Royalty Report: Fabrication, Semiconductors, IC – Collection: 293482

License Grant

The Parties wish to settle, dismiss, and terminate the Pending Proceedings and grant each other certain rights and releases under their respective patents pursuant to the terms and conditions of this Agreement.

The Dutch Licensor grants to the Japanese Licensee, under the Licensor Licensed Patents, retroactive to the Effective Application Date of each Licensor Licensed Patent, a non-exclusive, non-sublicensable, non-transferable license, only during the Term, to (a) make, use, including use with patterns or masks for processing substrates such as wafers, Sell, offer to Sell, import and export Licensee Licensed Products anywhere in the world, (b) have Licensee Licensed Products made by its manufacturers anywhere in the world, provided that, solely for purposes of this clause (b) and such have made right is conditioned upon (i) such manufacturers making the Licensee Licensed Products in accordance with specifications provided by a Licensee Grantee Entity, and (ii) such Licensee Licensed Products not being off the shelf products offered for Sale by or on behalf of such manufacturer to Persons other than Licensee Grantee Entities, (c) practice any method or process anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold, and (d) make, have made, and use, including use with patterns or masks for processing substrates such as wafers, any tool, software, machine, or other apparatus anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold.

License Property

Licensee Licensed Products means:
(a) Lithography Equipment and Lithography Components, and, in each case, all applications therefor, and
(b) Digital Cameras and all applications therefor; provided, however, that Licensee Licensed Products exclude (i) Licensee Excluded Products and (ii) Components that are solely for use in Licensee Excluded Products. For the avoidance of doubt, Lithography Equipment, Lithography Components, and Digital Cameras are licensed in their entirety, including any Third Party Components thereof. Without limiting the generality of the foregoing, as of the Effective Date, Licensee Licensed Products include Licensee’s and its Grantee Entities’ products within the following product lines: NSR series, FX series, LithoBooster, D series, Z series, COOLPIX series, and KeyMission series.

Licensor Licensed Products means Lithography Equipment and Lithography Components, and, in each case, all applications therefor; provided, however, that Licensor Licensed Products exclude (a) Licensor Excluded Products and (b) Components that are solely for use in Licensor Excluded Products.

Lithography Components means, individually and collectively, Components for use in Lithography Equipment, including (a) separately installed Components of any Lithography Equipment, (b) any optical elements, modules and systems, including illumination optical systems, projection optical systems, manipulation devices and mounting means of any Lithography Equipment, (c) any Components integrated in any Lithography Equipment, (d) materials for use in, and solely to the extent they are for use in, the operation of any Lithography Equipment, such as fluids and gases, (e) any software installed in such Lithography Equipment that is used to operate or control such Lithography Equipment, solely to the extent it is for use in the operation or control of Lithography Equipment; including where such Lithography Equipment uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers; and (f) processes, materials and devices for designing, manufacturing, assembling, adjusting and qualifying any of the items described above; provided, however, that Lithography Components shall not include masks, resists, or substrates themselves. Notwithstanding the foregoing, Lithography Components include any entire standalone assembly of a tool or machine, where a standalone assembly of a tool or machine means an assembly that is not included in any Lithography Equipment, solely for (i) measuring either or both alignment marks on a wafer and the topography of a wafer, and (ii) using such measurements solely to calculate feedforward corrections for wafer stage positioning in an Immersion Lithography System, which, for the avoidance of doubt, includes Licensee’s LithoBooster Standalone Alignment Station as and in the form marketed by Licensee as of the Effective Date. For the avoidance of doubt, Lithography Components does not include, by way of examples only, the products of Licensor’s Applications Business Lines, including Licensor’s Yieldstar line of products and including the products of Licensor’s HMI and Brion businesses, in each case, as and in the form such products are marketed by Licensor and its Grantee Entities as of the Effective Date.

Lithography Equipment means any tool or machine for forming or transferring a pattern on or onto a substrate by Lithography for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements to any of the foregoing, including where such tool or machine uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers, or performs maskless Lithography; provided, however, that Lithography Equipment shall not include masks, resists, or substrates themselves. For the avoidance of doubt, except where expressly indicated otherwise in this Agreement, Lithography Equipment includes EUV Lithography Equipment and FPD/Large Area Substrate Equipment.

“Digital Camera” means a complete digital camera or digital camera body for personal or professional photography (including video) use. “Digital Camera” does not include microscopes, medical imaging equipment, or stand-alone lenses.

“EUV Lithography Equipment” means Lithography Equipment that performs Lithography using radiation with wavelengths of 20 nanometers or less, and all Components thereof.

“FPD/Large Area Substrate Equipment” means Lithography Equipment (a) for the manufacture of flat panel displays, or (b) for exposing large area substrates, other than semiconductor wafers, having a dimension greater than 500 mm along any dimension.

Field of Use

The field of use is Lithography and optical equipment  for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements.

License Grant

The Parties wish to settle, dismiss, and terminate the Pending Proceedings and grant each other certain rights and releases under their respective patents pursuant to the terms and conditions of this Agreement.

The Licensor of Japan grants to the Dutch Licensee, under the Licensor Licensed Patents, retroactive to the Effective Application Date of each Licensor Licensed Patent, a non-exclusive, non-sublicensable, non-transferable license, only during the Term, to make, use, including use with patterns or masks for processing substrates such as wafers, Sell, offer to Sell, import and export Licensee Licensed Products anywhere in the world,  have Licensee Licensed Products made by its manufacturers anywhere in the world, provided that, solely for purposes of this clause,  such manufacturers making the Licensee Licensed Products in accordance with specifications provided by a Licensee Grantee Entity, and such Licensee Licensed Products not being “off the shelf” products offered for Sale by or on behalf of such manufacturer to Persons other than Licensee Grantee Entities or Zeiss Grantee Entities,  practice any method or process anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold, and make, have made, and use,  including use with patterns or masks for processing substrates such as wafers any tool, software, machine, or other apparatus anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold.

License Property

Licensor Licensed Products means:
(a) Lithography Equipment and Lithography Components, and, in each case, all applications therefor, and
(b) Digital Cameras and all applications therefor; provided, however, that Licensor Licensed Products exclude (i) Licensor Excluded Products and (ii) Components that are solely for use in Licensor Excluded Products. For the avoidance of doubt, Lithography Equipment, Lithography Components, and Digital Cameras are licensed in their entirety, including any Third Party Components thereof. Without limiting the generality of the foregoing, as of the Effective Date, Licensor Licensed Products include Licensor’s and its Grantee Entities’ products within the following product lines: NSR series, FX series, LithoBooster, D series, Z series, COOLPIX series, and KeyMission series.

