Royalty Report: Semiconductors, Fabrication, Test/Monitoring – Collection: 286021

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Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 20

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 20

Primary Industries

  • Semiconductors
  • Fabrication
  • Test/Monitoring
  • Scientific & Technical Instruments
  • Material Composite
  • Electrical & Electronics
  • Polymer
  • Business Method
  • Computers & Office Equipment
  • Consumer Electronics
  • Device
  • Laser
  • Optical
  • Telecommunications Equip
  • Mobile
  • Machinery

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 286021

License Grant
University hereby grants to Licensee, subject to the terms herein recited, the exclusive, nontransferable (except as provided in Agreement herein) perpetual, royalty bearing, worldwide right and license under the Patent Rights with the right to grant sublicenses, to make, have made, use, sell and distribute (directly or indirectly through third parties) Licensed Products.
License Property
Patent Rights shall mean
(a)  U.S. Patent 4,710,030, Optical generator and detector of stress pulses.
(b)  U.S. Patent 5,706,094, Ultrafast optical technique for the characterization of altered materials
(c)  U.S. Patent 5,864,393, Optical method for the determination of stress in thin films.
(d)  U.S. Patent 5,748,317, Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector.
(e)  U.S. Patent 5,748,318, Optical stress generator and detector.
(f)  U. S. Patent 5,844,684, Optical method for determining the mechanical properties of a material.

Licensed Product shall not, however, include (i) replacement parts provided or sold to end-users after the initial system is delivered; (ii) all software provided after delivery which does not provide additional  functional capabilities which incorporates the claims of the Patent Rights; (iii) software upgrades or revisions which do not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iv) service and maintenance of hardware and/or software and peripherals to the system.  For purposes of this Agreement, a product shall be deemed a Licensed Product if such product is covered, in whole or in part, by at least one Patent Right in one country, whether or not that product is made, used or sold within that country.  For example, an instrument system that incorporates one of the claims of U.S. Patent 4,710,030 would be a Licensed Product and would be subject to a royalty payment if sold in Japan, even though there is no issued patent in Japan.

Field of Use
This agreement pertains to the semiconductor industry relating to the measurement of the properties of thin films and surface characteristics; and semiconductor metrology automation platforms (FE-III, FE-IV) including, an automatic microscope, auto height, tilt optics platform, automated wafer handling robotics and control system with proprietary software, operation interface, pattern recognition system SECS-II/GEM system, data mapping system, data review system and recipe system, with attendant know-how, process technology and related software; and technology to industry of instruments for the measurement of surface characteristics.

Metal and Opaque Thin Film Measurement Solutions. Licensee's MetaPULSE family of metrology systems incorporates our proprietary technology for optical acoustic metrology, which allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non- contact manner on product wafers. By minimizing the need for test wafers, MetaPULSE enables Licensee's customers to achieve significant cost savings. Licensee believe that Licensee currently offer the only systems that can non-destructively measure up to six metal film layers with the degree of accuracy semiconductor device manufacturers demand. Licensee's MetaPULSE systems use ultra-fast lasers to generate sound waves that pass down through a stack of metal or opaque films such as copper and aluminum, sending back to the surface an echo which is detected and analyzed. These systems precisely measure the films with Angstrom accuracy and sub-Angstrom repeatability at high throughputs. This accuracy and repeatability is critical to semiconductor device manufacturers' ability to achieve higher manufacturing yields with the latest fabrication processes.

IPSCIO Record ID: 27303

License Grant
TWI hereby grants to Japanese company the exclusive right and license, without right of sublicense, to use the TWI Intellectual Property Rights to manufacture, use and sell Products (including those incorporating Improvements) to customers for use in non-semiconductor applications, such as flat panel display.
License Property
OP-LCD System is film measurement system for customers for use in non-semiconductor applications using Beam Profile Reflectometry technology and consisting of (1) Measurement Optics, (2) Sample Stage, (3) Control System and (4) Software, details of which are as follows Patent No. 4,999,014  Method and apparatus for measuring thickness of thin films; 5,042,951  High-resolution ellipsometric apparatus; 5,159,412  Optical Measurement Device with enhanced sensitivity; 5,181,080  Method and apparatus for evaluating the thickness of thin films.

(1)  Measurement Optics

     a. Optics for Beam Profile Reflectometry

     b. Optics for Spectrometry (optional)

     c. Optics for Ellipsometry (optional)

(2)  Sample Stage

     a. XY-0 Stage System

     b. Isolation Unit

(3)  Control System

     a. Main Control System

     b. Auto-focus System

     c. Video Monitoring System

     d. Pattern Recognition System

(4)  Software

     a.   TFMS

     b.   IOPT

Licensed Trademarks
1. Therma-Wave
2. Opti-Probe

IPSCIO Record ID: 6873

License Grant
The Company of Israel  signed a technology-License Agreement, whereby the Company received a patent usage right as well as equipment from an undisclosed Licensor.
License Property
Metrology systems measure various thin film properties, critical circuit dimensions and layer-to-layer circuit alignment, known as overlay, during various steps in the semiconductor manufacturing process, allowing semiconductor manufacturers to increase quality, productivity and yields, lower their manufacturing costs and increase their profitability
Field of Use
The Licensee is a worldwide leading designer, developer and producer of integrated process control metrology systems used in the manufacture of semiconductors and a leading designer, manufacturer and producer of stand-alone process control metrology systems.

