Category: Technology Licenses
Created On: 2022-04-28
Record Count: 10
- Material Composite
- Computers & Office Equipment
- Electrical & Electronics
- Integrated Circuits
- Metals & Metal Products
- Technical Know How
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 26969
SurgeTape means a flexible film of proprietary polymer-based material that can be applied between signal lines and a ground plane that has a high impedance and low leakage state during normal circuit operation. During an electrical overstress (EOS) or electrostatic discharge (ESD) event, the polymer has a low impedance state that shunts the offending charge to the ground plane.
Licensed Intellectual Property Rights shall mean, solely with respect to Licensed Products, Licensorâ€™s interest in any patents, patent applications, inventions, the SurgX trademark, the SurgeTape trademark, Technical Information, and copyrights owned.
Licensed Marks shall mean solely the trademark SurgX' and the trademark SurgeTape(Trademark).
IPSCIO Record ID: 28594
U.S. Patent Number 5,736,910 issued in 1998 and titled â€œModular jack connector with a flexible laminate capacitor mounted on a circuit board.â€
IPSCIO Record ID: 243446
5,148,266 – Semiconductor chip assemblies having interposer and flexible lead
5,148,265 – Semiconductor chip assemblies with fan-in leads
5,258,330 – Semiconductor chip assemblies with fan-in leads
5,282,312 – Multi-layer circuit construction methods with customization features
The term Technology means the Technical Information and Licensor Patent relating to design, manufacture, assembly, packaging, and use of TCC, TLS, TCMT and MCMs including all Packaging-Related know-how owned or controlled and used by Licensor.
The term Packaging-Related, as applied to any item (including any information, idea, invention or know-how, Licenseeâ€™s Improvement or Licensor Patent), means only such item that is both (a) related to TCC, TLS, TCMT and MCMs (limited to the extent MCMs are subject to valid claims in Licensor Patents covering TCC), and (b) substantially related to the physical structures and/or stages of assemblies, components and/or methods for packaging, mounting or connecting semi-conductor chips. Items which relate only to the electrical circuitry embodied in semi-conductor chips or assemblies, and which do not relate to said physical structures or stages of assembly are not Packing-Related.
TCMT for ICs (semiconductor integrated circuit) is Compliant Mounting Tape, a multi-layer flexible film made under or using the Technology comprising a first layer of flexible film with electrical contacts arranged in an area array, each connected to one or more flexible conductors terminating in features disposed and suitable for direct wire bonding to bonding pads of said IC, plus possible optional signal or ground plane wiring layers, and a possible layer of compliant material attached to first said layer on the side opposite the bumps on the BGA.
TLS means proprietary Laminated Substrates for MCMs and IC interconnect substrates made under or using the Technology comprised of sub laminate signal layers and interconnecting interposer layers that may be individually personalized and assembled by means of lamination into electrical interconnecting substrates for use in MCMs or other IC packages.
A TCC is a Compliant Chip, an IC device which is made or packaged under or using the Technology with an area array of coplanar contacts or bumps on a grid spacing (BGA) a TCC comprises an IC die and a thin compliant multi-layer structure mounted to the bonding pad side of said IC die, with permanent flexible electrical connections between at least one of said bumps and corresponding bonding pad(s) on said IC die, where said pad(s) can be arranged on the perimeter, or the interior, or in an area array on the surface of said IC die.
An MCM is a Multi-Chip Module, an IC sub assembly (Daughter Board), made under or using the Technology comprising at least one TCC, including the first wiring substrate it may be attached to, whether permanently attached or not, and further including those ICs, TCCs, components, heat spreaders, sealing caps, and sub assemblies that are ultimately attached or connected to the same first wiring substrate (all of the foregoing and nothing else), and where said IC sub assembly is designed and intended for connection, by means of a socket or other suitable method, to a greater electronic system for data I/O, instructions, control signals, and access to system power and ground.
An MCM Component is a partially completed MCM incorporating at least one TCC, whether permanently attached or not, and which may be arranged to allow for later removal of said TCC(s) and/or further incorporation of other TCCs, chips, passives, heat spreaders, scaling caps, or other components.
IPSCIO Record ID: 282868
to make or manufacture LEP Devices (but not LEP);
to incorporate the LEP Devices into Finished Products;
to design, develop, use, sell, offer for sale, distribute, import, export, Transfer and otherwise deal in the LEP Devices and Finished Products in any and all countries of the world; and
to have LEP Devices (but not LEP) made or manufactured for the Licensee, in whole or in part by a sub-contractor.
LEP Device means an electronic device (of viewable diagonal dimension of 10 inches or more) in which light is generated by a LEP to produce a visible representation, which device is covered by one or more claims of the Licensed Patents.
LEP means light emitting polymer material.