Licensee Licensed Products means Lithography Equipment and Lithography Components, and, in each case, all applications therefor; provided, however, that Licensee Licensed Products exclude (a) Licensee Excluded Products and (b) Components that are solely for use in Licensee Excluded Products.

Lithography Components means, individually and collectively, Components for use in Lithography Equipment, including (a) separately installed Components of any Lithography Equipment, (b) any optical elements, modules and systems, including illumination optical systems, projection optical systems, manipulation devices and mounting means of any Lithography Equipment, (c) any Components integrated in any Lithography Equipment, (d) materials for use in, and solely to the extent they are for use in, the operation of any Lithography Equipment, such as fluids and gases, (e) any software installed in such Lithography Equipment that is used to operate or control such Lithography Equipment, solely to the extent it is for use in the operation or control of Lithography Equipment; including where such Lithography Equipment uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers; and (f) processes, materials and devices for designing, manufacturing, assembling, adjusting and qualifying any of the items described above; provided, however, that Lithography Components shall not include masks, resists, or substrates themselves. Notwithstanding the foregoing, Lithography Components include any entire standalone assembly of a tool or machine, where a standalone assembly of a tool or machine means an assembly that is not included in any Lithography Equipment, solely for (i) measuring either or both alignment marks on a wafer and the topography of a wafer, and (ii) using such measurements solely to calculate feedforward corrections for wafer stage positioning in an Immersion Lithography System, which, for the avoidance of doubt, includes Licensor’s LithoBooster Standalone Alignment Station as and in the form marketed by Licensor as of the Effective Date. For the avoidance of doubt, Lithography Components does not include, by way of examples only, the products of Licensee’s Applications Business Lines, including Licensee’s Yieldstar line of products and including the products of Licensee’s HMI and Brion businesses, in each case, as and in the form such products are marketed by Licensee and its Grantee Entities as of the Effective Date.

Lithography Equipment means any tool or machine for forming or transferring a pattern on or onto a substrate by Lithography for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements to any of the foregoing, including where such tool or machine uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers, or performs maskless Lithography; provided, however, that Lithography Equipment shall not include masks, resists, or substrates themselves. For the avoidance of doubt, except where expressly indicated otherwise in this Agreement, Lithography Equipment includes EUV Lithography Equipment and FPD/Large Area Substrate Equipment.

Field of Use

The field of use is Lithography and optical equipment  for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements.

License Grant

The Memorandum of Understanding, between a Licensor of the Netherlands, a Licensor of Germany and a Licensee of Japan, is a binding cross license agreement that concerns all pending disputes between the parties.

The Licensor of the Netherlands grants the Japanese Licensee, on its own behalf and on behalf of its other Grantor entities, a worldwide, non-exclusive, non-sublicensable, non-transferable license, under the Netherlands Licensor’s Licensed Patents, to make, have made, use, sell, offer for sale, and import Licensee Licensed Products during the Term, and permanently for any Converted Licensed Patent family.

The German Licensor grants the Japanese Licensee, a worldwide, non-exclusive, non-sublicensable, non-transferable license, under the German Licensor’s Licensed Patents, to make, have made, use, sell, offer for sale, and import Licensee Licensed Products during the Term, and permanently for any Converted Licensed Patent family.

License Property

The Netherlands Licensor Licensed Products means lithography equipment, including EUV Lithography Products, and components for use in lithography equipment, including EUV Lithography Products, that are designed, made, have made, used, sold, offered for sale, or imported by or on behalf of this Licensor or its Subsidiaries, and all applications therefor, as well as such other products as may be agreed by the parties; but excluding this Licensors Excluded Products and components for Excluded Products. For purposes of clarification, lithography equipment and components licensed pursuant hereto are licensed in their entirety, including any third-party components and materials thereof or therefor that were not designed by or for this Licensor or its Subsidiaries.

The German Licensor Licensed Products means components for use in lithography equipment, including EUV Lithography Products, and this Licensors Digital Cameras, in each case that are designed, made, have made, used, sold, offered for sale, or imported by or on behalf of this Licensor (or, with regard to this Licensor Digital Cameras, or its Subsidiaries, and all applications therefor, as well as such other products as may be agreed by the parties; but excluding components for this Licensor Excluded Products. For purposes of clarification, components for use in lithography equipment and this Licensor Digital Cameras licensed pursuant hereto are licensed in their entirety, including any third-party components and materials thereof or therefor that were not designed by or for this Licensor or its Subsidiaries.

Licensee Licensed Products means lithography equipment, including FPD/Large Area Substrate Products, and components for use in lithography equipment, including FPD/Large Area Substrate Products, and Digital Cameras, in each case that are designed, made, have made, used, sold, offered for sale, or imported by or on behalf of Licensee or its Subsidiaries, and all applications therefor, as well as such other products as may be agreed by the parties; but excluding Licensee Excluded Products and components for Licensee Excluded Products. For purposes of clarification, lithography equipment and components and Digital Cameras licensed pursuant hereto are licensed in their entirety, including any third-party components and materials thereof or therefor that were not designed by or for Licensee or its Subsidiaries.

EUV Lithography Products means lithography systems that image using radiation with wavelengths of 20 nanometers or less, and all components thereof and therefor.

FPD/Large Area Substrate Products means products, including lithography equipment, for the manufacture of flat panel displays or substrates having a dimension greater than 500 mm along any dimension.

Digital Camera means a complete digital camera or digital camera body for personal or professional photography, including video, use.  Digital Camera does not include microscopes, medical imaging equipment, or stand-alone lenses.

Field of Use

The field of use is lithography equipment and components and digital cameras.

Lithography equipment includes a variety of techniques for transferring circuit patterns to a printed circuit board, such as photolithography, which uses a mask or template, and nanolithography, which uses electron beam imaging to produce a pattern.

License Grant

The Memorandum of Understanding is a binding cross-license agreement that concerns all pending disputes between the parties.

The Japanese Licensor grants the Netherlands Licensee a worldwide, non-exclusive, non-sublicensable, non-transferable license, under Licensor’s Licensed Patents, to make, have made, use, sell, offer for sale, and import Netherland Licensee Licensed Products during the Term, and permanently for any Converted Licensed Patent family.