IPSCIO Record ID: 27456

License Grant
The Company licensed certain trademarks and technology, and granted to a company headquartered in Kanagawa Prefecture, Japan the exclusive right to manufacture and sell in Japan, Korea, Taiwan, Hong Kong, China, India, the Philippines, Thailand, Vietnam, Malaysia, Singapore and Indonesia, and such other countries as the parties may agree to from time to time, products similar to those manufactured and distributed by the Company.
License Property
The Company designs, develops, manufactures, markets and services chemical mechanical planarization, or CMP, systems used in the fabrication of semiconductor devices as well as other high throughput precision surface processing systems used in the fabrication of thin film memory disk media, semiconductor wafers and general industrial components; products include polishing, grinding and lapping equipment and systems; cleaning systems; other high precision surface processing equipment; and certain other products used in its customers’ manufacturing process, including slurries.

IPSCIO Record ID: 166414

License Grant
Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents to make, use, import, offer to sell, sell and otherwise transfer Products.  Additionally, Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents the right to have Licensees Products made by another manufacturer for the use and/or lease, sale or other transfer only by Licensee and its Subsidiaries.  Such license shall further include the right to incorporate Products as components, subassemblies or subsystems in other products manufactured and/or sold by Licensee and its Subsidiaries.
License Property
The patents relate to coherent semiconductor injection laser array.  The invention relates to optical devices and more particularly relates to solid state lasers.

'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.

Field of Use
Licensee is in the semiconductor industry.

IPSCIO Record ID: 328

License Grant
Japanese Licensor hereby grants to Licensee the exclusive License under the Patents, Technical Information and Intellectual Property Rights to manufacture, use, offer for sale, sell, import and/or lease the Products in the territory; provided, however, Licensee agrees not to manufacture any of the three Products listed in this Agreement at any time on or prior to June 30, 2006; provided further, however, that Licensee may start on the effective date to manufacture, use, offer for sale, sell, import and/or lease in the territory all subsystems related to any Products, including, but not limited to, the Nison Vesper submodule. For the avoidance of doubt, Licensor acknowledges and agrees that the License granted to Licensee under this Agreement includes the right of the Licensee to subLicense to any purchaser of the Products the right to use (but not manufacture) the Patents, Technical Information and Intellectual Property Rights.
License Property
Licensor was incorporated to, among other things, manufacture and distribute certain products and systems of Licensee in Japan in accordance with a Shareholders Agreement dated June 5, 1991.  This license is a result of Licensor buying a portion of the business of a semiconductor manufacturing equipment business and licensing back rights to Licensee.

The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers.  Three products are covered by this agreement Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.

Patent

Title
No.
number

number
Country

1
Method of recirculation of high temperature etching solution
63–248757
02–096334

1653241
Japan

2
Cleaning/ rinsing vessel for semiconductor wafer
03–350731
05–166787

2013691
Japan

3
Method for refinig etchant
05–253672
07–086260

3072876
Japan

4
Single wafer spin etching method
07–104581
08–279485

3459137
Japan

5
Etching method with hot phosphoric acid
07–216528
09–045660

3459141
Japan

6
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
07–163075
08–334461

N/A
Japan

7
Regeneration treatment apparatus for etchant and etching apparatus using the same
10–095836
11–293479

N/A
Japan

8
Cleaning apparatus
11–199868
2001–028356

N/A
Japan

9
Filter device with bellows damper and chemical–circulation treatment device for semiconductor wafer using the same
11–222204
2001–046815

