Created On: 2020-07-15
Record Count: 11
- Material Composite
- Technical Know How
- Scientific & Technical Instruments
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 28220
IPSCIO Record ID: 28221
IPSCIO Record ID: 166414
'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.
IPSCIO Record ID: 280974
With this interim patent license, the Licensor grants to the German Licensee a non-exclusive, non transferable worldwide license under the Patent Rights, without the right to grant sublicenses, to make, have made, use, sell, offer for sale, and import Licensed Products during the Term of this Agreement.
Licensed Products shall mean drying equipment, wet bench products, and replacement parts .
Dryer Module shall mean drying equipment in an enclosed, self-contained, physically separate unit which performs rinsing and drying but no chemical treatment operation.
IPSCIO Record ID: 291104
Licensor extends the license rights granted in the C-4 Agreements for Licensee to perform Bumping on 300mm semiconductor wafers solely for Licensee only in the Dresden Facility, manufacture Licensed Products solely for Licensee only in the Dresden Facility using Bumping on 300mm semiconductor wafers, use solely for Licensee Licensed Products only in the Dresden Facility using Bumping on 300mm semiconductor wafers, sell and have sold worldwide solely under the Licensee brand name Licensed Products manufactured using Bumping on 300mm semiconductor wafers, and manufacture only in the Dresden Facility and have manufactured by Another Manufacturer for Licenseeâ€™s internal use only, any apparatus designed or modified to implement Bumping of 300mm semiconductor wafers.
Licensor grants the right to use the Licensed Technology to perform Bumping of 200mm semiconductor wafers for third parties.
The license rights extended to Licensee are nonexclusive, nontransferable and revocable.
IPSCIO Record ID: 328
The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers. Three products are covered by this agreement: Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.
Method of recirculation of high temperature etching solution
Cleaning/ rinsing vessel for semiconductor wafer
Method for refinig etchant
Single wafer spin etching method
Etching method with hot phosphoric acid
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
Regeneration treatment apparatus for etchant and etching apparatus using the same
Filter device with bellows damper and chemicalâ€“circulation treatment device for semiconductor wafer using the same
Semiconductor wafer cleaning system
Method of etching semiconductor wafer
Device and method for etching semiconductor wafer
Scrub cleaning device
Cleaning Equipment of wafer
Equipment and method for processing solution for semiconductor wafer
The apparatus and the method of etching wafer
The apparatus of reclaiming etching liquid and method and apparatus of etching
The method of controlling the boiling chemical
The apparatus and the method of floating wafer chuck
The apparatus of wafer treatment and shaft
Etching method and equipment
Processing method and processing device before wafer inspection
Processing method and processing device before wafer inspection
Method for recirculating highâ€“temperature etching soluthin
Method for purification of etching solution
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments
Automatic fluidâ€“ composition control machines and instruments
The apparatus of wafer etching, chemical machines and instruments
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.
Remark: An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.
Spin Processor CENOTE
Single Wafer Wet Station
Wafer Backside Etcher
Immersion Process System
IPSCIO Record ID: 89738
Licensed Claims shall mean any and all non-Equipment claims entitled to priority to U.S. Serial No. 09/227,679 and/or 60/070,991, including, without limitation, non-Equipment claims in U.S. Patent Nos. 6,749,687 and 7,105,055.
6,749,687 – In situ growth of oxide and silicon layers
7,105,055 – In situ growth of oxide and silicon layers
The lead technology, named Mears Silicon Technologyâ„¢, or MSTÂ®, is a thin film of reengineered silicon, typically 100 to 300 angstroms (or approximately 20 to 60 silicon atomic unit cells) thick. MSTÂ® can be applied as a transistor channel enhancement to CMOS-type transistors, the most widely used transistor type in the semiconductor industrry.
IPSCIO Record ID: 177530
IPSCIO Record ID: 4178
Licensor is in possession of at least license rights in the invention disclosed in Invention Record P.D. File 82-2716 entitled 'R-Line Optical Pumping of Alexandrite Lasers Using Semiconductor Diode Lasers' ('Invention Record') and claimed in U.S. Patent Nos. 5,488,626 and 6,009,114, (such license rights being referred to herein as 'Invention Rights').
IPSCIO Record ID: 286021
(a) U.S. Patent 4,710,030, Optical generator and detector of stress pulses.
(b) U.S. Patent 5,706,094, Ultrafast optical technique for the characterization of altered materials
(c) U.S. Patent 5,864,393, Optical method for the determination of stress in thin films.
(d) U.S. Patent 5,748,317, Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector.
(e) U.S. Patent 5,748,318, Optical stress generator and detector.
(f) U. S. Patent 5,844,684, Optical method for determining the mechanical properties of a material.
Licensed Product shall mean any instrument system, device, software, protocol, or service which is based on or incorporates any claim of the Patent Rights or the claims of inventions listed and is part of the initial instrument system sold to end-users, or provides upgraded capabilities with respect to the Patent Rights.
Licensed Product shall not, however, include: (i) replacement parts provided or sold to end-users after the initial system is delivered; (ii) all software provided after delivery which does not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iii) software upgrades or revisions which do not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iv) service and maintenance of hardware and/or software and peripherals to the system. For purposes of this Agreement, a product shall be deemed a Licensed Product if such product is covered, in whole or in part, by at least one Patent Right in one country, whether or not that product is made, used or sold within that country. For example, an instrument system that incorporates one of the claims of U.S. Patent 4,710,030 would be a Licensed Product and would be subject to a royalty payment if sold in Japan, even though there is no issued patent in Japan.
Metal and Opaque Thin Film Measurement Solutions. Licensee's MetaPULSE family of metrology systems incorporates our proprietary technology for optical acoustic metrology, which allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non- contact manner on product wafers. By minimizing the need for test wafers, MetaPULSE enables Licensee's customers to achieve significant cost savings. Licensee believe that Licensee currently offer the only systems that can non-destructively measure up to six metal film layers with the degree of accuracy semiconductor device manufacturers demand. Licensee's MetaPULSE systems use ultra-fast lasers to generate sound waves that pass down through a stack of metal or opaque films such as copper and aluminum, sending back to the surface an echo which is detected and analyzed. These systems precisely measure the films with Angstrom accuracy and sub-Angstrom repeatability at high throughputs. This accuracy and repeatability is critical to semiconductor device manufacturers' ability to achieve higher manufacturing yields with the latest fabrication processes.
IPSCIO Record ID: 2080
Licensed Product(s) shall mean certain drying equipment and replacement parts therefor the use of such equipment having been held to be covered by one or more issued claims of the Patent Rights.
The term 'Patent Rights' shall mean rights under U.S. Patent 4,911,761 – Process and apparatus for drying surfaces.