The Japanese Licensor grants the German Licensee a worldwide, non-exclusive, non- sublicensable, non-transferable license, under Licensor’s Licensed Patents, to make, have made, use, sell, offer for sale, and import the German Licensee Licensed Products during the Term, and permanently for any Converted Licensed Patent family.

License Property

The Netherland Licensor Licensed Products means lithography equipment, including EUV Lithography Products, and components for use in lithography equipment, including EUV Lithography Products, that are designed, made, have made, used, sold, offered for sale, or imported by or on behalf of this Licensor or its Subsidiaries, and all applications therefor, as well as such other products as may be agreed by the parties; but excluding this Licensors Excluded Products and components for Excluded Products. For purposes of clarification, lithography equipment and components licensed pursuant hereto are licensed in their entirety, including any third-party components and materials thereof or therefor that were not designed by or for this Licensor or its Subsidiaries.

The German Licensor Licensed Products means components for use in lithography equipment, including EUV Lithography Products, and this Licensors Digital Cameras, in each case that are designed, made, have made, used, sold, offered for sale, or imported by or on behalf of this Licensor (or, with regard to this Licensor Digital Cameras, or its Subsidiaries, and all applications therefor, as well as such other products as may be agreed by the parties; but excluding components for this Licensor Excluded Products. For purposes of clarification, components for use in lithography equipment and this Licensor Digital Cameras licensed pursuant hereto are licensed in their entirety, including any third-party components and materials thereof or therefor that were not designed by or for this Licensor or its Subsidiaries.

Licensee Licensed Products means lithography equipment, including FPD/Large Area Substrate Products, and components for use in lithography equipment, including FPD/Large Area Substrate Products, and Digital Cameras, in each case that are designed, made, have made, used, sold, offered for sale, or imported by or on behalf of Licensee or its Subsidiaries, and all applications therefor, as well as such other products as may be agreed by the parties; but excluding Licensee Excluded Products and components for Licensee Excluded Products. For purposes of clarification, lithography equipment and components and Digital Cameras licensed pursuant hereto are licensed in their entirety, including any third-party components and materials thereof or therefor that were not designed by or for Licensee or its Subsidiaries.

EUV Lithography Products means lithography systems that image using radiation with wavelengths of 20 nanometers or less, and all components thereof and therefor.

FPD/Large Area Substrate Products means products, including lithography equipment, for the manufacture of flat panel displays or substrates having a dimension greater than 500 mm along any dimension.

Digital Camera means a complete digital camera or digital camera body for personal or professional photography, including video, use.  Digital Camera does not include microscopes, medical imaging equipment, or stand-alone lenses.

Field of Use

The field of use is lithography equipment and components and digital cameras.

Lithography equipment includes a variety of techniques for transferring circuit patterns to a printed circuit board, such as photolithography, which uses a mask or template, and nanolithography, which uses electron beam imaging to produce a pattern.

License Grant

The Parties agree to jointly develop semiconductor manufacturing process technology based on Licensor’s “S” high performance technology roadmap on commercially available wafers that meet the requirements (referred to as Strategic Technology Objectives) in accordance with the schedule (hereinafter referred to as Development Schedule). The Parties agree that the process technology so developed, shall be high performance, leading edge technology and, to the extent consistent with the Strategic Technology Objectives, shall be cost efficient. Any modification to such Strategic Technology Objectives or Development Schedule requires the mutual agreement of the Parties. For the avoidance of doubt, none of the Process Development Projects shall include the development of i) Proprietary Tools, ii) Packaging Technology, iii) Mask Fabrication and Photoresist Technology, iv) Memory, v) SiGe Technology, vi) Chip Designs, or vii) Post-Silicon Devices.

License Property

Semiconductor Product means a component that contains an Integrated Circuit on a single or multichip module that incorporates a means of connecting those Integrated Circuits with other electronic elements (active or passive) and/or means to make external electrical connections to such elements, but which excludes any means for a user to operate the functions therein (e.g., buttons, switches, sensors).

Licensed Product means Integrated Circuits that include Bulk CMOS Information, Industry Standard Information, High Performance Device Information, SOI Device Information, or any combination thereof, other than Foundry Products.

Integrated Circuit means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, Integrated Circuit shall include charge-coupled devices (“CCDs”).

Bulk CMOS Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, and/or (ii) selected by Licensor either for incorporation into an Licensor Bulk CMOS process or otherwise pursuant to this agreement.

Industry Standard Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, or (ii) applicable to Industry Standard CMOS and selected by Licensor either for incorporation into an Licensor Industry Standard CMOS process or otherwise selected pursuant to this agreement.

High Performance Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on substrates, not including SOI Device Information. Bulk CMOS Information or Industry Standard Information.

SOI Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on commercially available SOI Wafers other than Bulk CMOS or Industry Standard Information.

Field of Use

This agreement pertains to the semiconductor industry.

License Grant

Licensor grants a non-exclusive, perpetual, worldwide, irrevocable license to use the Bulk CMOS Information and portions of Specific Results other than those portions which Licensee uses exclusively to produce the highest performing thirty percent (30%} of wafers manufactured in the applicable technology generation (e.g. 45nm, 32nm) in any given quarter for the purpose of researching, developing, engineering and manufacturing up to one thousand (1000) 300mm wafers, other than SOI Wafers, per week in 65nm, 45nm and/or 32 nm technology, including the right to sell, market, distribute or otherwise dispose of such wafers to Third Parties, provided that such licensed wafers manufactured using the aforementioned portions of Specific Results shall not include high performance microprocessors intended for use in high performance enterprise Servers.

After September 30, 2003, Licensee may exercise the sublicensing option. If Bump Technology is established as a Process Development Project,  Licensor grants Licensee the right to disclose and sublicense the process technology developed by Licensor and Licensee under this Agreement including SOI Device Information, High Performance Device Information and Bulk CMOS and Industry Standard CMOS Information and Pre-TO Information, subject to the following: AMO may sublicense no more than two (2) JMP for a maximum of a total of two (2) joint manufacturing facilities with a combined maximum of 20,000 300 mm wafers per month for such technology consumed by, or supplied to the Joint Manufacturing Partners (JMP).

License Property

The technology is leading edge semiconductor manufacturing processes.

The Licensed Product means Integrated Circuits that include Bulle CMOS Information, Industry Standard Information, High Performance Device Information (excluding eDRAM Technology), SOI Device Information (excluding eDRAM Technology), or any combination thereof, other than Foundry Products.