N/A
Japan

10
Semiconductor wafer cleaning system
11–234855
2001–060574

N/A
Japan

11
Method of etching semiconductor wafer
11–271065
2001–093876

N/A
Japan

12
Device and method for etching semiconductor wafer
11–314794
2001–135611

N/A
Japan

13
Scrub cleaning device
2000–044343
2001–237209

N/A
Japan

14
Cleaning Equipment of wafer
2000–274592
2002–093764

N/A
Japan

15
Equipment and method for processing solution for semiconductor wafer
2001–009915
2002–217165

N/A
Japan

16
Wafer–cleaning device
2001–158580
2002–353183

N/A
Japan

17
The apparatus and the method of etching wafer
2002–42120
2003–243353

N/A
Japan

18
The apparatus of reclaiming etching liquid and method and apparatus of etching
2002–269405
N/A

N/A
Japan

19
The method of controlling the boiling chemical
2002–318730
2004–153164

N/A
Japan

20
The apparatus and the method of floating wafer chuck
2002–108651
2003–303871

N/A
Japan

21
The apparatus of wafer treatment and shaft
2003–47148
N/A

N/A
Japan

22
Etching method and equipment
2002–324795
2004–158746

N/A
Japan

23
Processing method and processing device before wafer inspection
2001–266653
2003–75312

N/A
Japan

24
Processing method and processing device before wafer inspection
2002–156835
2003–344243

N/A
Japan

25
Method for recirculating high–temperature etching soluthin
412444
N/A

4980017
USA

26
Method for purification of etching solution
305334
N/A

5470421
USA

Trademarks

Class of

NO
Trademark
goods
Designated goods

1 NISON
7
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments

2 NISON
9
Automatic fluid– composition control machines and instruments

3 CENOTE
7
The apparatus of wafer etching, chemical machines and instruments

4 Stelna
7
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.

Remark An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.

Product
Product Name

Description

Spin Processor CENOTE
Single Wafer Wet Station

Best

                Wafer Backside Etcher

Wet Station

Immersion Process System

Field of Use
Products means any and all products, systems and subsystems now or hereafter produced by or under control of Licensee based upon the Technical Information given under this Agreement which are in the field of surface conditioning, cleaning, etch and stripping technology such as the Technical Information used in the products to this Agreement and any products, systems and subsystems to be used in the Field which will be developed, designed or invented, or otherwise acquired by Licensor in the future during the term of this Agreement.

IPSCIO Record ID: 553

License Grant
Licensor grants to Japanese Licensee a non-exclusive, except during the Exclusivity Period of ten years from the transaction date, transferable, perpetual license to use the Licensee Technology in the FPD Field to make and have made, use, sell, offer for sale and import FPD Film Thickness Measurements Systems and to provide technical support and service (including the sale and for such FPD Film Thickness Measurement Systems.
License Property
Licensed IP means the Nanometrics Technology, the Nanometrics Software and the Licensed Marks.

Licensed Marks means the trademarks of Nanometric.

Licensor designs, develops, manufactures, sells and supports a Film Thickness Measurement System optimized and specially adapted for the measurement of thin films on FPD, including its “NanoSpec” series of products (“FPD Film Thickness Measurement System”).  â€œFPD” means a liquid crystal display, plasma display, field emission display, electroluminescent display, LTPS, HTPS, LCOS or other like flat panel display. FPD excludes devices and technologies other than FPD, including without limitation any and all semiconductor devices.

Field of Use
FPD Field means the development, manufacture, marketing, distribution and sale of Film Thickness Measurement Systems and enhancements thereto for application to FPDs.

IPSCIO Record ID: 27484

License Grant
The Licensor and the Licensee have entered into a certain Joint Development Agreement to development a certain communication product to be manufactured under this Agreement where the Licensor will provide  services to manufacture a certain communication product for the Licensee. Products shall mean certain wafer manufactured Licensor using the Licensor Process with the Licensee Design.
License Property
The Licensor has certain foundry capabilities for manufacturing communication devices.

“Single-Crystal BAW Filter Products or Technology” shall mean acoustic wave piezoelectric raw materials, wafers, resonators or BAW filters where a piezoelectric material is characterized by X-ray diffraction with clear peak at a detector angle (2-?) associated with single crystal film and whose Full Width Half Maximum (FWHM) is measured to be less than 1.0°, or where a piezoelectric material is produced using any and all techniques, excluding a thin film piezoelectric material deposited directly on the resonator metal electrode without use of any single crystal seed layer or wafer material.

Single-crystal bulk acoustic wave (BAW) filters for the mobile-wireless industry, facilitates signal acquisition and accelerates band performance between the antenna and the back end of mobile devices.

Field of Use
The Licensee has a proprietary communication product, related technology, and intellectual property rights related to the development and manufacturing of the Product, and/or Single-Crystal BAW Filter Products or Technology.

IPSCIO Record ID: 282935

License Grant
The English Licensor grants to the Japanese Licensee, and the Licensee accepts, a non-exclusive licence under the Patents and any Know-how, upon and subject to the provisions of this Agreement
(a)
to make or manufacture LEP Devices, which devices may implement the TMA architecture and/or use the TMA algorithm (but not to manufacture or have manufactured LEP material or Total Matrix Addressing Driver Chips, or any other semiconductor device).
(b)
to make or manufacture Finished Products incorporating LEP Devices manufactured under the licensed rights granted;
(c)
to use, sell and otherwise deal in the LEP Devices and Finished Products made or manufactured in accordance with the licensed rights granted and (b) in any and all countries of the world;
(d)
to sublicense (either in whole or in part) its licensed rights to manufacture LEP Devices (as granted to a sub-contractor, for the sole purpose of having LEP Devices manufactured on Licensee’s behalf, provided that, in respect of those sub-contractors which are located outside the geographical region of Japan.
License Property
LEP means light emitting polymer material formed from an Electroluminescent Polymer.

