Royalty Report: Semiconductors, RAM, IC – Collection: 29267


Curated Royalty Rate Report
Created On: 2020-07-15, Record Count: 12


This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Created On: 2020-07-15
Record Count: 12

Primary Industries

  • Semiconductors
  • RAM
  • IC
  • Storage
  • Fabrication
  • Computers & Office Equipment
  • Circuits

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 29267

License Grant
The Licensor grants the Licensee a non-exclusive licenses under any of the Licensors patents to make Licensed Products and the right to use, to lease, to sell, and otherwise to dispose of, Licensed Products made only by Licensee or its subsidiaries.
License Property
The Licensed Products are Integrated Circuits of a type which is commonly recognized in the industry by any of the following acronyms: DRAMs (including but not limited to Dynamic Random Access Memory devices, Synchronous Dynamic Random Access Memory devices, Video RAMs (VRAMs), and Field or Frame memories commonly referred to in the industry as FRAMs); SRAMs; ROMs; PROMs; EPROMs; FLASH EPROMs; or EEPROMs.

IPSCIO Record ID: 3243

License Grant
The Licensor and the Chinese Licensee amended two technology transfer and License Agreements and entered into a new technology transfer and License option Agreement for the 20nm process node.
License Property
Dynamic random-access memory (DRAM) is a type of random-access memory that stores each bit of data in a separate capacitor within an integrated circuit.

IPSCIO Record ID: 203510

License Grant
Licensor grants a non-exclusive, perpetual, worldwide, irrevocable license to use the Bulk CMOS Information and portions of Specific Results other than those portions which Licensee uses exclusively to produce the highest performing thirty percent (30%} of wafers manufactured in the applicable technology generation (e.g. 45nm, 32nm) in any given quarter for the purpose of researching, developing, engineering and manufacturing up to one thousand (1000) 300mm wafers, other than SOI Wafers, per week in 65nm, 45nm and/or 32 nm technology, including the right to sell, market, distribute or otherwise dispose of such wafers to Third Parties, provided that such licensed wafers manufactured using the aforementioned portions of Specific Results shall not include high performance microprocessors intended for use in high performance enterprise Servers.

After September 30, 2003, Licensee may exercise the sublicensing option. If Bump Technology is established as a Process Development Project,  Licensor grants Licensee the right to disclose and sublicense the process technology developed by Licensor and Licensee under this Agreement including SOI Device Information, High Performance Device Information and Bulk CMOS and Industry Standard CMOS Information and Pre-TO Information, subject to the following: AMO may sublicense no more than two (2) JMP for a maximum of a total of two (2) joint manufacturing facilities with a combined maximum of 20,000 300 mm wafers per month for such technology consumed by, or supplied to the Joint Manufacturing Partners (JMP).

License Property
The technology is leading edge semiconductor manufacturing processes.

The Licensed Product means Integrated Circuits that include Bulle CMOS Information, Industry Standard Information, High Performance Device Information (excluding eDRAM Technology), SOI Device Information (excluding eDRAM Technology), or any combination thereof, other than Foundry Products.

“Chip Design(s)” means any design of one or more Integrated Circuits and/or Semiconductor Products, including (by way of example and not limitation) random access memory (RAM)s, read only memory (ROM)s, microprocessors, ASICs and other logic designs, and analog circuitry; provided, however, that “Chip Designs” shall not include (i) alignment marks or test structures and associated layout and data used in the Process Development Projects for process development, (ii) process kerf test structures, layout, and data of the test chip(s) (including SRAM macro cells and eDRAM macros) as well as such test chips themselves used for the development work of the Process Development Projects unless specifically excluded (for the avoidance of doubt, this phrase means that such structures or macros that are specifically designated as owner proprietary shall not be considered Specific Results), (iii) other product designs (including eDRAM macros) as mutually agreed by the Parties to be used as qualification vehicles in the Process Development Projects, or (iv) ESD protection devices as used in the Project Test Sites and ESD groundrules and models as defined in the Design Manual. For the avoidance of doubt, all of (i) through (iv) above shall be treated as Specific Results to the extent utilized in a Process Development Project.