“Chip Design(s)” means any design of one or more Integrated Circuits and/or Semiconductor Products, including (by way of example and not limitation) random access memory (RAM)s, read only memory (ROM)s, microprocessors, ASICs and other logic designs, and analog circuitry; provided, however, that “Chip Designs” shall not include (i) alignment marks or test structures and associated layout and data used in the Process Development Projects for process development, (ii) process kerf test structures, layout, and data of the test chip(s) (including SRAM macro cells and eDRAM macros) as well as such test chips themselves used for the development work of the Process Development Projects unless specifically excluded (for the avoidance of doubt, this phrase means that such structures or macros that are specifically designated as owner proprietary shall not be considered Specific Results), (iii) other product designs (including eDRAM macros) as mutually agreed by the Parties to be used as qualification vehicles in the Process Development Projects, or (iv) ESD protection devices as used in the Project Test Sites and ESD groundrules and models as defined in the Design Manual. For the avoidance of doubt, all of (i) through (iv) above shall be treated as Specific Results to the extent utilized in a Process Development Project.

“CMOS 10S” means a 90 nanometer CMOS logic fabrication process.

“Embedded DRAM” or “eDRAM” means a device that either (i) primarily carries out logic functions, and includes one or more dynamic random access memory (DRAM) cells embedded within logic circuitry on the same semiconductor substrate, or (ii) primarily carries out memory functions, and includes one or more DRAM cells in combination with a static random access memory (SRAM) array on the same semiconductor substrate (including an array of SRAM cells linked with bit lines, word lines, sense amplifiers and decoders).

“Integrated Circuit” means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, “Integrated Circuit” shall include charge-coupled devices (“CCDs”).

“Lithography” shall mean those aspects of Background Know-How and Specific Results directed to (a) process technology-dependent ground rules or process technology-dependent special rules for shapes replication as developed by the Parties for the generation of photomasks used for development and qualification of a semiconductor process technology in the Process Development Projects, (b) resolution enhancement techniques specifically created pursuant to the Process Development Projects to generate mask build data, (c) such photomasks themselves and the data files used therefor as are used in the Process Development Projects, (d) lithography process sequence as utilized in the Process Development Projects, and (e) mask data generation sequence as utilized in the Process Development Projects.

Field of Use

This agreement is for semiconductor industry.

License Grant

Licensor hereby grants to Chinese Licensee a personal, royalty-bearing, internal, non-transferable, non-sublicensable, license under Licensors Intellectual Property Rights in and to the Licensor Product Technology to:
(a) make (but not have made), in each case solely at the Licensee Facility, Licensed Products;
(b) sell and offer for sale Licensed Products, and deliver such Licensed Products solely to customers in Greater China for end use in products solely for sale and use in Greater China;
(c) make a reasonable number of copies of the Licensor Product Technology, other than the Licensor Maskworks, as necessary to exercise the license above and to test the Licensed Products; and
(d) Subject to Licensors prior written approval to use, copy and distribute certain non-confidential Licensor documents in connection with the marketing and sale by Licensee of Licensed Products.

License Property

Licensor Product Technology means the Licensor Maskworks, and copies of any Licensor Product information and specifications, testing requirements and procedures and any other Technology, in each case provided by Licensor to Licensee under this Agreement for purposes of Product Qualification, or the manufacturing and testing of Licensor Products and/or Licensed Product under the Product License Agreement.

Licensed Products means those semiconductor devices manufactured by Licensee using the Licensor Maskworks and other Licensor Product Technology that are sold in wafer, die or packaged form as part of a Licensee product, excluding in all cases any Licensor Product.

Licensor Maskworks means those specific Maskworks sets provided or to be provided by Licensor to Licensee as set forth in this agreement to include but not limited to Ultratech-based Mask Sets and Nilon-based Mask Sets.

Intellectual Property Rights means the United States and foreign rights associated with the following: (i) patents and patent applications (Patent Rights); (ii) copyrights, copyright registrations and applications therefor (Copyrights); (iii) Maskworks, Maskwork registrations and applications therefor (Maskwork Rights); (iv) trade-secret rights and all other trade secret or similar proprietary rights in confidential business or technical information (Trade Secret Rights); and (v) any similar, corresponding or equivalent rights to any of the foregoing any where in the world. For purposes of this Agreement, Intellectual Property Rights excludes any United States and foreign rights associated with Trademarks.

Licensor is engaged in the business of designing, manufacturing and marketing high performance, analog integrated circuits that are used primarily by original equipment manufacturers operating in the computing, consumer electronics, communications and networking infrastructure markets.

Field of Use

This agreement covers foundry manufacturing, product licenses, process technology transfers and fab equipment sales.

Licensee is an integrated circuit design company focused on integrated circuits used in audio/video equipment and other consumer products in China.

License Grant

Licensor grants to Licensee a non-transferable, non-exclusive, worldwide right and license under Licensors applicable trade secret, know-how and copyrights in the Licensed Products and Update(s)
to do any or all of the following:
-Use the Licensed Products and Updates to develop, derive or otherwise create one or more Designs and mask sets that embody such Designs, including but not limited to the right to execute, distribute internally, and reproduce the Licensed Products and Updates in support of such use, provided such Designs are manufactured at Licensees Manufacturing Site(s);
– lease, sell, or otherwise transfer semiconductor products instantiating such Designs in any form or level of assembly (by way of example, in wafer or single chip form as bare die, in chip packages, or on printed circuit boards) to third parties;
– Use the Licensed Products and Updates as reasonably necessary to carry out the activities set forth;
– distribute the Front-End Views/Back-End Views to third party entities to internally use the Front-End Views and internally use the Back-End Views.

License Property

Licensed Product(s) means the products described in the Product Schedule, and any Updates thereto, whether in object code, reconfigurable binary, ASCII data, binary data or any other form. Licensed Product(s) includes the Back-End Views, Front-End Views and Internal Use Documentation.

Required Data means semiconductor manufacturing processes.

Wafer shall mean a combination of die produced from a single manufactured semiconductor wafer, which die in whole or in part are made up of, incorporate or are based upon any portion of a Design.

Licensor is a leading developer of high performance, high density and low power embedded memory, standard cell and input/output intellectual property components used for the design and manufacture of complex integrated circuits.

Field of Use

This agreement is for the semiconductor and related device industry.