Electroluminescent Polymer means any material deposited by solution processing that is electroluminescent and where at least one ingredient is a polymer.

LEP Device means an electronic device (which device is covered by one or more Valid Claim) in which light is generated by LEP to produce (i) a visible representation comprising Glass, a Passive Matrix Module or an Active Matrix Module, as the case may be, and (ii) backlighting to, and solely to the extent the same is necessary for, such visible representation (but excluding any lighting device intended for use primarily as a source of area illumination), which devices may be driven by a TMA Driver Chip and shall be of any resolution and shall have a viewable diagonal dimension which is either (a) equal to or in excess of Ten (10') inches, or (b) equal to less than Twenty Seven (27') inches, whichever the Licensee shall have elected prior to entering into Commercial Production, by serving prior written election on CDT in accordance with this agreement.

TMA means Total Matrix Addressing.

Patent means the patents and patent applications listed; all future patents and patent applications that may be filed by or on behalf of Licesor or a Licensor Group member which are related to LEP display architecture and/or manufacture and which Licensor or a Licensor Group member exclusively owns or jointly owns, has an unrestricted right and ability to grant licenses thereto and such right to grant licences is not conditional upon Licensor or a Licensor Group member making any form of payment or other form of compensation to any relevant third party; and any extension of any such patent and any patent obtained in pursuance of any such application.

4,923,288 – Optical modulators based on polymers
5,247,190 – Electroluminescent devices
5,399,502 – Method of manufacturing of electrolumineschent devices

Finished Product means any article (whether or not complete) produced by or for the Licensee or any member of the Licensee’s Group which incorporates an LEP Device and additional components.

Total Matrix Addressing Driver Chips means row and column driver chips interfacing with either a separate or integrated processor chip capable of running any non-negative matrix factorisation algorithm (or any other algorithm that gives positive values) such that the said row and column driver chips can drive more than one row and column at a time within one subframe. (“TMA Driver Chips” shall be construed accordingly). Total Matrix Addressing is a a form of passive matrix driving where more than one row is addressed at a time, resulting in reduced power consumption and extended panel lifetime.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 4164

License Grant
The Licensor licensed to us TCP-related technology and intellectual property rights.
License Property
Tape Carrier Package Technology (TCP) offer a high number of inputs and outputs, a thin package profile and a smaller footprint on the circuit board, without compromising performance. Key package features include surface mount technology design, fine-pitch tape format and slide carrier handling. Because of their flexibility and high number of inputs and outputs, TCPs are primarily employed either for STN-LCD or TFT-LCD driver semiconductors.
Testing of tape carrier packages. We conduct full function testing of LCD and other flat-panel display driver semiconductors with a specially designed probe handler to ensure reliable contact to the test pads on the TCP tape. We can test STN-LCD or TFT-LCD driver semiconductors with frequencies of up to 750 MHz and at voltages up to 40V. The test is performed in a temperature-controlled environment with the device in tape form. The assembled and tested LCD and other flat-panel display driver semiconductors in tape form are packed between spacer tapes together with a desiccant in an aluminum bag to avoid contact during shipment.

Assembly of tape carrier packages. TCPs use a tape-automated bonding process to connect die and tape. The printed circuit tape is shipped with a reel. The reel is then placed onto an inner lead bonder, where the LCD or other flat-panel display driver semiconductor is configured onto the printed circuit tape. The resulting TCP component consists of the device interconnected to a three-layer tape, which includes a polyamide-down carrier film, an epoxy-based adhesive layer and a metal layer. The tape metallization area of the interconnections is tin plated over a metal layer. The silicon chip and inner lead area is encapsulated with a high temperature thermoset polymer after inner lead bonding. The back face of the chip is left un-sealed for thermal connection to the printed circuit board.

Field of Use
The Licensee provides gold bumping, testing and assembly services for LCD and other flat-panel display driver semiconductors by employing tape carrier package, or TCP, chip-on-film, or COF, and chip-on-glass, or COG, technologies.

IPSCIO Record ID: 280974

License Grant
Licensor and German Licensee are parties to certain litigation involving the 761 patent.

With this interim patent license, the Licensor grants to the German Licensee a non-exclusive, non transferable worldwide license under the Patent Rights, without the right to grant sublicenses, to make, have made, use, sell, offer for sale, and import Licensed Products during the Term of this Agreement.

License Property
Licensor is the owner of patents relating to wet processing of semiconductors.

Licensed Products shall mean drying equipment, wet bench products, and replacement parts .

Dryer Module shall mean drying equipment in an enclosed, self-contained, physically separate unit which performs rinsing and drying but no chemical treatment operation.

