Royalty Report: Semiconductors, Fabrication, Material Composite – Collection: 27484

$100.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 4

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 4

Primary Industries

  • Semiconductors
  • Fabrication
  • Material Composite
  • Telecommunications Equip
  • Mobile
  • Test/Monitoring
  • Energy Resources & Svcs
  • Alternative and Renewable Energy
  • Solar
  • Device
  • Laser
  • Optical

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 27484

License Grant
The Licensor and the Licensee have entered into a certain Joint Development Agreement to development a certain communication product to be manufactured under this Agreement where the Licensor will provide  services to manufacture a certain communication product for the Licensee. Products shall mean certain wafer manufactured Licensor using the Licensor Process with the Licensee Design.
License Property
The Licensor has certain foundry capabilities for manufacturing communication devices.

“Single-Crystal BAW Filter Products or Technology” shall mean acoustic wave piezoelectric raw materials, wafers, resonators or BAW filters where a piezoelectric material is characterized by X-ray diffraction with clear peak at a detector angle (2-?) associated with single crystal film and whose Full Width Half Maximum (FWHM) is measured to be less than 1.0°, or where a piezoelectric material is produced using any and all techniques, excluding a thin film piezoelectric material deposited directly on the resonator metal electrode without use of any single crystal seed layer or wafer material.

Single-crystal bulk acoustic wave (BAW) filters for the mobile-wireless industry, facilitates signal acquisition and accelerates band performance between the antenna and the back end of mobile devices.

Field of Use
The Licensee has a proprietary communication product, related technology, and intellectual property rights related to the development and manufacturing of the Product, and/or Single-Crystal BAW Filter Products or Technology.

IPSCIO Record ID: 286021

License Grant
University hereby grants to Licensee, subject to the terms herein recited, the exclusive, nontransferable (except as provided in Agreement herein) perpetual, royalty bearing, worldwide right and license under the Patent Rights with the right to grant sublicenses, to make, have made, use, sell and distribute (directly or indirectly through third parties) Licensed Products.
License Property
Patent Rights shall mean
(a)  U.S. Patent 4,710,030, Optical generator and detector of stress pulses.
(b)  U.S. Patent 5,706,094, Ultrafast optical technique for the characterization of altered materials
(c)  U.S. Patent 5,864,393, Optical method for the determination of stress in thin films.
(d)  U.S. Patent 5,748,317, Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector.
(e)  U.S. Patent 5,748,318, Optical stress generator and detector.
(f)  U. S. Patent 5,844,684, Optical method for determining the mechanical properties of a material.

Licensed Product shall not, however, include (i) replacement parts provided or sold to end-users after the initial system is delivered; (ii) all software provided after delivery which does not provide additional  functional capabilities which incorporates the claims of the Patent Rights; (iii) software upgrades or revisions which do not provide additional functional capabilities which incorporates the claims of the Patent Rights; (iv) service and maintenance of hardware and/or software and peripherals to the system.  For purposes of this Agreement, a product shall be deemed a Licensed Product if such product is covered, in whole or in part, by at least one Patent Right in one country, whether or not that product is made, used or sold within that country.  For example, an instrument system that incorporates one of the claims of U.S. Patent 4,710,030 would be a Licensed Product and would be subject to a royalty payment if sold in Japan, even though there is no issued patent in Japan.

Field of Use
This agreement pertains to the semiconductor industry relating to the measurement of the properties of thin films and surface characteristics; and semiconductor metrology automation platforms (FE-III, FE-IV) including, an automatic microscope, auto height, tilt optics platform, automated wafer handling robotics and control system with proprietary software, operation interface, pattern recognition system SECS-II/GEM system, data mapping system, data review system and recipe system, with attendant know-how, process technology and related software; and technology to industry of instruments for the measurement of surface characteristics.