License Grant

Licensor hereby grants the Japanese Licensee a non-exclusive, non-transferable license to use the Technology including Licensor Patents to manufacture, or have manufactured, TCMT materials and TLS materials, and to package and assemble, or to have packaged and assembled, ICs it may own as TCCs, and to assemble or have assembled such devices into MCMs with or without TLS materials, all of the foregoing made or assembled according to Specifications, and to sell TCMT, TLS, MCMs, MCM Components, and TCCs on a world wide basis.

License Property

Patents:
5,148,266 – Semiconductor chip assemblies having interposer and flexible lead
5,148,265 – Semiconductor chip assemblies with fan-in leads
5,258,330 – Semiconductor chip assemblies with fan-in leads
5,282,312 – Multi-layer circuit construction methods with customization features

The term Technology means the Technical Information and Licensor Patent relating to design, manufacture, assembly, packaging, and use of TCC, TLS, TCMT and MCMs including all Packaging-Related know-how owned or controlled and used by Licensor.

The term Packaging-Related, as applied to any item (including any information, idea, invention or know-how, Licensee’s Improvement or Licensor Patent), means only such item that is both: (a) related to TCC, TLS, TCMT and MCMs (limited to the extent MCMs are subject to valid claims in Licensor Patents covering TCC), and (b) substantially related to the physical structures and/or stages of assemblies, components and/or methods for packaging, mounting or connecting semi-conductor chips. Items which relate only to the electrical circuitry embodied in semi-conductor chips or assemblies, and which do not relate to said physical structures or stages of assembly are not Packing-Related.

TCMT for ICs (semiconductor integrated circuit) is Compliant Mounting Tape, a multi-layer flexible film made under or using the Technology comprising a first layer of flexible film with electrical contacts arranged in an area array, each connected to one or more flexible conductors terminating in features disposed and suitable for direct wire bonding to bonding pads of said IC, plus possible optional signal or ground plane wiring layers, and a possible layer of compliant material attached to first said layer on the side opposite the bumps on the BGA.

TLS means proprietary Laminated Substrates for MCMs and IC interconnect substrates made under or using the Technology comprised of sub laminate signal layers and interconnecting interposer layers that may be individually personalized and assembled by means of lamination into electrical interconnecting substrates for use in MCMs or other IC packages.

A TCC is a Compliant Chip, an IC device which is made or packaged under or using the Technology with an area array of coplanar contacts or bumps on a grid spacing (BGA): a TCC comprises an IC die and a thin compliant multi-layer structure mounted to the bonding pad side of said IC die, with permanent flexible electrical connections between at least one of said bumps and corresponding bonding pad(s) on said IC die, where said pad(s) can be arranged on the perimeter, or the interior, or in an area array on the surface of said IC die.

An MCM is a Multi-Chip Module, an IC sub assembly (Daughter Board), made under or using the Technology comprising at least one TCC, including the first wiring substrate it may be attached to, whether permanently attached or not, and further including those ICs, TCCs, components, heat spreaders, sealing caps, and sub assemblies that are ultimately attached or connected to the same first wiring substrate (all of the foregoing and nothing else), and where said IC sub assembly is designed and intended for connection, by means of a socket or other suitable method, to a greater electronic system for data I/O, instructions, control signals, and access to system power and ground.

An MCM Component is a partially completed MCM incorporating at least one TCC, whether permanently attached or not, and which may be arranged to allow for later removal of said TCC(s) and/or further incorporation of other TCCs, chips, passives, heat spreaders, scaling caps, or other components.

Field of Use

This agreement pertains to the semiconductor industry.

License Grant

Japanese Licensor hereby grants to Licensee the exclusive License under the Patents, Technical Information and Intellectual Property Rights to manufacture, use, offer for sale, sell, import and/or lease the Products in the territory; provided, however, Licensee agrees not to manufacture any of the three Products listed in this Agreement at any time on or prior to June 30, 2006; provided further, however, that Licensee may start on the effective date to manufacture, use, offer for sale, sell, import and/or lease in the territory all subsystems related to any Products, including, but not limited to, the Nison Vesper submodule. For the avoidance of doubt, Licensor acknowledges and agrees that the License granted to Licensee under this Agreement includes the right of the Licensee to subLicense to any purchaser of the Products the right to use (but not manufacture) the Patents, Technical Information and Intellectual Property Rights.

License Property

Licensor was incorporated to, among other things, manufacture and distribute certain products and systems of Licensee in Japan in accordance with a Shareholders Agreement dated June 5, 1991.  This license is a result of Licensor buying a portion of the business of a semiconductor manufacturing equipment business and licensing back rights to Licensee.

The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers.  Three products are covered by this agreement: Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.

Patent:

Title
No.
number

number
Country

1
Method of recirculation of high temperature etching solution
63–248757
02–096334

1653241
Japan

2
Cleaning/ rinsing vessel for semiconductor wafer
03–350731
05–166787

2013691
Japan

3
Method for refinig etchant
05–253672
07–086260

3072876
Japan

4
Single wafer spin etching method
07–104581
08–279485

3459137
Japan

5
Etching method with hot phosphoric acid
07–216528
09–045660

3459141
Japan

6
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
07–163075
08–334461

N/A
Japan

7
Regeneration treatment apparatus for etchant and etching apparatus using the same
10–095836
11–293479

N/A
Japan

8
Cleaning apparatus
11–199868
2001–028356

N/A
Japan

9
Filter device with bellows damper and chemical–circulation treatment device for semiconductor wafer using the same
11–222204
2001–046815

N/A
Japan

10
Semiconductor wafer cleaning system
11–234855
2001–060574

N/A
Japan

11
Method of etching semiconductor wafer
11–271065
2001–093876

N/A
Japan

12
Device and method for etching semiconductor wafer
11–314794
2001–135611

N/A
Japan

13
Scrub cleaning device
2000–044343
2001–237209

N/A
Japan

14
Cleaning Equipment of wafer
2000–274592
2002–093764

N/A
Japan

15
Equipment and method for processing solution for semiconductor wafer
2001–009915
2002–217165

N/A
Japan

16
Wafer–cleaning device
2001–158580
2002–353183

N/A
Japan

17
The apparatus and the method of etching wafer
2002–42120
2003–243353

N/A
Japan

18
The apparatus of reclaiming etching liquid and method and apparatus of etching
2002–269405
N/A

N/A
Japan

19
The method of controlling the boiling chemical
2002–318730
2004–153164

N/A
Japan

20
The apparatus and the method of floating wafer chuck
2002–108651
2003–303871

N/A
Japan

21
The apparatus of wafer treatment and shaft
2003–47148
N/A

N/A
Japan

22
Etching method and equipment
2002–324795
2004–158746

N/A
Japan

23
Processing method and processing device before wafer inspection
2001–266653
2003–75312

N/A
Japan

24
Processing method and processing device before wafer inspection
2002–156835
2003–344243

N/A
Japan

25
Method for recirculating high–temperature etching soluthin
412444
N/A

4980017
USA

26
Method for purification of etching solution
305334
N/A

5470421
USA

Trademarks:

Class of

NO
Trademark
goods
Designated goods

1 NISON
7
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments

2 NISON
9
Automatic fluid– composition control machines and instruments

3 CENOTE
7
The apparatus of wafer etching, chemical machines and instruments

4 Stelna
7
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.

Remark: An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.

