and the topography of a wafer, and (ii) using such measurements solely to calculate feedforward corrections for wafer stage positioning in an Immersion Lithography System, which, for the avoidance of doubt, includes Licensor’s LithoBooster Standalone Alignment Station as and in the form marketed by Licensor as of the Effective Date. For the avoidance of doubt, Lithography Components does not include, by way of examples only, the products of Licensee’s Applications Business Lines, including Licensee’s Yieldstar line of products and including the products of Licensee’s HMI and Brion businesses, in each case, as and in the form such products are marketed by Licensee and its Grantee Entities as of the Effective Date.

Lithography Equipment means any tool or machine for forming or transferring a pattern on or onto a substrate by Lithography for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements to any of the foregoing, including where such tool or machine uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers, or performs maskless Lithography; provided, however, that Lithography Equipment shall not include masks, resists, or substrates themselves. For the avoidance of doubt, except where expressly indicated otherwise in this Agreement, Lithography Equipment includes EUV Lithography Equipment and FPD/Large Area Substrate Equipment.

Field of Use
The field of use is Lithography and optical equipment  for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements.

IPSCIO Record ID: 6727

License Grant
The Parties have agreed to the joint development of semiconductor apparatus and processes relating to plating technology for advanced packaging and integration solutions in semiconductor processing and manufacturing. The Licensor has granted a license under its intellectual property rights to develop, make, have made and sell certain products.
License Property
Packaging Technology means any process, procedure, software, or hardware tools used in the packaging of Integrated Circuit products into single-chip packages, multi-chip packages, or any other higher levels of assembly.

IPSCIO Record ID: 8621

License Grant
The University hereby grants to the Licensee an exclusive as to all parties, including the University, world-wide, transferable license in the Field.

The Licensee was granted certain rights to technology from the University regarding aspects of semiconductors technology.  The Licensee restructure its license agreement of April 8, 2003 with the University. The parties confirmed that the licenses granted pursuant to the License Agreement are in full force and are irrevocable.

While the maintenance fee provisions of the License Agreement remain unchained, the parties agreed to restructure the payment provisions by reducing the royalty payment on amounts received from unaffiliated third parties in respect of the exploitation of the Intellectual Property defined in the License Agreement.

License Property
“Product” means any optoelectronic component or device for any product or any process in the Field, whose manufacture, use, sale or import would, absent the license granted to OPEL hereunder, infringe one or more claims of the Patent Rights. Product, as that term is defined herein shall not include products used in customer and strategic association or partner alpha or beta tests, samples and prototypes.
Field of Use
“Field” means all optical, electronic, and optoelectronic integrated circuit applications, including but not limited to components and devices for communications, computing, and imaging.

Licensee is the developer of the POET (Planar OptoElectronic Technology) platform for monolithic fabrication of integrated circuit devices containing both electronic and optical elements on a single semiconductor wafer. It is combining electronics and optics onto a single chip for massive improvements in size, power, speed and cost. The Licensee's core principles have been in development at the University. The Licensee has developed a proprietary process that addresses the deficiencies of speed, size, integration, power and cost efficiency associated with current semiconductor manufacturing technologies.  The planar optoelectronic technology (POET) platform for monolithic fabrication of integrated electronic and optical devices on a single semiconductor wafer.

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