Field of Use
The field of use is the semiconductor wet processing business.

IPSCIO Record ID: 6726

License Grant
In connection with the development agreement Grantee is given a nonexclusive and worldwide license under Grantor Licensed Patents.  Parties have agreed to the joint development of semiconductor apparatus and processes relating to plating technology for advanced packaging and integration solutions in semiconductor processing and manufacturing.
License Property
IHS Product shall mean an Information Handling System or any instrumentality or aggregate of instrumentalities (including, without limitation, any component, subassembly, computer program or supply) designed for incorporation in an Information Handling System. Any instrumentality or aggregate of instrumentalities primarily designed for use in the fabrication (including testing) of an IHS Product shall not be considered to be an IHS Product.

Information Handling System shall mean any instrumentality or aggregate of instrumentalities primarily designed to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, measure, detect, record, reproduce, handle or utilize any form of information, intelligence or data for business, scientific, control or other purposes.

IPSCIO Record ID: 203471

License Grant
Licensors hereby grant to Licensee, for the term of this Agreement, a worldwide and nonexclusive license under the method claims of the licensed patent to make, have made, use, lease, offer to sell, sell, distribute, import or otherwise dispose of licensed products and to use licensed equipment to manufacture licensed products.
License Property
Licensed patent shall mean (i) U.S. Patent No. 5,015,492 titled 'Method and Apparatus for Pulsed Energy Induced Vapor Deposition';

Licensed product shall mean a cryogenic receiver front-end device for wireless communications networks which contains a thin film radio frequency filter manufactured using high-temperature superconducting materials and either pulsed energy deposition or pulsed laser deposition. A list of the current Licensed products of Licensee, is set forth.   Additional Licensed products may be added to this list by Licensee upon written notice to Licensor.

Licensed equipment shall mean an apparatus performing pulsed energy deposition and/or pulsed laser deposition claimed in the Licensed patent.

Field of Use
This agreement pertains to the superconductor industry.

IPSCIO Record ID: 362472

License Grant
Licensor grants to Customer all right, title, and interest in and to said Customer Technology, unless otherwise set forth in a separate agreement related to the use of the Dry Workflow purchased hereunder for a customer program that is signed by Customer, Licensor and such customer.

For the License Grant for Informatics Software and HPC Site License, Licensor grants to Customer a non-exclusive, non-transferable, license, without the right to sublicense, to use the Equipment and to use the Informatics Software identified in the Quote on the Equipment and/or Informatics Hardware for which it was purchased and upon which it was installed, for use by Named Users solely for the purpose of developing and commercializing Products in the Field.

For Customer Improvements, Licensor grants a non-exclusive license to Customer to use any Improvement, other than a Licensor Improvement, on or with any Dry Workflow for which Customer continues to pay the HPC Site License fee and continues to license the HPC-Enabled Informatics Software.

License Property
Licensor has developed proprietary tools to enable high productivity combinatorial experimentation and is in the business of selling, leasing and/or licensing such technology.

Product means a compound or material (or composition of compounds and materials) identified, first synthesized, or discovered in whole or in part through use of the Equipment and/or Informatics Software provided through this Agreement and any derivative thereof whether or not the derivative is identified, first synthesized, modified or discovered in whole or in part through use of any Dry Workflow, but does not include materials or compounds developed independent of use of the Dry Workflow and/or methods of using the same.

Customer Independent Technology means all Intellectual Property Rights that is owned, licensed or otherwise controlled by Customer on or prior to the Effective Date; or created, conceived or reduced to practice by Customer employees, contractors or agents without reliance upon, use of or benefit of the Dry HPC Technology, Dry HPC Technology derivatives, Licensor independent IP, or any technology, know-how or technical information provided by or obtained from an Licensor employee, contractor or agent, directly and or indirectly.

Dry HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques) subject to or covered by any Intellectual Property Right owned by Licensor or licensed to Licensor, provided by Licensor to Customer and Licensor used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than 2 compounds, compositions, mixtures, processes, or synthesis conditions, or the structures derived from such. Dry HPC Technology does not include any of the foregoing Techniques to the extent they were used by Customer prior to the Effective Date, created, conceived or reduced to practice by Customer independent of this Agreement, without reliance on or use or benefit of Alliance Technology, Licensor Independent IP, or any technology, know-how or information provided by or obtained from an Licensor employee, contractor or agent, directly and or indirectly.

HPC-Enabled Informatics Software means Informatics Software and Equipment control software that enables Equipment to use Dry HPC Technology. Non-HPC-Enabled Informatics Software means Informatics Software and Equipment control software that operates Equipment without enabling it to utilize Dry HPC Technology. Use of HPC-Enabled Informatics Software at a Site requires an HPC Site License, in addition to a license to use the software.

