Royalty Report: Semiconductors, Fabrication, Business Method – Collection: 280974

$150.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 8

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 8

Primary Industries

  • Semiconductors
  • Fabrication
  • Business Method
  • Machinery
  • IC
  • RAM

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 280974

License Grant
Licensor and German Licensee are parties to certain litigation involving the 761 patent.

With this interim patent license, the Licensor grants to the German Licensee a non-exclusive, non transferable worldwide license under the Patent Rights, without the right to grant sublicenses, to make, have made, use, sell, offer for sale, and import Licensed Products during the Term of this Agreement.

License Property
Licensor is the owner of patents relating to wet processing of semiconductors.

Licensed Products shall mean drying equipment, wet bench products, and replacement parts .

Dryer Module shall mean drying equipment in an enclosed, self-contained, physically separate unit which performs rinsing and drying but no chemical treatment operation.

Field of Use
The field of use is the semiconductor wet processing business.

IPSCIO Record ID: 2080

License Grant
The Company hereby grants a non-exclusive, non-transferable license in the Field of Use under the Patent Rights, without the right to grant sublicenses.
License Property
Licensed Product(s) shall mean certain Marangoni drying equipment and replacement parts used in the manufacture of semiconductors.

Licensed Product(s) shall mean certain drying equipment and replacement parts therefor the use of such equipment having been held to be covered by one or more issued claims of the Patent Rights.

The term 'Patent Rights' shall mean rights under U.S. Patent 4,911,761 – Process and apparatus for drying surfaces.

IPSCIO Record ID: 328

License Grant
Japanese Licensor hereby grants to Licensee the exclusive License under the Patents, Technical Information and Intellectual Property Rights to manufacture, use, offer for sale, sell, import and/or lease the Products in the territory; provided, however, Licensee agrees not to manufacture any of the three Products listed in this Agreement at any time on or prior to June 30, 2006; provided further, however, that Licensee may start on the effective date to manufacture, use, offer for sale, sell, import and/or lease in the territory all subsystems related to any Products, including, but not limited to, the Nison Vesper submodule. For the avoidance of doubt, Licensor acknowledges and agrees that the License granted to Licensee under this Agreement includes the right of the Licensee to subLicense to any purchaser of the Products the right to use (but not manufacture) the Patents, Technical Information and Intellectual Property Rights.
License Property
Licensor was incorporated to, among other things, manufacture and distribute certain products and systems of Licensee in Japan in accordance with a Shareholders Agreement dated June 5, 1991.  This license is a result of Licensor buying a portion of the business of a semiconductor manufacturing equipment business and licensing back rights to Licensee.

The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers.  Three products are covered by this agreement Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.

Patent

Title
No.
number

number
Country

1
Method of recirculation of high temperature etching solution
63–248757
02–096334

1653241
Japan

2
Cleaning/ rinsing vessel for semiconductor wafer
03–350731
05–166787

2013691
Japan

3
Method for refinig etchant
05–253672
07–086260

3072876
Japan

4
Single wafer spin etching method
07–104581
08–279485

3459137
Japan

5
Etching method with hot phosphoric acid
07–216528
09–045660

3459141
Japan

6
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
07–163075
08–334461

N/A
Japan

7
Regeneration treatment apparatus for etchant and etching apparatus using the same
10–095836
11–293479

N/A
Japan

8
Cleaning apparatus
11–199868
2001–028356

N/A
Japan

9
Filter device with bellows damper and chemical–circulation treatment device for semiconductor wafer using the same
11–222204
2001–046815

