Royalty Report: Semiconductors, Fabrication, Laser – Collection: 28220

License Grant

We entered into a license agreement with the University granting us exclusive worldwide rights relating to aluminum free high power semiconductor diode lasers under patent rights of the University.

License Property

The patent rights and the license with University cover all production methods, including, but not limited to Molecular Beam Epitaxy and Metal Organic Chemical Vapor Deposition.

Field of Use

The Licensee produces high power semiconductor diode laser wafers and bars or HPDLs, and to market these products worldwide.

License Grant

This agreement is an exclusive license on the Desorption Mass Spectrometric technology as it applies to laser technology.  The Licensor, government organization, has received a patent with respect to the Desorption Mass Spectrometric technology.

License Property

U.S. Patent No. 5,543,170 entitled 'Desorption Mass Spectrometric Control of Alloy Composition During Molecular Beam Epitaxy'

Field of Use

Licensee produces high power semiconductor diode laser wafers and bars or HPDLs, and to market these products worldwide.

License Grant

Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents to make, use, import, offer to sell, sell and otherwise transfer Products.   Additionally, Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents the right to have Licensees Products made by another manufacturer for the use and/or lease, sale or other transfer only by Licensee and its Subsidiaries.  Such license shall further include the right to incorporate Products as components, subassemblies or subsystems in other products manufactured and/or sold by Licensee and its Subsidiaries.

License Property

The patents relate to coherent semiconductor injection laser array.  The invention relates to optical devices and more particularly relates to solid state lasers.

'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.

Field of Use

Licensee is in the semiconductor industry.

License Grant

Licensor and German Licensee are parties to certain litigation involving the 761 patent.

With this interim patent license, the Licensor grants to the German Licensee a non-exclusive, non transferable worldwide license under the Patent Rights, without the right to grant sublicenses, to make, have made, use, sell, offer for sale, and import Licensed Products during the Term of this Agreement.

License Property

Licensor is the owner of patents relating to wet processing of semiconductors.

Licensed Products shall mean drying equipment, wet bench products, and replacement parts .

Dryer Module shall mean drying equipment in an enclosed, self-contained, physically separate unit which performs rinsing and drying but no chemical treatment operation.

Field of Use

The field of use is the semiconductor wet processing business.

License Grant

The Parties previously entered into three (3) technology license agreements relating to a technology known as C-4 plating technology in which certain license rights were granted to Licensee.  The Parties desire to extend the license rights previously granted.

Licensor extends the license rights granted in the C-4 Agreements for Licensee to perform Bumping on 300mm semiconductor wafers solely for Licensee only in the Dresden Facility, manufacture Licensed Products solely for Licensee only in the Dresden Facility using Bumping on 300mm semiconductor wafers, use solely for Licensee Licensed Products only in the Dresden Facility using Bumping on 300mm semiconductor wafers, sell and have sold worldwide solely under the Licensee brand name Licensed Products manufactured using Bumping on 300mm semiconductor wafers, and manufacture only in the Dresden Facility and have manufactured by Another Manufacturer for Licensee’s internal use only, any apparatus designed or modified to implement Bumping of 300mm semiconductor wafers.

Licensor grants the right to use the Licensed Technology to perform Bumping of 200mm semiconductor wafers for third parties.

The license rights extended to Licensee are nonexclusive, nontransferable and revocable.

License Property

Bumping shall have the meaning in the C-4 Plating Technology Transfer and Licensing Agreement.  Typically, Wafer bumping is an essential to flipchip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where “bumps” or “balls” made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips.

Field of Use

The agreement relates to the semiconductor industry.