Licensor Independent IP means all Intellectual Property Rights that are owned, licensed or otherwise solely controlled by Licensor as of the Effective Date; or created, conceived or reduced to practice by Licensor employees, contractors or agents without reliance, use or benefit of Customer Independent Technology or technology, know-how or technical information provided by or obtained from a Customer employee, contractor or agent, directly and or indirectly and including the Dry HPC Technology.

Informatics Software means machine readable object code versions of the software licensed to be used with the Informatics Hardware, and related documentation, together with any Informatics Updates, if any, that may be provided by Licensor to Customer during its license term. Informatics Software may consist of either HPC-Enabled Informatics Software or Non-HPC-Enabled Informatics Software. Informatics Software does not include Third Party Software.

Metrology/Characterization Technology means technology relating to measurements, systems, methods, techniques, test vehicles, synthetic procedures or combination thereof, used to measure materials or processing characteristics or parameters of wafers, wafer samples or other substrates.

Field of Use
The Field means technologies, methods and embodiments for materials, processes, apparatus, process integration, and device integration, or any combination thereof, used for the research, development, commercialization or manufacturing of integrated circuits and photovoltaic cells.

Dry Workflow means the combination of one or more of the following Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 223115

License Grant
The United Kingdom Licensor grants to Licensee of the Netherlands an indivisible, non-exclusive license under the Basic Patent Rights, without the right to grant sublicenses, to manufacture, to use and to sell or otherwise dispose of Remuneration Products.

Licensor grants a worldwide, indivisible, non-exclusive license under Licensors Licensed Patent Rights, without the right to grant sublicenses, to manufacture, to use and to sell or otherwise dispose of Products in any and all countries of the world.

License Property
The Basic Patent Rights are for Electroluminescent devices and Method of manufacturing of electroluminescent devices.

The Licensed Patent Rights of either Party shall mean Patent Rights other than Basic Patent Rights relating to the manufacture, structure and operation of polymer electroluminescent devices and entitled to receive the benefit of a priority date before January 1, 2001.

The term Remuneration Products shall mean Products covered by any claim of the Basic Patent Rights.

The Products mean complete polymer electroluminescent devices and arrays of such devices in the form of layers or layer structures incorporating at least a light emitting polymer layer and electrode layers and further optionally incorporating other layers such as for example substrate and supporting layers or protective layers. The term Products excludes devices which are High Information Content Displays. High Information Content Displays are displays with more than 100,000 picture elements (pixels).

Field of Use
Licensee is in the business of manufacturing and selling polymer electroluminescent devices.  The patents focus is semiconductors.

IPSCIO Record ID: 227276

License Grant
The Parties have agreed to transfer and to license certain patents relating to wafer and/or reticle containers, Ports, material handling systems and/or Tracking Systems.  

Licensor hereby sells, assigns, transfers and otherwise conveys to Licensee Cayman the entire right, title and interest in and to the specific Patents and Applications identified and any foreign counterparts, and all other patents or applications that now or in the future claim priority to any Patent or Application identified.

Licensee and Licensee Cayman grant to Licensor and Licensors Subsidiaries a world-wide, fully paid, exclusive, non-transferable license, including the right to grant sublicenses, under all Exclusive Rights Patents owned or licensable by Licensee Cayman or Licensee to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, all products except Acquired Products.

Licensor grants to Licensee Cayman a a world-wide, fully paid, exclusive, non-transferable license, including the right to grant sublicenses, under all Combined Pod and Port Patents owned or licensable by Licensor to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, Acquired Products.

Licensee Cayman and Licensee grant to Licensor and Licensors Subsidiaries a a world-wide, fully paid, nonexclusive, non-transferable license under Pod and Carrier Patents owned or licensable by Licensee Cayman or Licensee to (a) conduct development, research, testing, or demonstration of Acquired Products, provided that Licensor does not transfer Acquired Products to third parties for purposes other than development, research, testing, or demonstration, and (b) to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, Non-Plastic Flat Panel Display Products.

Licensee Cayman and Licensee grant to Licensor and Licensors Subsidiaries a a world-wide, fully paid, nonexclusive, non-transferable license under all Port Patents, MHS Patents, Environmental Control Patents, and AutoID/Lot Tracking Patents owned or licensable by Licensee Cayman or Licensee to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, all products except Acquired Products.

Licensor grants to Licensee Cayman a a world-wide, fully paid, nonexclusive, non-transferable license under Pod and Carrier Patents, MHS Patents, Environmental Control Patents, and AutoID/Lot Tracking Patents owned or licensable by Licensor to make, have made, use, sell, offer to sell, import, export, and otherwise dispose of, anywhere in the world, Acquired Products.

License Property
Licensed Trademarks means the marks ASYST(R), A S Y S T(R), and A(R).

Pod and Carrier Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to sealable, transportable containers, wafer and/or reticle carriers and containers, or components of wafer and/or reticle carriers and containers, including, but not limited to, the patents identified below.