N/A
Japan

10
Semiconductor wafer cleaning system
11–234855
2001–060574

N/A
Japan

11
Method of etching semiconductor wafer
11–271065
2001–093876

N/A
Japan

12
Device and method for etching semiconductor wafer
11–314794
2001–135611

N/A
Japan

13
Scrub cleaning device
2000–044343
2001–237209

N/A
Japan

14
Cleaning Equipment of wafer
2000–274592
2002–093764

N/A
Japan

15
Equipment and method for processing solution for semiconductor wafer
2001–009915
2002–217165

N/A
Japan

16
Wafer–cleaning device
2001–158580
2002–353183

N/A
Japan

17
The apparatus and the method of etching wafer
2002–42120
2003–243353

N/A
Japan

18
The apparatus of reclaiming etching liquid and method and apparatus of etching
2002–269405
N/A

N/A
Japan

19
The method of controlling the boiling chemical
2002–318730
2004–153164

N/A
Japan

20
The apparatus and the method of floating wafer chuck
2002–108651
2003–303871

N/A
Japan

21
The apparatus of wafer treatment and shaft
2003–47148
N/A

N/A
Japan

22
Etching method and equipment
2002–324795
2004–158746

N/A
Japan

23
Processing method and processing device before wafer inspection
2001–266653
2003–75312

N/A
Japan

24
Processing method and processing device before wafer inspection
2002–156835
2003–344243

N/A
Japan

25
Method for recirculating high–temperature etching soluthin
412444
N/A

4980017
USA

26
Method for purification of etching solution
305334
N/A

5470421
USA

Trademarks

Class of

NO
Trademark
goods
Designated goods

1 NISON
7
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments

2 NISON
9
Automatic fluid– composition control machines and instruments

3 CENOTE
7
The apparatus of wafer etching, chemical machines and instruments

4 Stelna
7
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.

Remark An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.

Product
Product Name

Description

Spin Processor CENOTE
Single Wafer Wet Station

Best

                Wafer Backside Etcher

Wet Station

Immersion Process System

Field of Use
Products means any and all products, systems and subsystems now or hereafter produced by or under control of Licensee based upon the Technical Information given under this Agreement which are in the field of surface conditioning, cleaning, etch and stripping technology such as the Technical Information used in the products to this Agreement and any products, systems and subsystems to be used in the Field which will be developed, designed or invented, or otherwise acquired by Licensor in the future during the term of this Agreement.

IPSCIO Record ID: 362471

License Grant
The parties entered into discussions in March 2007 and signed an LOI in May 2007 to align their interests with respect to the development and sale by Licensor of a workflow for Wets Processing as contemplated in this Agreement.  The Parties entered into the Alliance Agreement and began working on a collaborative development program directed at a cleans application.

This Agreement sets forth terms and conditions under which Licensor may sell to Licensee one or more Wets Workflows, and the terms and conditions under which Licensor may provide related Services.

Licensor will grant and hereby grants to Licensee all right, title, and interest in and to said Licensee Technology.  For the Proprietary Rights, between Licensee and Licensor, Licensee shall be the sole owner of all right, title, and interest in and to
–    the Licensee Independent Technology,
–    Intellectual Property Rights; relating to Materials or Products and methods of using Materials or
Products,
–   Metrology/Characterization Technology that is not HPC Technology, and
–   Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

For the License Grant for Informatics Software; HPC Site License, Licensor grants a nonexclusive, nontransferable, license, without the right to sublicense, to use the Equipment and install and execute the Informatics Software identified in the Purchase Documentation on the Equipment and/or Informatics Hardware for which it was purchased and upon which it was installed, for use by Named Users, for the term specified in the Purchase Documentation, solely at the Site, and solely for the purpose of developing and commercializing Materials, Wets Processing, Products, and Materials Manufacturing Technologies in the Field.

For Licensee Improvements Licensor grants a non-exclusive license to Licensee to use any Improvement, other than an Licensor Improvement, on or with any Wets Workflow for which Licensee continues to pay the HPC Site License fee and continues to license the HPC-Enabled Informatics Software.