Product:
Product Name

Description

Spin Processor CENOTE
Single Wafer Wet Station

Best

                Wafer Backside Etcher

Wet Station

Immersion Process System

Field of Use

Products means any and all products, systems and subsystems now or hereafter produced by or under control of Licensee based upon the Technical Information given under this Agreement which are in the field of surface conditioning, cleaning, etch and stripping technology such as the Technical Information used in the products to this Agreement and any products, systems and subsystems to be used in the Field which will be developed, designed or invented, or otherwise acquired by Licensor in the future during the term of this Agreement.

License Grant

For Evaluation, Licensor grants to the Licensee of the Netherlands a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to the Evaluation Software, Specifications and Evaluation Circuit Designs, to: use and reproduce the Evaluation Software and Specifications solely to conduct evaluation testing of the Products; and use the Evaluation Circuit Designs solely to conduct evaluation testing of the Products.

For Manufacturing, Licensor grants a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to the IC Designs, IC Design Files, Mask Tooling Sets, Manufacturing Test Circuit Designs and Manufacturing Test Software, to make and have made the Products solely for sale to Customers pursuant to this Agreement;  use and reproduce the IC Design Files to manufacture and have manufactured the Mask Tooling Sets solely for use in accordance with this Agreement; use the Mask Tooling Sets to manufacture and have manufactured Products solely for sale, either on a standalone basis or bundled with other Licensee semiconductor products, to Customers solely in accordance with this Agreement, use the Manufacturing Test Circuit Designs solely to test the functionality of Products manufactured in accordance with this Agreement, and use and reproduce the Manufacturing Test Software solely to test the functionality of Products manufactured in accordance with this Agreement.

For Sales by Licensee,  Licensor grants a nontransferable, nonsublicenseable, nonexclusive license, under Licensors Intellectual Property Rights in and to IC Design and IC Design File, to offer for sale, sell, and import Products, either on a standalone basis or bundled with other Licensor semiconductor products, solely in accordance with this Agreement.

License Property

Licensor will design the foregoing integrated circuits and develop certain hardware and software to help bring such integrated circuits into production, and will deliver and license a GDSII design file for the same to  Licensee of the Netherlands for Licensee to manufacture and sell such integrated circuits to customers of Licensee.

Licensor is a fabless semiconductor company that designs, builds, or has built on its behalf, and sells complex, highly integrated systems-on-a-chip radio frequency integrated circuits for consumer broadband and entertainment markets.

IC Design means the integrated circuit design developed by Licensor pursuant to this Agreement.

IC Design File means the GDSII database file containing the IC Design information necessary to manufacture the Mask Tooling Set.

Mask Tooling Set means the collection of masks used to manufacture the layers of Products, or any portion of a Product.

Product means a radio frequency integrated circuit Manufactured by Licensee, or on behalf of Licensee, that conforms to the IC Design.

Evaluation Software means the software developed by Licensor pursuant to this Agreement to evaluate the functionality of Products relative to the Specifications, in object code only.

Reference Design means the system level circuit board design, including a Product, a demodulator and an MPEG decoder, developed by Licensee pursuant to this Agreement to demonstrate the functionality of the Products.

Field of Use

The field of use is for a radio frequency integrated circuit to be incorporated into a Satellite Single Tuner.

Licensee is a global independent semiconductor company which designs, develops, manufactures and markets a broad Satellite Single Tuner means a device that enables the selection and frequency conversion of one stream of information that is disseminated electro-magnetically via radio frequency transmissions from a satellite after block frequency conversion to the frequency range of 9 50MHz to 2150 MHz range of integrated circuits and discrete devices based on semiconductors used in a wide variety of microelectronic applications, including telecommunication systems, computer systems, consumer products, automotive products and industrial automation and control systems.

License Grant

The Licensor and Chinese Licensee agree to amend the License Agreement to provide for a different royalty payment calculation and to add and/or clarify certain additional terms and conditions.

License Property

The parties confirm and clarify that LIC/Wafer shall mean any single integrated circuit die and/or piece of silicon wafer designed and/or manufactured.  

0.25(micron) LIC/Wafers means all LIC/Wafers that are manufactured for any of the TSMC 0.25(micron) processes and TSMC 0.25(micron) derivative processes.

0.18(micron) LIC/Wafers means those LIC/Wafers that are manufactured for any of the TSMC 0.18(micron) processes and TSMC 0.18(micron) derivative processes.

0.15(micron) LIC/Wafers means those LIC/Wafers that are manufactured for any of the TSMC 0.15(micron) processes and TSMC 0.15(micron) derivative processes.

Field of Use

This agreement pertains to the semiconductor industry.

License Grant

Licensor grants to Japanese Licensee a non-exclusive, except during the Exclusivity Period of ten years from the transaction date, transferable, perpetual license to use the Licensee Technology in the FPD Field to make and have made, use, sell, offer for sale and import FPD Film Thickness Measurements Systems and to provide technical support and service (including the sale and for such FPD Film Thickness Measurement Systems.

License Property

Licensed IP means the Nanometrics Technology, the Nanometrics Software and the Licensed Marks.

Licensed Marks means the trademarks of Nanometric.

Licensor designs, develops, manufactures, sells and supports a Film Thickness Measurement System optimized and specially adapted for the measurement of thin films on FPD, including its “NanoSpec” series of products (“FPD Film Thickness Measurement System”).  â€œFPD” means a liquid crystal display, plasma display, field emission display, electroluminescent display, LTPS, HTPS, LCOS or other like flat panel display. FPD excludes devices and technologies other than FPD, including without limitation any and all semiconductor devices.

Field of Use

FPD Field means the development, manufacture, marketing, distribution and sale of Film Thickness Measurement Systems and enhancements thereto for application to FPDs.