US 4,739,882 – Container having disposable liners
US 4,815,912 – Box door actuated retainer
US 4,995,430 – Sealable transportable container having improved latch mechanism

Combined Pod and Port Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to (a) the combined structure of a wafer or reticle container and a Port or (b) the operation of a wafer or reticle container and a Port, including, but not limited to, the patents identified.

Port Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to the structure and/or operation of a Port.

MHS Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to the structure and/or operation of a material handling system for transporting, storing, delivering and/or loading wafer and/or reticle containers or individual wafers in the manufacture of semiconductor devices, or components of such a system.

Environmental Control Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims directed to environmental control features of Ports for controlling the environment inside of wafer and/or reticle containers, including purging systems, including, but not limited to, the patents identified in this Agreement; provided, however, that Environmental Control Patents do not include patents with claims principally directed to environmental control features within wafer and/or reticle containers.

Autoid/Lot Tracking Patents means United States and foreign patents issued on or before the seventh anniversary of the Effective Date having claims principally directed to systems or components of systems used to track, identify, manage, control and route lots, carriers, wafers and/or reticlesduring the manufacture of semiconductors or semiconductor wafers, including, but not limited to, the patents identified.

Licensed Patents means Pod and Carrier Patents, Port Patents, Combined Pod and Port Patents, MHS Patents, Environmental Control Patents, and AutoID/Lot Tracking Patents.

Exclusive Rights Patents means the Patents and Applications identified in this Agreement and all foreign equivalents and counterparts, divisions, continuations, continuations-in-part, reexaminations, and reissues of such Patents and Applications.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 362471

License Grant
The parties entered into discussions in March 2007 and signed an LOI in May 2007 to align their interests with respect to the development and sale by Licensor of a workflow for Wets Processing as contemplated in this Agreement.  The Parties entered into the Alliance Agreement and began working on a collaborative development program directed at a cleans application.

This Agreement sets forth terms and conditions under which Licensor may sell to Licensee one or more Wets Workflows, and the terms and conditions under which Licensor may provide related Services.

Licensor will grant and hereby grants to Licensee all right, title, and interest in and to said Licensee Technology.  For the Proprietary Rights, between Licensee and Licensor, Licensee shall be the sole owner of all right, title, and interest in and to
–    the Licensee Independent Technology,
–    Intellectual Property Rights; relating to Materials or Products and methods of using Materials or
Products,
–   Metrology/Characterization Technology that is not HPC Technology, and
–   Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

For the License Grant for Informatics Software; HPC Site License, Licensor grants a nonexclusive, nontransferable, license, without the right to sublicense, to use the Equipment and install and execute the Informatics Software identified in the Purchase Documentation on the Equipment and/or Informatics Hardware for which it was purchased and upon which it was installed, for use by Named Users, for the term specified in the Purchase Documentation, solely at the Site, and solely for the purpose of developing and commercializing Materials, Wets Processing, Products, and Materials Manufacturing Technologies in the Field.

For Licensee Improvements Licensor grants a non-exclusive license to Licensee to use any Improvement, other than an Licensor Improvement, on or with any Wets Workflow for which Licensee continues to pay the HPC Site License fee and continues to license the HPC-Enabled Informatics Software.

License Property
As between the Parties, Licensee shall be the sole owner of all right, title, and interest in and to
– the Licensee Independent Technology,
– Intellectual Property Rights; relating to Materials or Products and methods of using Materials or Products,
– Metrology/Characterization Technology that is not HPC Technology, and
– Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

As between the Parties, Licensor shall he the sole owner of the Licensor Independent IP, Metrology/ Characterization Technology that is HPC Technology, HPC Technology, and any improvements to any of the foregoing (Licensor Technology).

Agreement WF Compound means any Lead WF Compound or Derivative WF Compound.  Lead WF Compound means a compound or material identified, first synthesized, or discovered in whole or in part through use of any Wets Workflow provided through this Agreement.

Product means a Material that incorporates an Agreement WP Compound or utilizes an Agreement WF Compound in its manufacture and/or methods of using the same.

Equipment means Wets Workflow hardware tools (excluding Informatics Hardware) that may be sold pursuant to this Agreement, conforming to the Specifications set forth in the Purchase Documentation.

HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques)
–  subject to or covered by any Intellectual Property Right owned by Licensor or licensed to Licensor,
–  provided by Licensor to Licensee and
–  used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis; conditions, or the structures derived from such.

Field of Use
The field of use applications include Post-CMP Cleans (Cu); Post Etch Dielectric Contact Clean; TDDB Dielectric Enhancement Layers; All wet solution for HDIS; Reclaim (SiC); HDA replacement, and other related Wets workflow opportunities in the semiconductor industry.

Wets Processing means a set of operations for the development or application of liquid or fluid-based Materials, which Materials are used in semiconductor manufacturing for cleaning, etching, or electro less deposition.