License Property
As between the Parties, Licensee shall be the sole owner of all right, title, and interest in and to
– the Licensee Independent Technology,
– Intellectual Property Rights; relating to Materials or Products and methods of using Materials or Products,
– Metrology/Characterization Technology that is not HPC Technology, and
– Materials Manufacturing Technology, and improvements to any of the foregoing (Licensee Technology) derived through Licensees use of the Wets Workflow purchased herein.

As between the Parties, Licensor shall he the sole owner of the Licensor Independent IP, Metrology/ Characterization Technology that is HPC Technology, HPC Technology, and any improvements to any of the foregoing (Licensor Technology).

Agreement WF Compound means any Lead WF Compound or Derivative WF Compound.  Lead WF Compound means a compound or material identified, first synthesized, or discovered in whole or in part through use of any Wets Workflow provided through this Agreement.

Product means a Material that incorporates an Agreement WP Compound or utilizes an Agreement WF Compound in its manufacture and/or methods of using the same.

Equipment means Wets Workflow hardware tools (excluding Informatics Hardware) that may be sold pursuant to this Agreement, conforming to the Specifications set forth in the Purchase Documentation.

HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques)
–  subject to or covered by any Intellectual Property Right owned by Licensor or licensed to Licensor,
–  provided by Licensor to Licensee and
–  used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis; conditions, or the structures derived from such.

Field of Use
The field of use applications include Post-CMP Cleans (Cu); Post Etch Dielectric Contact Clean; TDDB Dielectric Enhancement Layers; All wet solution for HDIS; Reclaim (SiC); HDA replacement, and other related Wets workflow opportunities in the semiconductor industry.

Wets Processing means a set of operations for the development or application of liquid or fluid-based Materials, which Materials are used in semiconductor manufacturing for cleaning, etching, or electro less deposition.

Wets Work flow means the combination of one or more of the following as described in the applicable Quote Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 367357

License Grant
The parties entered into discussions in March 2007 and signed an LOI in May 2007 to align their interests with respect to the development and sale by Licensor of a workflow for Wets Processing as contemplated in this Agreement.  The Parties entered into the Alliance Agreement and began working on a collaborative development program directed at a cleans application.

This Agreement sets forth terms and conditions under which Licensee may sell to Licensor one or more Wets Workflows, and the terms and conditions under which Licensor may provide related Services.

Licensor grants to Licensee all right, title, and interest in and to Licensee Technology.

License Property
As between the Parties, Licensor shall be the sole owner of all right, title, and interest in and to
– the Licensor Independent Technology,
– Intellectual Property Rights; relating to Materials or Products and methods of using Materials or Products,
– Metrology/Characterization Technology that is not HPC Technology, and
– Materials Manufacturing Technology, and improvements to any of the foregoing (Licensor Technology) derived through Licensors use of the Wets Workflow purchased herein.

As between the Parties, Licensee shall he the sole owner of the Licensee Independent IP, Metrology/ Characterization Technology that is HPC Technology, HPC Technology, and any improvements to any of the foregoing (Licensee Technology).

Agreement WF Compound means any Lead WF Compound or Derivative WF Compound.  Lead WF Compound means a compound or material identified, first synthesized, or discovered in whole or in part through use of any Wets Workflow provided through this Agreement.

Product means a Material that incorporates an Agreement WP Compound or utilizes an Agreement WF Compound in its manufacture and/or methods of using the same.

Equipment means Wets Workflow hardware tools (excluding Informatics Hardware) that may be sold pursuant to this Agreement, conforming to the Specifications set forth in the Purchase Documentation.

HPC Technology means all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof (collectively, Techniques)
–  subject to or covered by any Intellectual Property Right owned by Licensee or licensed to Licensee,
–  provided by Licensee to Licensor and
–  used for the simultaneous parallel or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis; conditions, or the structures derived from such.

Field of Use
The field of use applications include Post-CMP Cleans (Cu); Post Etch Dielectric Contact Clean; TDDB Dielectric Enhancement Layers; All wet solution for HDIS; Reclaim (SiC); HDA replacement, and other related Wets workflow opportunities in the semiconductor industry.