License Grant

Japanese Licensor hereby grants to Licensee the exclusive License under the Patents, Technical Information and Intellectual Property Rights to manufacture, use, offer for sale, sell, import and/or lease the Products in the territory; provided, however, Licensee agrees not to manufacture any of the three Products listed in this Agreement at any time on or prior to June 30, 2006; provided further, however, that Licensee may start on the effective date to manufacture, use, offer for sale, sell, import and/or lease in the territory all subsystems related to any Products, including, but not limited to, the Nison Vesper submodule. For the avoidance of doubt, Licensor acknowledges and agrees that the License granted to Licensee under this Agreement includes the right of the Licensee to subLicense to any purchaser of the Products the right to use (but not manufacture) the Patents, Technical Information and Intellectual Property Rights.

License Property

Licensor was incorporated to, among other things, manufacture and distribute certain products and systems of Licensee in Japan in accordance with a Shareholders Agreement dated June 5, 1991.  This license is a result of Licensor buying a portion of the business of a semiconductor manufacturing equipment business and licensing back rights to Licensee.

The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers.  Three products are covered by this agreement: Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.

Patent:

Title
No.
number

number
Country

1
Method of recirculation of high temperature etching solution
63–248757
02–096334

1653241
Japan

2
Cleaning/ rinsing vessel for semiconductor wafer
03–350731
05–166787

2013691
Japan

3
Method for refinig etchant
05–253672
07–086260

3072876
Japan

4
Single wafer spin etching method
07–104581
08–279485

3459137
Japan

5
Etching method with hot phosphoric acid
07–216528
09–045660

3459141
Japan

6
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
07–163075
08–334461

N/A
Japan

7
Regeneration treatment apparatus for etchant and etching apparatus using the same
10–095836
11–293479

N/A
Japan

8
Cleaning apparatus
11–199868
2001–028356

N/A
Japan

9
Filter device with bellows damper and chemical–circulation treatment device for semiconductor wafer using the same
11–222204
2001–046815

N/A
Japan

10
Semiconductor wafer cleaning system
11–234855
2001–060574

N/A
Japan

11
Method of etching semiconductor wafer
11–271065
2001–093876

N/A
Japan

12
Device and method for etching semiconductor wafer
11–314794
2001–135611

N/A
Japan

13
Scrub cleaning device
2000–044343
2001–237209

N/A
Japan

14
Cleaning Equipment of wafer
2000–274592
2002–093764

N/A
Japan

15
Equipment and method for processing solution for semiconductor wafer
2001–009915
2002–217165

N/A
Japan

16
Wafer–cleaning device
2001–158580
2002–353183

N/A
Japan

17
The apparatus and the method of etching wafer
2002–42120
2003–243353

N/A
Japan

18
The apparatus of reclaiming etching liquid and method and apparatus of etching
2002–269405
N/A

N/A
Japan

19
The method of controlling the boiling chemical
2002–318730
2004–153164

N/A
Japan

20
The apparatus and the method of floating wafer chuck
2002–108651
2003–303871

N/A
Japan

21
The apparatus of wafer treatment and shaft
2003–47148
N/A

N/A
Japan

22
Etching method and equipment
2002–324795
2004–158746

N/A
Japan

23
Processing method and processing device before wafer inspection
2001–266653
2003–75312

N/A
Japan

24
Processing method and processing device before wafer inspection
2002–156835
2003–344243

N/A
Japan

25
Method for recirculating high–temperature etching soluthin
412444
N/A

4980017
USA

26
Method for purification of etching solution
305334
N/A

5470421
USA

Trademarks:

Class of

NO
Trademark
goods
Designated goods

1 NISON
7
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments

2 NISON
9
Automatic fluid– composition control machines and instruments

3 CENOTE
7
The apparatus of wafer etching, chemical machines and instruments

4 Stelna
7
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.

Remark: An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.

Product:
Product Name

Description

Spin Processor CENOTE
Single Wafer Wet Station

Best

                Wafer Backside Etcher

Wet Station

Immersion Process System

Field of Use

Products means any and all products, systems and subsystems now or hereafter produced by or under control of Licensee based upon the Technical Information given under this Agreement which are in the field of surface conditioning, cleaning, etch and stripping technology such as the Technical Information used in the products to this Agreement and any products, systems and subsystems to be used in the Field which will be developed, designed or invented, or otherwise acquired by Licensor in the future during the term of this Agreement.