“CMOS 10S” means a 90 nanometer CMOS logic fabrication process.

“Embedded DRAM” or “eDRAM” means a device that either (i) primarily carries out logic functions, and includes one or more dynamic random access memory (DRAM) cells embedded within logic circuitry on the same semiconductor substrate, or (ii) primarily carries out memory functions, and includes one or more DRAM cells in combination with a static random access memory (SRAM) array on the same semiconductor substrate (including an array of SRAM cells linked with bit lines, word lines, sense amplifiers and decoders).

“Integrated Circuit” means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, “Integrated Circuit” shall include charge-coupled devices (“CCDs”).

“Lithography” shall mean those aspects of Background Know-How and Specific Results directed to (a) process technology-dependent ground rules or process technology-dependent special rules for shapes replication as developed by the Parties for the generation of photomasks used for development and qualification of a semiconductor process technology in the Process Development Projects, (b) resolution enhancement techniques specifically created pursuant to the Process Development Projects to generate mask build data, (c) such photomasks themselves and the data files used therefor as are used in the Process Development Projects, (d) lithography process sequence as utilized in the Process Development Projects, and (e) mask data generation sequence as utilized in the Process Development Projects.

Field of Use
This agreement is for semiconductor industry.

IPSCIO Record ID: 27937

License Grant
The Licensor hereby grants to Licenseea non-exclusive, non-assignable, world-wide right and license to use the Licensor results and the Licensor previous results relating to the work, for the term of this Agreement, only to the extent such licensed use is necessary in the manufacture and sale of the Chip by Licensee. The license granted by Licensor to Licensee shall include the right to fabricate the Chip at any fabrication facility whether owned by Licensee or third party entities, but shall not include the right to sub-license.
License Property
2.1K', VTO, GAMMA, DW, DL and NSUB for all types of MOSFET devices used by the process.
  2.2SPICE LEVEL 3 MOSFET models (DC and AC parameters) for all types of MOSFET devices used by the process.
  2.3Measured IDS-VDS curves for all types of MOSFET devices used by the process including (a) a large square device and (b) an average width, typical length device.
  2.4Measured ring oscillator performance for all operating conditions plus an accurate schematic for the ring oscillator.
   2.5  Junction depths for the tub (s) ana n+/p+ diffusions.
   2.6  Junction breakdown voltages for the tub (s) and n+/p+ diffusions.
   2.7  MOSFET punch-through voltage characteristics.
   2.8  Process cross-section including dielectric material descriptions,permitivities, thickness and interconnect layer thickness.
   2.9  Resistance characteristics of interconnect layers and interlayer contacts.
   2.10 Capacitance of minimum width conductor layers per unit length for various conditions of neighboring conductor layers (i.e. metal 1 over ubstrate, Metal I over substrate and covered by Metal 2, Metal 2 over Metal 1, etc. for the cases where there are adjacent tracks with typical layer to layer spacing).
   2.11 Capacitance values for (a) the wordline per 'In' cells, (b) the entirebitline and (c) the memory cell.
   2.12 DC and AC Metal migration guidelines.
   2.13 Latch-up prevention guidelines.
   2.14 Layout cell of a proven ESD protection structure.
   2.15 Test wafer with sample transistors (if available).
   3.1  A complete list of all layer names with layer definitions and numbering convention.
   3.2  A complete set of geometrical design rules (array and periphery rules).
   3.3  A list highlighting the unusual geometrical design rules which require more involved DRC checking procedures.
   3.4  A diagram showing which layers are connected by which contacts.
   3.5  Seal ring geometric design rules.
   3.6  Minimum acceptable layout grid size.
Field of Use
Licensee desires that Licensor provide it with the engineering design of a 4 Megabit Dynamic Random Access Memory (DRAM) chip in x1 and x4 format.

IPSCIO Record ID: 211899

License Grant
Licensor grants to the South Korean Licensee a worldwide, non-exclusive, non-transferable, non-assignable license under all Licensors Intellectual Property Rights to manufacture, have manufactured, use, offer for sale, import and sell Smart Media.