Wets Processing means a set of operations for the development or application of liquid or fluid-based Materials, which Materials are used in semiconductor manufacturing for cleaning, etching, or electro less deposition.

Wets Work flow means the combination of one or more of the following as described in the applicable Quote Equipment; Informatics Hardware; Third Party Software and/or Informatics Software; an HPC Site License.

IPSCIO Record ID: 134397

License Grant
The Licensor released the non-compete clause in the agreement for a royalty payment in the field of pre-owned equipment sales through January 2002.
License Property
The pre-owned equipment is semiconductor production equipment relating to semiconductor manufacturing tools and systems.
Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 362473

License Grant
The Licensor and Licensee of Japan began working on a development program directed at a Dynamic Random Access Memory (DRAM) and Phase Change Memory (PCM) pursuant to the Demonstration Agreement previously executed, the Demonstration Agreement, and continued to work in these areas pursuant to a Letter Agreement executed by the parties on February 27, 2008.

Licensor grants the Licensee of Japan, within the CDP Fields, a worldwide, exclusive, nontransferable license under and to Licensor Inventions and Joint Inventions and any Intellectual Property Rights to use, make, have made, import, offer to sell, sell, lease and otherwise dispose of the Products, to modify or make derivatives of the CDP Developed Technology, and to exercise the limited sublicense rights.

Exclusivity is lost if Licensee and Licensor stop working together pursuant to this Agreement or any extensions thereof in one of the CDP Fields.  Then, the exclusivity for that CDP Field shall expire.

If Licensee does not maintain an exclusive license in accordance with this agreement, Licensor grants to Licensee, within the CDP Fields, a worldwide, non-exclusive, perpetual, non-transferable license under and to Licensor Inventions and any Licensor Intellectual Property Rights to use, make, have made, import, offer to sell, sell, lease and otherwise dispose of the Products, to modify or make derivatives of the CDP Developed Technology, and to exercise the limited sublicense rights.

If Licensee does not maintain an exclusive license in accordance with this agreement, Licensee and Licensor grants to the other a worldwide, non-exclusive, perpetual, non-transferable license, including sublicense rights, without restrictions under and to each party’s Intellectual Property Rights in Joint Inventions without any right of accounting.

Licensor agrees to grant Licensee a world-wide, non-exclusive and non-transferable license under and to Licensor Background IP, for which Licensor has the right to license without payment of a royalty to a Third Party, that is essential for Licensee, and its Affiliate and Third Party Licensees to exploit Licensor Inventions in Products in the CDP Field.

Licensor will provide access, in conjunction with Licensor’s FTE resources and pursuant to the applicable Development Plan, to Licensor’s internal Dry Workflows, Wet Workflows, physical and electrical characterization capabilities, and Informatics Software (Licensor Tools and Software) to perform the CDP Services (HPC Workflow Subscription and Access Fee).

Licensor grants to Licensee a non-exclusive, non-transferable license to use the Informatics Software solely for the purposes of the CDP.

License Property
Product shall mean a product containing one or more semiconductor integrated circuit memory chips manufactured by or for Licensee, a Licensee Affiliate or Third Party Licensee, including through contract manufacturers, utilizing the CDP Developed Technology,

CDP means a Collaborative Development Program.

Critical Parameter Set or CPS shall mean a combination of the material, material stack, process conditions and process integration resulting from the Collaborative Development Program that meet or have the best chance to meet the specification defined by Licensee.

Dry Workflow shall mean physical vapor deposition tools and atomic layer deposition tools using HPC Technology, including, but not limited to, Licensors P-25, P-35, A-30 and AP-30 systems.

Wet Workflows shall mean fluid based processing tools using HPC Technology, including, hut not limited to, Licensees F-10, F-20 and F-30 systems.