License Grant

Licensor and their Netherlands Affiliate hereby grants to Licensee and its Affiliates for the Term a nonexclusive license, with the right to sublicense, under the Licensed Claims to develop, make, have made, use, sell, offer to sell, lease, and import Licensed Products in the Territory and to develop and perform Licensed Processes in the Territory. Nothing in this Agreement is intended to grant a license to anyone to make, use, sell, offer to sell, lease, or import Equipment that infringes any patent owned by Licensor.

License Property

Licensed Product shall mean products comprising Permitted Structures that absent the license granted hereunder, would infringe one or more Licensed Claims.

Licensed Claims shall mean any and all non-Equipment claims entitled to priority to U.S. Serial No. 09/227,679 and/or 60/070,991, including, without limitation, non-Equipment claims in U.S. Patent Nos. 6,749,687 and 7,105,055.

6,749,687 –  In situ growth of oxide and silicon layers
7,105,055 – In situ growth of oxide and silicon layers

The lead technology, named Mears Silicon Technology™, or MST®, is a thin film of reengineered silicon, typically 100 to 300 angstroms (or approximately 20 to 60 silicon atomic unit cells) thick. MST® can be applied as a transistor channel enhancement to CMOS-type transistors, the most widely used transistor type in the semiconductor industrry.

Field of Use

This agreement pertains to the semiconductor industry.

License Grant

The Licensor hereby grants Licensee of Singapore an exclusive license in the territories to use Licensors Wafer Technology to carry on its Business. Licensee may not sublicense Licensors Wafer Technology without first obtaining the written consent of Licensor.

License Property

Licensor is in the business of polishing and reclamation of semiconductor wafers and the brokering of semiconductor wafers used in the electronic industry   Licensor possesses valuable industrial, marketing and commercial information regarding the conduct of the Business to be conducted by Licensee including, without limitation, drawings, formulae, test reports, operating and test procedures, instruction manuals, tables of operating conditions, administration procedures, marketing methods and procedures, advertising copy and computer software programs relating to and/or used in connection with the Business (the 'Licensors Wafer Technology')

Field of Use

Licensee is in the business of polishing and reclamation of semiconductor wafers and the brokering of semiconductor wafers used in the electronic industry.  Licensor and SPM (i) may use Licensors Wafer Technology to the extent that they are conducting business in the Territories on or before the date on which Licensees facility in Singapore commences commercial production and (ii) a Proposing Party may require Licensee to grant a non-exclusive sublicense (but  without the right to sublicense) of Licensors Wafer Technology licensed to Licensee hereunder and to Licensees Wafer Technology to a Relevant Investment Entity, but only for use in such country or countries in the Territories in which such Relevant Investment Entity establishes a facility which uses Licensors Wafer Technology and Licensees Wafer Technology.

License Grant

Licensor grants to Licensee a personal, nontransferable exclusive, royalty-bearing license in the Territory under the Invention Rights to  practice the technology described in the Invention Record and to sell Licensed Products.

License Property

Licensed Products – Lasers, laser subassemblies, and discrete laser components and devices in lasers thereof.

Licensor is in possession of at least license rights in the invention disclosed in Invention Record P.D. File 82-2716 entitled 'R-Line Optical Pumping of Alexandrite Lasers Using Semiconductor Diode Lasers' ('Invention Record') and claimed in U.S. Patent Nos. 5,488,626 and 6,009,114, (such license rights being referred to herein as 'Invention Rights').

License Grant

University hereby grants to Licensee, subject to the terms herein recited, the exclusive, nontransferable (except as provided in Agreement herein) perpetual, royalty bearing, worldwide right and license under the Patent Rights with the right to grant sublicenses, to make, have made, use, sell and distribute (directly or indirectly through third parties) Licensed Products.