Licensor grants a worldwide, non-exclusive, non-transferable, non-assignable license under all Intellectual Property Rights to manufacture, have manufactured, use, offer for sale, import and sell Memory Sticks.

Licensor grants a worldwide, non-exclusive, non-transferable, non-assignable license under all Licensor Intellectual Property Rights to manufacture, have manufactured, use, offer for sale, import and sell High-Speed Memory Sticks.

License Property
Licensor has certain proprietary technology related to flash memory controllers, flash memory and system architecture.

Smart Media means a flash memory storage device that meets the Smart Media Specifications.

Flash Controller means a device within Flash Card Products (whether implemented in firmware, hardware and/or software) that controls the operation of a memory within such Flash Card Products.

Flash Card Products means a Flash Memory System on a card having a connector that attaches it to a host system.

Flash Memory System means an integrated circuit memory system that contains one or more interconnected flash memory devices or flash memory integrated circuits, and in-system control, I/O and other support circuit(s) that are interconnected with the flash memory devices or flash memory integrated circuits and necessary to the operation of the memory system.

Field of Use
This agreement relates to memory storage systems for computers.

IPSCIO Record ID: 2151

License Grant
Licensor and Licensee announced on November 14, 2000 that they have reached a settlement agreement concerning the patent infringement actions and all other claims and counterclaims currently before the United States District Courts of the Northern District of California and the District of Delaware.
License Property
Lexar's CompactFlash' and PC Cards (U.S. Patent No. 5,602,987).  These are flash memory and flash memory storage devices.

IPSCIO Record ID: 203531

License Grant
Licensor grants to the Japanese Licensee a worldwide, perpetual, nonexclusive, nontransferable, nonsublicensable right and license to use Licensors Intellectual Property Rights to design, develop, make, have made, sell, use, lease, transfer and otherwise dispose of the Products, the technology license.
License Property
Licensor has developed and is developing a state-of-the-art ferroelectric semiconductor technology.

The Product means any product using the Technology and/or Licensors Improvements in semiconductor devices that incorporate embedded nonvolatile ferroelectric memory, the Embedded Products and/or semiconductor devices that combine ferroelectric memory with RF/ID analog circuitry in a single chip Ferroelectric RF/ID Products.  In no case will the Product be deemed to include standard, nonvolatile ferroelectric semiconductor memory devices.

The Technology means that certain thin-film ferroelectric technology developed and/or owned by Licensor or as to which Licensor has the right to grant a license to Licensee without payment of any compensation to third parties except Licensees employees or Subsidiaries, and which consists of technology pertaining to the manufacture and production of standard, nonvolatile, random access semiconductor memory devices that utilize binary polarization states on the hysteresis curve of ferroelectric material; and, technology pertaining to the material and process for the formation of ferroelectric film, which may be developed and/or owned by Licensor, including all technology and inventions claimed in Licensors patents.

The patent relates to, but is not necessarily limited to Self restoring ferroelectric memory.

Field of Use
The products are to combine ferroelectric memory with RF/ID analog circuitry in a single chip Ferroelectric RF/ID Products.  In no case will the Product be deemed to include standard, nonvolatile ferroelectric semiconductor memory devices.

IPSCIO Record ID: 751

License Grant
The Licensor, on behalf of itself and its Affiliates, hereby grants to Licensee and its Affiliates the following separate and distinct licenses for each product that falls within the definition of a Licensed Product identified JEDEC-compliant memory controllers: a non-exclusive, non-transferable, royalty-bearing, worldwide license, without the right to sublicense, solely under the associated Licensor Applicable Patent Claims, to make including have made, use, Sell, offer for Sale, and/or import the corresponding Licensed Product during the Term.  

Licensor has also been subject to an investigation in the European Union. Licensee was not a party to that investigation, but has recently sought to intervene in the appeal of the investigation.

As a result of Licensor's commitments to resolve that investigation, for a period of five years from the date of the resolution, Licensor must now provide a License to memory controller manufacturers, sellers, and/or companies that integrate memory controllers into other products.

The parties have not signed a release of liability for past damages, nor dismissed any outstanding litigation between the parties.  The terms of the License Agreement are per the agreement that licensor offers as part of its commitment with the European Commission.