HPC Technology shall mean all techniques, methodologies, processes, test vehicles, synthetic procedures, technology, systems, or combination thereof, without reference to any Licensee Confidential Information, used for the simultaneous, parallel, or rapid serial design, synthesis, processing, process sequencing, process integration, device integration, analysis, or characterization of more than two compounds, compositions, mixtures, processes, or synthesis conditions, or the structures derived from such on a single wafer.

Informatics Software shall mean the Licensor software platform enabling the operation of the Dry and Wet Workflows and the gathering and sharing of CDP related information through a web-based interface.

Field of Use
The Field if use for this Development Program Agreement shall mean technologies, methods and embodiments for materials, processes, apparatus, process integration, and device integration, or any combination thereof, used for the research, development, commercialization or manufacturing of integrated circuits.

This CDP field shall mean solid state DRAM semiconductor integrated circuit memory chips.

IPSCIO Record ID: 286101

License Grant
Licensor grants to Licensee, effective upon (and only upon) a Triggering Event, an exclusive, royalty bearing, transferable license to make, have made, use, offer to sell, sell or import Particles for applications in the Field under U.S. patent no. 6,669,823 and all corresponding foreign patents and patent applications, and any trade secrets or other intellectual property owned or controlled by Licensor or its principals relevant to manufacture of Particles in the Field.

Licensor will sell, and Licensee will purchase, all of Licensee’s worldwide requirements for Ceria Particles for applications in the Field. In addition, if, pursuant to Licensee’s request, Licensor develops and produces Other Particles for applications in the Field that meet Licensee’s performance and pricing criteria, Licensor will sell, and Licensee will purchase, all of Licensee’s worldwide requirements for such Other Particles for applications in the Field at a price to be negotiated and agreed by the parties and otherwise on the terms and conditions set forth herein.

For Ceria Particles, the purchase and sale obligations set forth shall be mutually exclusive; i.e., except as specifically otherwise provided herein, for the term of this Agreement,

In consideration of the foregoing premises and the mutual covenants and promises hereinafter set forth, the parties agree as follows
(a)

Licensor and Licensee mutually agree to use all commercially reasonable efforts to cooperate with one another to develop one or more commercial slurry products incorporating the Particles for applications in the Field (the Development Product(s)).
(b)

Without limiting Licensee’s general obligation of cooperation under subsection (a), above, Licensee undertakes to (i) provide Licensor with target specifications, performance data and analytical assistance as may be agreed to characterize Development Product performance, (ii) test and evaluate Development Product samples provided by Licensor and provide feedback as to the results thereof to Licensor in a timely manner, (iii) keep Licensor regularly advised of the general market situation applicable to the Development Products, and (iv) include Licensor business and technical personnel in meetings with business and technical personnel at customers, as appropriate, to discuss and promote the Particles and the Development Products.
(c)

Without limiting Licensor’s general obligation of cooperation under subsection (a), above, Licensor undertakes to (i) provide Licensee with reasonable research samples of the Development Product for testing and evaluation as may be agreed, together with related physical, chemical and other information, (ii) devote sufficient resources (including equipment and personnel) as may be agreed to provide for the development effort, and (iii) provide agreed technical support to Licensee and its customers as to the use of the Particles and the Development Products.

License Property
Particles are cerium oxides particles (ceria) and/or dispersions of Ceria using Licensor’s proprietary processes.

6,669,823 – Process for preparing nanostructured materials of controlled surface chemistry

Other particles and/or dispersions (nanocrystalline or otherwise) developed and manufactured by Licensor using its proprietary processes for use in the Field (such other particles and/or dispersions developed and manufactured by Licensor for use in the Field being hereinafter referred to as Other Particles, and Ceria Particles and Other Particles developed and manufactured by Licensor being hereinafter together referred to as the Particles)

Field of Use
The Field is for potential use by Licensee in products for chemical mechanical planarization (CMP) for semiconductor wafers.
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