Licensed Patents means all Patents that Licensor Group exclusively owns or jointly owns or shall so own and/or Licensor has or shall have sublicense rights and is generally free to license without any payment to a third party, filed prior to or after the Effective Date which are related to LEP Device architecture and/or manufacture and/or driving schemes for such LEP Devices and in the case of such driving schemes, those which are implemented directly on the LEP Device panel (including but not limited to those schemes utilising organic TFTs) but expressly excluding those Patents that are directed to driving schemes (or algorithms) which are implemented off the LEP Device panel (for the avoidance of any doubt, the Licensed Patents include Patents which are related to driving circuitry used in the Dispay Module).
US 5,523,555 – Photodetector device having a semiconductive conjugated polymer
US 5,698,048 – Photoresponsive materials
US 5,965,901 – Electroluminescent devices with voltage drive scheme
Finished Product means any article or device (whether or not in final form) made by or for the Licensee which incorporates an LEP Device and additional components.
IPSCIO Record ID: 28130
Fine Line Technology Patents. Technology – A conductive metal layer is used in the manufacture of printed circuit boards, aerials, and antennae such as those found in mobile telephones, radio frequency identification devices (RFIDs), smart cards, contacts for batteries and power supplies, arrays of contacts for flat screen technologies (liquidcrystal displays, light emitting polymer displays and the like), electrodes for biological and electrochemical sensors, smart textiles and decorative features.
US Patent No 8435603 Formation of solid layers on substrates
US Patent No 8519048 Formation of solid layers on substrates
IPSCIO Record ID: 223115
Licensor grants a worldwide, indivisible, non-exclusive license under Licensors Licensed Patent Rights, without the right to grant sublicenses, to manufacture, to use and to sell or otherwise dispose of Products in any and all countries of the world.
The Licensed Patent Rights of either Party shall mean Patent Rights other than Basic Patent Rights relating to the manufacture, structure and operation of polymer electroluminescent devices and entitled to receive the benefit of a priority date before January 1, 2001.
The term Remuneration Products shall mean Products covered by any claim of the Basic Patent Rights.
The Products mean complete polymer electroluminescent devices and arrays of such devices in the form of layers or layer structures incorporating at least a light emitting polymer layer and electrode layers and further optionally incorporating other layers such as for example substrate and supporting layers or protective layers. The term Products excludes devices which are High Information Content Displays. High Information Content Displays are displays with more than 100,000 picture elements (pixels).
IPSCIO Record ID: 282935
to make or manufacture LEP Devices, which devices may implement the TMA architecture and/or use the TMA algorithm (but not to manufacture or have manufactured LEP material or Total Matrix Addressing Driver Chips, or any other semiconductor device).
to make or manufacture Finished Products incorporating LEP Devices manufactured under the licensed rights granted;
to use, sell and otherwise deal in the LEP Devices and Finished Products made or manufactured in accordance with the licensed rights granted and (b) in any and all countries of the world;
to sublicense (either in whole or in part) its licensed rights to manufacture LEP Devices (as granted to a sub-contractor, for the sole purpose of having LEP Devices manufactured on Licenseeâ€™s behalf, provided that, in respect of those sub-contractors which are located outside the geographical region of Japan.
Electroluminescent Polymer means any material deposited by solution processing that is electroluminescent and where at least one ingredient is a polymer.
LEP Device means an electronic device (which device is covered by one or more Valid Claim) in which light is generated by LEP to produce (i) a visible representation comprising Glass, a Passive Matrix Module or an Active Matrix Module, as the case may be, and (ii) backlighting to, and solely to the extent the same is necessary for, such visible representation (but excluding any lighting device intended for use primarily as a source of area illumination), which devices may be driven by a TMA Driver Chip and shall be of any resolution and shall have a viewable diagonal dimension which is either (a) equal to or in excess of Ten (10') inches, or (b) equal to less than Twenty Seven (27') inches, whichever the Licensee shall have elected prior to entering into Commercial Production, by serving prior written election on CDT in accordance with this agreement.
TMA means Total Matrix Addressing.
Patent means the patents and patent applications listed; all future patents and patent applications that may be filed by or on behalf of Licesor or a Licensor Group member which are related to LEP display architecture and/or manufacture and which Licensor or a Licensor Group member exclusively owns or jointly owns, has an unrestricted right and ability to grant licenses thereto and such right to grant licences is not conditional upon Licensor or a Licensor Group member making any form of payment or other form of compensation to any relevant third party; and any extension of any such patent and any patent obtained in pursuance of any such application.
4,923,288 – Optical modulators based on polymers
5,247,190 – Electroluminescent devices
5,399,502 – Method of manufacturing of electrolumineschent devices
Finished Product means any article (whether or not complete) produced by or for the Licensee or any member of the Licenseeâ€™s Group which incorporates an LEP Device and additional components.
Total Matrix Addressing Driver Chips means row and column driver chips interfacing with either a separate or integrated processor chip capable of running any non-negative matrix factorisation algorithm (or any other algorithm that gives positive values) such that the said row and column driver chips can drive more than one row and column at a time within one subframe. (â€œTMA Driver Chipsâ€ shall be construed accordingly). Total Matrix Addressing is a a form of passive matrix driving where more than one row is addressed at a time, resulting in reduced power consumption and extended panel lifetime.