License Property
The License Agreement requires that licensee pay licensor royalties for certain specified SDR memory controllers and a higher royalty for certain other memory controllers, including DDR, DDR2, DDR3, LPDDR, LPDDR2, GDDR2, GDDR3, GDDR4, and portions of GDDR5 memory controllers.
Field of Use
Licensee is the world leader in visual computing technologies and the inventor of the GPU, a high-performance processor which generates breathtaking, interactive graphics on workstations, personal computers, game consoles, and mobile devices.  Licensee serves the entertainment and consumer market with its GeForce(R) products, the professional design and visualization market with its Quadro(R) products, and the high-performance computing market with its Tesla(TM) products.

IPSCIO Record ID: 211882

License Grant
Licensor grants to the Singapore Licensee a non-exclusive license under the Licensors Licensed Patents:
– to make Licensees Licensed Products only in Singapore and one Licensee Elected Country;
– to use, import, and lease, offer for sale, sell or otherwise transfer Licensees Licensed Products worldwide;
– to use any apparatus in the manufacture or testing of Licensee Licensed Products and to practice any method or process in such manufacture or testing of Licensees Licensed Products; and
– to have Licensees Licensed Products made in whole or in part by another manufacturer for the use and/or lease, offer for sale, sale or other transfer by Licensee only when the designs and specifications for such Licensees Licensed Products were provided by Licensee to the other manufacturer, whether developed by Licensee or received by Licensee from customers to whom the Licensed Products are to be sold.
License Property
The Licensed Products shall mean Semiconductor Apparatus.

Semiconductor Apparatus shall mean Semiconductor Material, Semiconductor Device, Semiconductor Circuit, Integrated Circuit and/or Semiconductor Memories and any combination of such apparatus with other such apparatus.

'Integrated Circuit' shall mean an integral unit including a plurality of active and/or passive circuit elements formed at least in part of Semiconductor Material and associated on, or in, one substrate comprising the first level of packaging for such elements; such unit forming or contributing to the formation of a circuit for performing electrical or electronic functions.

'Semiconductor Circuit' shall mean a circuit in which one or more Semiconductor Devices are interconnected in one or more paths (including passive circuit elements, if any) for performing fundamental electrical or electronic functions and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Device' shall mean a device and any material therefor, including but not limited to device structures such as transistors, diodes, capacitors, resistors, conductors and dielectrics, comprising a body of one or more Semiconductor Materials and one or more electrodes associated therewith and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Material' shall mean any material whose conductivity is intermediate to that of metals and insulators at room temperature and whose conductivity, over some temperature range, increases with increases in temperature. Such materials shall include, but not be limited to, refined products, reaction products, reduced products, mixtures and compounds.

'Semiconductor Memory' shall mean any instrumentality or aggregate of instrumentalities, which instrumentality or aggregate is designed only for storing digital information, intelligence or data by selectively setting or presetting detectable states in Semiconductor Material forming at least a part of such instrumentality or aggregate, such instrumentality or aggregate may include powering means and auxiliary and/or support circuits (such as regeneration means, true-complement generations means, address decoding means, sensing means and selection means) to control the flow of such information, intelligence or data into and out of such Semiconductor Memory.

Field of Use
This agreement is for the semiconductor industry.

IPSCIO Record ID: 25950

License Grant
The Canadian Licensee will acquire the joint ownership and exclusive world wide licensing rights (together the 'Territory') the following patents related to certain ferromagnetic memory technology known as VEMRAM (previously known as MAGRAM) and covered by U.S. Patent #5,295,097 and the related patent applications (the Vemram Patents) described in the Agreement.
License Property
a. US Patent File No. 5295097

b. EEC Patent File No. 939186441

c. Japan Patent File No. 505547/1994

Magram(TM) memory is the world's first memory to combine all the positive attributes of existing memory technologies w combine non-volatility (retains information even after being shut off) and random read/write access (fast speed), MAGRAM offers a superior memory solution for computers, diagnostic tools, medical equipment, automobiles, and a host of othositive attributes found in various other digital memory technologies including low power consumption, low ceing able to use your computer the instant you turn it on rather than having to wait for it to boot up.