License Grant

For the patent license, Licensor grants the Licensee of Taiwan a time-limited, non-transferable, non-exclusive, worldwide right and license under the PSM Patents to make Royalty Bearing Wafers at Licensee Wafer Fabrication Sites, and to use, sell, offer to sell, import or export Royalty Bearing Wafers made at Licensee Wafer Fabrication Sites.  Licensee has no right to use the rights granted herein to provide Design Services to third parties unless Licensee also makes the subject Production Wafers under this Agreement.

For the copyright license, Licensor hereby grants a time-limited, non-exclusive and non- transferable license under Licensors copyrights:  to reproduce and Use the PSM Software for the purpose of the production of Production Wafers at Licensee Wafer Fabrication Sites; to use, reproduce and modify the PSM Documentation in connection with the manufacture of Production Wafers; and to create Licensee Scripts and Flows.  Licensee has no right to sublicense the rights granted herein.

Licensor grants a worldwide, non-exclusive, time-limited right to reproduce and distribute Customer PSM Technology to Licensee customers or potential customers subject to the terms of an appropriate non-disclosure agreement.

License Property

Licensor shall issue to Licensee, as soon as practicable, machine-readable copies of the PSM Software, along with one (1) copy of the appropriate Documentation.  PSM Software means the following software: iN-Phase v. X.x (iN-Phase Design, iN-Phase OPC, iN-Phase Verification), Model Generator v. X.x and Rule Generator v. X.x, and all Updates provided by Licensor under this Agreement.

PSM Technology means a use of two masks, or reticles, for defining a layer of material in an integrated circuit.

Field of Use

Licensee fabricates wafers and has fabrication sites.

License Grant

For the technology, Licensor shall grant a worldwide, personal, non-exclusive, non-transferable, non-assignable and revocable right and license to use, without the right to sublicense, transfer or convey such rights, in whole or in part, Licensors Technology, for the purposes of designing, modifying,   manufacturing, having manufactured, marketing, selling and otherwise disposing of integrated circuits which embody or are based upon part or all of Licensor Technology licensed by Licensor to Licensee and implemented in Designated Process Technology and which are not pin-compatible with Licensor Chips, in Licensee products, as components or Modules.

For the software, Licensor shall grant a world-wide, personal, non-exclusive, non-transferable, non-sublicenseable, non-assignable and revocable right and license, without any right to market, sublicense or distribute, to use, copy, and modify for Internal Use only and only with Licensor Chips in Designated Process Technology and/or Licensor Systems,  certain Licensor Source Code Software as set forth on the Source Code Use License Agreement.

Licensor shall grant a world-wide, personal, non-exclusive, non-transferable, fee-bearing, non assignable and revocable right and license to use for Internal Use and for sublicensing, copy for  Internal Use and for sublicensing, market, grant non-exclusive sublicenses for use and distribute  certain Licensor Binary Software,  as set forth on the Binary Software License Agreement all for use  only with Licensee Chips in Designated Process Technology and/or Licensor-based Systems.

For the Architecture License Software, Licensor shall grant a worldwide, personal, non-exclusive, non-transferable, non-sublicenseable, non-assignable and revocable right and license without any right to market, distribute or sublicense, to use, copy and modify, all for Internal Use only and only with Licensor Systems, certain Licensor Architecture License Software.

For Documentation rights, Licensor shall  grant a worldwide, personal, non-exclusive, fully-paid, non-transferable, non-assignable and revocable right and license, to use, modify, copy and distribute,  all for Internal Use only, without any right to market, copy or distribute outside of Licensee, Licensee Architecture License Documentation as set forth.

License Property

The Designate Process Technology means any technology for the design and manufacture of integrated circuit products that incorporates a type of circuit structure containing both p-channel and  n-channel MOS devices on the same silicon substrate (CMOS OR Bi-CMOS).

The licensed property includes Instruction Set and System Performance Simulator (SABLE), and Architecture Specification (superscalar) R4000 and R5000.

MIPS ARCHITECTURE – means the organization, structure, and content of any CPU or CPU support chips, or portions thereof, as designed and enhanced by MIPS, including but not limited to, MIPS Instruction Set (for example, the architecture set forth in the book entitled, MIPS RISC ARCHITECTURE) and interface specifications.

Field of Use

This agreement is for the integrated circuit industry.

License Grant

Licensor hereby grants to Licensee under Licensor Technology an irrevocable, worldwide, nonexclusive, nontransferable (except to Licensee Affiliates) license to make, have made, use, lease and sell Joint Products and Licensee Licensed Products.

Licensor hereby grants to Licensee and its Affiliates a non-exclusive, nontransferable, irrevocable license under the Licensor Licensed Patent Claims to make, have made, use, lease, sell, offer for sale, import, and otherwise transfer Joint Products and Licensee Licensed Products, solely to the extent necessary to exercise its licensed rights as set forth.

Licensor hereby grants to Licensee under the Licensor Tools, an irrevocable, nonexclusive, worldwide and royalty-free license to use, execute, display and perform such Licensee Tools or Licensor Tools, as the case may be, only for the purpose of developing, maintaining, or implementing a deliverable in a Statement of Work and for developing, maintaining and implementing Joint Products, Licensee Licensed Products and Licensor Licensed Products, as the case may be, subject to the obligations with respect to Confidential Information as set forth in this Agreement.

The Parties agree to cooperate on Joint Projects for the design of certain Joint Products useful in Transport Layer Applications. Each Joint Project or other development work to be performed by the Parties hereunder shall be the subject of a Statement of Work hereto. Each Statement of Work will establish the specifications for the Joint Product(s), a detailed plan for the conduct of the work and the schedule for task completion, a staffing commitment for each Party, the deliverables, including technology, to be provided by each Party for use in the Joint Project, and the documentation and other output requirement for the Joint Project results. Each Statement of Work will set forth a budget for the Design Costs for the Joint Project described therein.  The actual Design Costs will be shared by the Parties equally. In the event of a conflict between the provisions of a Statement of Work and the provisions of this Joint Development Agreement, the provisions of the Statement of Work will prevail.

License Property

Licensee Licensed Product means any integrated circuit, chip set, module, or other item, including packages and control software therefor, having all or any portion of its design based on or derived from Licensor Technology or the Joint Technology but which Licensee Licensed Product is not itself a Joint Product.

Joint Product means an Integrated Circuit, chip set, module or board or any other item specified on a Statement of Work to be jointly developed by the Parties hereunder.