License Property

Patent Rights shall mean (a) United States patent number 4,710,030; (b) all United States and foreign patents based upon United States Patent Number 4,710,030 and inventions which are patented and listed in this Agreement hereto; (c) any additions, continuations, continuations-in-part, divisions, reissues or renewals and extensions based thereon; and (d) all United States and foreign patent and other industrial property rights  obtained from any of said United States or foreign patents applications, and reissues and extensions thereof.

(a)  U.S. Patent 4,710,030, Optical generator and detector of stress pulses.
(b)  U.S. Patent 5,706,094, Ultrafast optical technique for the characterization of altered materials
(c)  U.S. Patent 5,864,393, Optical method for the determination of stress in thin films.
(d)  U.S. Patent 5,748,317, Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector.
(e)  U.S. Patent 5,748,318, Optical stress generator and detector.
(f)  U. S. Patent 5,844,684, Optical method for determining the mechanical properties of a material.

Licensed Product shall mean any instrument system, device, software, protocol, or service which is based on or incorporates any claim of the Patent Rights or the claims of inventions listed and is part of the initial instrument system sold to end-users, or provides upgraded capabilities with respect to the Patent Rights.

Licensed Product shall not, however, include: (i) replacement parts provided or sold to end-users after the initial system is delivered; (ii) all software provided after delivery which does not provide additional  functional capabilities which incorporates the claims of the Patent Rights; (iii) software upgrades or revisions which do not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iv) service and maintenance of hardware and/or software and peripherals to the system.  For purposes of this Agreement, a product shall be deemed a Licensed Product if such product is covered, in whole or in part, by at least one Patent Right in one country, whether or not that product is made, used or sold within that country.  For example, an instrument system that incorporates one of the claims of U.S. Patent 4,710,030 would be a Licensed Product and would be subject to a royalty payment if sold in Japan, even though there is no issued patent in Japan.

Field of Use

This agreement pertains to the semiconductor industry relating to the measurement of the properties of thin films and surface characteristics; and semiconductor metrology automation platforms (FE-III, FE-IV) including, an automatic microscope, auto height, tilt optics platform, automated wafer handling robotics and control system with proprietary software, operation interface, pattern recognition system SECS-II/GEM system, data mapping system, data review system and recipe system, with attendant know-how, process technology and related software; and technology to industry of instruments for the measurement of surface characteristics.

Metal and Opaque Thin Film Measurement Solutions. Licensee's MetaPULSE family of metrology systems incorporates our proprietary technology for optical acoustic metrology, which allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non- contact manner on product wafers. By minimizing the need for test wafers, MetaPULSE enables Licensee's customers to achieve significant cost savings. Licensee believe that Licensee currently offer the only systems that can non-destructively measure up to six metal film layers with the degree of accuracy semiconductor device manufacturers demand. Licensee's MetaPULSE systems use ultra-fast lasers to generate sound waves that pass down through a stack of metal or opaque films such as copper and aluminum, sending back to the surface an echo which is detected and analyzed. These systems precisely measure the films with Angstrom accuracy and sub-Angstrom repeatability at high throughputs. This accuracy and repeatability is critical to semiconductor device manufacturers' ability to achieve higher manufacturing yields with the latest fabrication processes.

License Grant

The Company hereby grants a non-exclusive, non-transferable license in the Field of Use under the Patent Rights, without the right to grant sublicenses.

License Property

Licensed Product(s) shall mean certain Marangoni drying equipment and replacement parts used in the manufacture of semiconductors.

Licensed Product(s) shall mean certain drying equipment and replacement parts therefor the use of such equipment having been held to be covered by one or more issued claims of the Patent Rights.

The term 'Patent Rights' shall mean rights under U.S. Patent 4,911,761 – Process and apparatus for drying surfaces.