IPSCIO Record ID: 215225

License Grant
The parties previously entered a foundry agreement where Licensee brought up the wafer process technology equivalent to Licensors 0.22um DRAM CM72 wafer process technology.  Licensee desires to make better use of the technology.

The Japanese Licensor grants to Chinese Licensee a non-transferable, non-exclusive, worldwide license to use Licensors Process Technology, Licensors Product Design and Licensors IPR incorporated or embodied in Licensors Process Technology and Licensors Product Design, to manufacture Licensed Products at Licensees own facilities and to market and sell such manufactured Licensed Products.

License Property
Licensors Process Technology shall mean the front-end manufacturing process technology of 0.22-micron what Licensor calls CM72 for manufacturing Licensed Products and Foundry Products which is owned or developed by Licensor, which Licensor has the right to grant a license to Licensee without payment of any compensation to third parties, and which is described in the Deliverables and has been brought up by Licensee under the Foundry Agreement.

Licensor Product Design shall mean the product design data for Licensed Products which is owned or developed by Licensor, which Licensor has the right to grant a license to Licensee without payment of any compensation to third parties, and which is described in the Deliverables.

The Licensed Products shall mean certain 64Mbit synchronous dynamic random-access memory (SDRAM) devices using Licensor Process Technology and Licensor Product Design whether in a die form or in a wafer form.

Field of Use
Licensee is in the semiconductor manufacturing industry.

IPSCIO Record ID: 223146

License Grant
The Parties agree to have the Licensors license to the Israel Licensee an existing and/or future development of sub-micron memory compilers, including, but not limited to, the memory compilers set forth, which consists of: (i) object code versions of a set of executable software programs, (ii) libraries containing design elements of memory cell arrays and control logic, and (iii) all related documentation, used for generating memory configurations as supplied to Licensee by Licensor, based on Licensee 0.18um technology (the Compilers) for Licensees manufacturing services, and to have Licensor extend the Compilers to its customers.

As between the parties, Licensor exclusively shall have all right, title and interest including all patent rights, copyrights, trade secret rights, mask work rights and other rights throughout the world (collectively Intellectual Property Rights) in any inventions, intellectual property, trademarks, works-of-authorship, mask works, ideas or information made or conceived or reduced to practice by Licensor or by Licensor jointly with Licensee and/or third parties in the course of development of the Compilers.

As between the parties, Licensee exclusively shall have all Intellectual Property Rights in (a) any Licensee Deliverables that exist prior to the Effective Date and (b) any inventions, intellectual property, trademarks, works-of-authorship, mask works, ideas or information made or conceived or reduced to practice by Licensee or by Licensee jointly with Licensor and/or third parties in the course of development of the Licensee Deliverables.

License Property
The Compilers will be an integration of (but not limited to) Licensee-specific memory compilers, which contain bit cells developed by Licensor.

ASAP Products:
2 Port Register File
Single Port SRAM (High Density)
Dual Port SRAM (High Density)
ROM (via 2/3)
Single Port SRAM (High Speed)
Dual Port SRAM (High Speed)

STAR Products:
STAR HS-512k Single Port
STAR HS-512k Dual Port
STAR Memory System

Miscellaneous Products:
NetCAM T-32K

Licensee Deliverables. Licensee agrees to provide Licensor early access to the technical information for use by Licensor solely in connection with developing the Compilers as set forth in this Agreement.

Field of Use
The agreement enables Licensor to develop and license to Licensee, and it's customers, the NOVeA family of non-volatile embedded memories on Licensee's 0.18-micron technology.

NOVeA, which can be reprogrammed numerous times, is designed for integration into system-on-chip (SoC) applications. It is the first non-volatile, electrically alterable embedded memory solution that can be produced using standard logic processes. Most embedded non-volatile memory solutions require special process technology that adds steps and photomasks to fabrication, which increases costs and delivery time. Since NOVeA can be manufactured by using a standard logic process, additional process steps and masks are not necessary, thereby reducing costs and delivery time. By employing sub-micron geometries, NOVeA technology can help reduce overall system size, lower power consumption and increase performance.

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