Wets Work flow means the combination of one or more of the following as described in the applicable Quote Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 3598

License Grant
The Company entered into an additional Agreement acquiring an Exclusive License to manufacture, sell and provide services and parts support for certain reactive ion etch semiconductor manufacturing equipment for wafer sized up to 200mm now marketed under the ASI trade names Arista and Arista Dual.
License Property
Products as used herein shall mean certain reactive ion etch semiconductor manufacturing equipment for wafer sizes up to 200mm under the trade names Bobcat 209 or Cheetah (limited to such equipment that includes at least one reactive ion etch chamber) including software, components and parts therefor.
Field of Use
Dry strip semiconductor manufacturing equipment As part of the chip creation process, a light sensitive, polymer-based liquid, called photoresist, is spread in a uniformly thin film on the wafer in pattern creating a stencil effect. Photostabilization uses ultraviolet light to harden, or cure, the photoresist so that it is more effective in maintaining the desired pattern during the subsequent implant processes and etch steps (in which the top layer of the surface of the wafer not covered by photoresist is removed). After these steps, the photoresist is no longer.

IPSCIO Record ID: 6602

License Grant
Austrian Licensor hereby grants to Licensee a license under Infineon Background IPR to use the to make Licensed Products and to sell and offer to sell such Licensed Products to its customers. This agreement granted a non-exclusive License to incorporate the technology developed under the Development Agreement into Licensee products based on the Stratus S200 tool platform. The License does not commence until January 1, 2014.
License Property
Intellectual Property Rights” shall mean any patents, patent rights, trademarks, service marks, registered designs, applications for any of the foregoing, copyright, unregistered design right and any other similar protected rights in any country.

Licensed Product/s shall mean any product based on the tool platform of NEXX Stratus 5200.

Pursuant to the terms of the Development Agreement we entered into with Infineon in September 2008, we have agreed to carry out the development of customized tool features, based on our Stratus S200 tool platform, and to provide Infineon with the results of this development work for use in Infineon’s manufacturing process for logic and semiconductors. Infineon will own the results of the development work other than any enhancements to the tool platform, which shall belong to us.

Field of Use
The Licensee meets the demand for smaller, high performance packages in the electronics industry, by designing, manufacturing, selling, installing and servicing highly-engineered semiconductor process equipment that automates the packaging of semiconductor devices. Advanced packaging process solutions include electrochemical deposition (ECD) systems used to deposit metal layers to plate wafer bumps or copper pillars and redistribution layers as well as fill 3D TSVs.

IPSCIO Record ID: 480

License Grant
The Licensor  hereby grants a sole and exclusive, worldwide, royalty-bearing right and license under the Licensed Patent Applications and the Licensed Patents to make, have made, use, sell, offer for sale, lease and otherwise dispose of Licensed Products in the Licensed Territory in the Licensed Field of Use.  Licensee accepts the terms and conditions required for sublicensees as outlined in the UC License.
License Property
Licensed Product, singular or plural, shall mean any Atmospheric Pressure Plasma Jet Technology wherein the manufacture, use, offer for sale, sale or importation of Atmospheric Pressure Plasma Jet Technology by Licensee would, but for the rights and license granted herein, constitute an infringement of a valid and enforceable claim of a subsisting Licensed Patent and shall not include Licensee's standard power delivery equipment (i.e., stand alone Licensee's power supplies and match networks) but includes power generation and delivery equipment which is designed specifically as an integral and indivisible part of the Atmospheric Pressure Plasma Jet Technology.

'Deposition Process Technology' means processes for depositing compositions of matter, including Deposition Precursor Technology, onto substrates using Deposition Plasma Jet Technology.  Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks.

Surface cleaning is a fundamental requirement for many industrial processes. It is also important for decontamination of objects. Traditionally, surface cleaning has been accomplished using solvent-based methods, technologies which have been available for more than 100 years. Increasing concerns about ground water and air pollution, greenhouse gases, and related health and safety issues have severely restricted the use of common volatile organic solvents, and even many of the recently-adapted, less hazardous chemical substitutes.  Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks. Plasmas ranging in pressure from high vacuum (<0.1 mTorr) to several Torr are most common, and have been used for film deposition, reactive ion etching, sputtering and other forms of surface modification. The primary advantage of plasma cleaning is that it is an 'all-dry' process, generates minimal effluent, does not require hazardous pressures, and is applicable to a wide variety of vacuum-compatible materials, including silicon, metals, glass, and ceramics.

Field of Use
'Licensed Field of Use shall mean all fields in which Licensee can demonstrate that it is one of the top three leading vendors in market share in each of such fields, as demonstrated by dollar volume of sales in the preceding year, including but not limited to Semiconductor Processing, Data Storage (including but not limited to magnetic and optical), Flat Panel and Electronic Displays, and Architectural Glass, and in any other field mutually agreed upon.
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