Metal and Opaque Thin Film Measurement Solutions. Licensee's MetaPULSE family of metrology systems incorporates our proprietary technology for optical acoustic metrology, which allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non- contact manner on product wafers. By minimizing the need for test wafers, MetaPULSE enables Licensee's customers to achieve significant cost savings. Licensee believe that Licensee currently offer the only systems that can non-destructively measure up to six metal film layers with the degree of accuracy semiconductor device manufacturers demand. Licensee's MetaPULSE systems use ultra-fast lasers to generate sound waves that pass down through a stack of metal or opaque films such as copper and aluminum, sending back to the surface an echo which is detected and analyzed. These systems precisely measure the films with Angstrom accuracy and sub-Angstrom repeatability at high throughputs. This accuracy and repeatability is critical to semiconductor device manufacturers' ability to achieve higher manufacturing yields with the latest fabrication processes.

IPSCIO Record ID: 27673

License Grant
Licensor hereby grants and agrees to grant to Licensee, effective upon license Effective Date, a world-wide, non-exclusive, non-transferable, perpetual, irrevocable, fully paid up and royalty-free license, without the right to sublicense, under the Licensor's Intellectual Property Rights, to make, use, sell, offer for sale, import or otherwise commercialize or exploit Licensed Products, to use the Licensor's Technology in connection with the foregoing, and to otherwise operate Licensee and commercialize its products as contemplated in the Master Agreement. It is understood that the foregoing license to Licensee includes, without limitation, the right to change and make improvements and extensions to the Licensor's Technology. Furthermore, it is understood that Licensee shall have the right to commercially exploit such changes and improvements in accordance with such license.  This is to be used in the manufacture of Licensee's solar modules.  

Subject to exceptions in this Agreement, Licensee shall pay royalties to Licensor for the use of MNIP. The royalty shall be based on two main elements the success of the relevant MNIP in achieving Cost Savings and the success of that MNIP in achieving Added Value.  MNIP means Material New IP.

Licensed Products means Wafers, Cells, and/or Modules, as the case may be, in which the Wafers are made using String Ribbon Technology.

License Property
The Licensor develops and manufactures multi-crystalline silicon wafers utilizing String Ribbon™ proprietary wafer technology. The technology involves a unique process to produce multi-crystalline silicon wafers by growing thin strips of silicon that are then cut into wafers. This process substantially reduces the amount of silicon and other processing costs required to produce a wafer when compared to conventional sawing processes. Silicon is the key raw material in manufacturing multi-crystalline silicon wafers. The wafers they produce are the primary components of photovoltaic “PV” cells which, in turn, are used to produce solar panels.

Licensed Products means Wafers, Cells, and/or Modules, as the case may be, in which the Wafers are made using String Ribbon Technology.  This is to be used in the manufacture of Licensee's solar modules.  The Licensor develops and manufactures multi-crystalline silicon wafers utilizing String Ribbonâ„¢ proprietary wafer technology. The technology involves a unique process to produce multi-crystalline silicon wafers by growing thin strips of silicon that are then cut into wafers. This process substantially reduces the amount of silicon and other processing costs required to produce a wafer when compared to conventional sawing processes. Silicon is the key raw material in manufacturing multi-crystalline silicon wafers. The wafers they produce are the primary components of photovoltaic (“PV”) cells which, in turn, are used to produce solar panels (also referred to as solar modules).

IPSCIO Record ID: 166414

License Grant
Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents to make, use, import, offer to sell, sell and otherwise transfer Products.  Additionally, Licensor grants to Licensee and its Subsidiaries a nonexclusive license under the Licensed Patents the right to have Licensees Products made by another manufacturer for the use and/or lease, sale or other transfer only by Licensee and its Subsidiaries.  Such license shall further include the right to incorporate Products as components, subassemblies or subsystems in other products manufactured and/or sold by Licensee and its Subsidiaries.
License Property
The patents relate to coherent semiconductor injection laser array.  The invention relates to optical devices and more particularly relates to solid state lasers.

'Full Wafer Technology' shall mean a batch processing chlorine- assisted ion beam etching technique capable of producing more than one edge emitting semiconductor ridge waveguide laser having a gallium arsenide quantum well active region.

Field of Use
Licensee is in the semiconductor industry.
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