IPSCIO Record ID: 179826
Licensor has issued and pending United States and foreign patents, which are hereinafter defined as 'Licensed Patents' relating to multi-layer circuit board construction and fabrication.
Excluded Products shall mean three-dimensional, multi-layer printed circuit boards which are designed or intended to be folded or bent upon installation, or multi-layer flexible circuit boards mountable on a flat rigidized heat sink, and including without limitation Type 3, Type 4 and Type 5 printed circuit or printed wiring boards as defined in MIL/STD- 2118 dated 4 May 1984, a copy of which is attached hereto.
Cap Material shall mean a copper layer having a C stage adhesive coating thereon over which a B stage adhesive coating is provided. This agreement pertains to the electronics relating to multi-layer circuit board construction and fabrication.
IPSCIO Record ID: 153750
Licensor Industrial Property Rights shall mean all Confidential Information and, whether or not the following constitute Confidential Information, all of Licensors patents, licenses, trademarks, trade names, inventions, inventors notes, copyrights, formulea know-how, trade secrets, drawings and designs relating to the Business represented by the Licensed Technology.
Licensed Technology shall mean all of Licensors proprietary technology relating to the Business which has been licensed to Licensee hereunder including, but not limited to, the Patents and the Marks.
The Marks means the trademark 'Licensor Materials' and all trade or service mark registrations (and any applications therefor) associated therewith.
Patents shall mean the following patents (i) U.S. Patent 4,535,029 dated 8/13/85, (ii) U.S. Patent 4,426,423 dated 11/17/84, (iii) U.S. Patent 4,358,506 dated 11/9/82, (iv) U.S. Patent 4,376,806 dated 3/15/83 and (v) U.S. Patent 4,396,677 dated 8/2/83.
4,535,029 – Method of catalyzing metal depositions on ceramic substrates
4,426,423 – Ceramic, cermet or metal composites
4,358,506 – Metal and carbon composites thereof
4,376,806 – Highly adhesive coatings for beryllia
4,396,677 – Metal, carbon, carbide and other composites thereof
The Intragene-TM- process is a proprietary methodology developed by metallurgists and materials scientists at the Company and has been granted six U.S. patents as well as national phase patents based on two European patent applications and three Japanese patents. The Intragene-TM- process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals.
The materials division product line consists of Intragene-TM–based sputtering target assemblies and electromagnet systems. The sputtering target assemblies have been sold into the rigid disk market since 1986 and are considered one of the most reliable such assemblies in the market today. Sputtering target assemblies are sold to end-users as source materials for coating other materials via a vacuum-based process called sputtering. Sputtering is employed as the primary method for depositing thin film functional and protective layers on rigid magnetic media (hard disks), as well as in many semiconductor-manufacturing operations. Once a target is made, it must usually be incorporated into the sputtering apparatus by joining it to a backing plate to make sound electrical, thermal and mechanical contact. The bonding of a target to the backing plate, which is usually made of copper, forms what is known as the 'bonded target assembly.'
IPSCIO Record ID: 368499
— an exclusive license under Licensed Patents to make, have made, use, sell and import PolyFluorene Based Materials in any and all countries of the world. This license includes process technology relating to the Suzuki Coupling reaction;
— a non-exclusive license under Licensed Patents for all process technology relating to the Suzuki coupling reaction for use in making materials other than PolyFluorene Based Materials in any and all countries of the world;
— a non-exclusive license under Licensor Patents to make, have made, use, sell and import PF Ink Jet Formulations in any and all countries of the world, provided that such Intellectual Property is wholly-owned and free to be licensed as of the date of this Agreement, or for later made inventions, as of the date of the invention;
— a non-exclusive license under Licensor Patents relating to Spiro and IndenoFluorones to make, have made, use, sell or import LEPs containing spiro and indenofluorenes in any and all countries of the world, provided that those patents are wholly-owned and free to be sublicensed as of the date of this Agreement, or for later made inventions, as of the date of the invention; and
— a non-exclusive license under Licensors intellectual property to make test devices for screening and developing new materials.
LEP means light emitting polymer relating to large molecule organic electroluminescent material.
Polyfluorene-Based Material means Polyfluorenes; solid compositions containing Polyfluorenes in an amount of at least 1% by weight; and solutions containing Polyfluorenes not including formulations for ink jetting.
PF Ink Jet Formulations Means solutions containing Polyfluorenes for ink jet application.
OLED displays are expected to be deployed in instrument panels and portable electronics such as mobile phones and personal digital assistants, and eventually larger displays for personal computers and consumer products, where they could overtake liquid-crystal display (LCD) technology in the future.
As an emissive display, LEPs need no backlight, which means they can be thinner and lighter than LCDs, as well as more power-efficient. LEP displays are also brighter with richer color, offering sharp, high-contrast images that can easily be viewed from acute angles. Additionally, LEPs in liquid form are unique in that they can be ink-jet printed on glass and plastic, which is a technology advantage that could significantly change the way displays are produced and open new markets and opportunities.
The field of use is semiconductors and related devices.