Integrated Circuit means an integral unit including a plurality of active and passive circuit elements formed at least in part of semiconductor material arranged on or in a single chip.

Transport Layer Application means high performance transceivers connecting data communications and telecommunications equipment to a fiber optic infrastructure. Examples include  10Gb Ethernet, OC192 10Gb Sonet, and OC768 40Gb Sonet applications.

Product means a Licensor Licensed Product, Licensee Licensed Product, or Joint Product.

Invention means any idea, design, concept, technique, invention, discovery or improvement, whether or not patentable, made solely or jointly by one or more employees or consultants of either Licensor or Licensee, provided that either the conception or reduction to practice occurs in the performance of work under a Joint Project.

Field of Use

This agreement pertains to the telecommunication industry relating in silicon germanium technology design and production and in microcontroller designs and technologies for Transport Layer Applications.

License Grant

The Company of Israel  signed a technology-License Agreement, whereby the Company received a patent usage right as well as equipment from an undisclosed Licensor.

License Property

Metrology systems measure various thin film properties, critical circuit dimensions and layer-to-layer circuit alignment, known as overlay, during various steps in the semiconductor manufacturing process, allowing semiconductor manufacturers to increase quality, productivity and yields, lower their manufacturing costs and increase their profitability

Field of Use

The Licensee is a worldwide leading designer, developer and producer of integrated process control metrology systems used in the manufacture of semiconductors and a leading designer, manufacturer and producer of stand-alone process control metrology systems.

License Grant

Licensor grants to the Singapore Licensee a non-exclusive license under the Licensors Licensed Patents:
– to make Licensees Licensed Products only in Singapore and one Licensee Elected Country;
– to use, import, and lease, offer for sale, sell or otherwise transfer Licensees Licensed Products worldwide;
– to use any apparatus in the manufacture or testing of Licensee Licensed Products and to practice any method or process in such manufacture or testing of Licensees Licensed Products; and
– to have Licensees Licensed Products made in whole or in part by another manufacturer for the use and/or lease, offer for sale, sale or other transfer by Licensee only when the designs and specifications for such Licensees Licensed Products were provided by Licensee to the other manufacturer, whether developed by Licensee or received by Licensee from customers to whom the Licensed Products are to be sold.

License Property

The Licensed Products shall mean Semiconductor Apparatus.

Semiconductor Apparatus shall mean Semiconductor Material, Semiconductor Device, Semiconductor Circuit, Integrated Circuit and/or Semiconductor Memories and any combination of such apparatus with other such apparatus.

'Integrated Circuit' shall mean an integral unit including a plurality of active and/or passive circuit elements formed at least in part of Semiconductor Material and associated on, or in, one substrate comprising the first level of packaging for such elements; such unit forming or contributing to the formation of a circuit for performing electrical or electronic functions.

'Semiconductor Circuit' shall mean a circuit in which one or more Semiconductor Devices are interconnected in one or more paths (including passive circuit elements, if any) for performing fundamental electrical or electronic functions and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Device' shall mean a device and any material therefor, including but not limited to device structures such as transistors, diodes, capacitors, resistors, conductors and dielectrics, comprising a body of one or more Semiconductor Materials and one or more electrodes associated therewith and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Material' shall mean any material whose conductivity is intermediate to that of metals and insulators at room temperature and whose conductivity, over some temperature range, increases with increases in temperature. Such materials shall include, but not be limited to, refined products, reaction products, reduced products, mixtures and compounds.

'Semiconductor Memory' shall mean any instrumentality or aggregate of instrumentalities, which instrumentality or aggregate is designed only for storing digital information, intelligence or data by selectively setting or presetting detectable states in Semiconductor Material forming at least a part of such instrumentality or aggregate, such instrumentality or aggregate may include powering means and auxiliary and/or support circuits (such as regeneration means, true-complement generations means, address decoding means, sensing means and selection means) to control the flow of such information, intelligence or data into and out of such Semiconductor Memory.

Field of Use

This agreement is for the semiconductor industry.

License Grant

Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents to make, use, import, offer to sell, sell and otherwise transfer Products.   Additionally, Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents the right to have Licensees Products made by another manufacturer for the use and/or lease, sale or other transfer only by Licensee and its Subsidiaries.  Such license shall further include the right to incorporate Products as components, subassemblies or subsystems in other products manufactured and/or sold by Licensee and its Subsidiaries.

License Property

The patents relate to coherent semiconductor injection laser array.  The invention relates to optical devices and more particularly relates to solid state lasers.

'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.

Field of Use

Licensee is in the semiconductor industry.

License Grant

Licensor grants under their respective trade secret/know-how rights in and to Background Know-How that becomes part of Specific Results a non-exclusive, perpetual, worldwide, irrevocable license, to use such Background Know-How for the purpose of researching, developing, engineering, manufacturing, using, marketing, selling, servicing and otherwise disposing of SOI Integrated Circuits other than Foundry Products, Integrated Circuits that combine Bulk CMOS and SOI Device Information other than Foundry Products, or Bulk CMOS products other than Foundry Products. AMD shall have no obligation under this Agreement to pay any royalty for the licenses set forth.

Licensor grants to Licensee, and Licensee grants to Licensor, under their respective copyright rights in and to Background Know-How that becomes part of Specific Results, a non-exclusive, perpetual, worldwide, irrevocable license to copy documentation and other written expression, to make derivative works of such written expression, to distribute such documentation and derivatives, and to execute, display, and perform.

Licensor grants to Licensee, and Licensee grants to Licensor, under their respective mask work rights in and to Background Know-How that becomes part of Specific Results, a non-exclusive, perpetual, worldwide, irrevocable license to use any process-related mask design information provided to a Process Development Project and create derivative works thereof, as reasonably necessary for the licensed Parties to carry out the license rights. Unless otherwise authorized, this right shall not include any rights to utilize any product design information in such masks.

License Property

Licensor has been developing leading edge semiconductor manufacturing processes with other parties.

The Foundry Product shall mean an SOI. Integrated Circuit wherein all the following conditions are met:
– the design, or masks and/or mask build data, for such SOI Integrated Circuit product are provided to a Party from a Third Party;
– such Party played no substantial role in any phase of the design of such product; and
– such Party is contractually bound to manufacture such product solely for, and to sell such product solely to, such Third Party or its distributor or other recipient solely for the benefit of such Third Party.

Field of Use

This agreement is for the integrated circuit industry.