Royalty Report: Semiconductors, Fabrication, Material Composite – Collection: 26338

$150.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 13

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 13

Primary Industries

  • Semiconductors
  • Fabrication
  • Material Composite
  • Electrical & Electronics
  • Coating
  • Chemicals
  • Metals & Metal Products
  • Coating surface
  • Test/Monitoring
  • Energy & Environment
  • Energy Resources & Svcs
  • Alternative and Renewable Energy
  • Solar
  • Polymer

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 26338

License Grant
The Latvian Licensor further hereby grants to Licensee a nontransferable, exclusive, perpetual license to use Licensor's technical information and other technology existing at the date hereof to put metals with a thickness of 0.1 microns to 5 microns on flexible polymeric substrates in order to produce and sell products, including without limitation the ability to put active and passive electronic components on thin substrates.
License Property
The Licensor, has over a period of years developed and patented valuable technology for depositing various metals onto metal foils, films and fabrics in a vacuum.  The Licensor has developed technology for the deposition of various metals on metal foils and onto films. This technology which employs innovative equipment developed by the Licensor can be used in the production of copper laminates and foils.

Metals as used in this Agreement include, without limitation, copper, aluminum, chrome and lithium, and composites of one or more metals.

Products as used in this Agreement include, without limitation, flexible composites of metals and films, flexible printed circuits, Multichip Modules, single and several chip packages, batteries and displays for use within the electrical interconnect industry.

Field of Use
The Licensee, a leading maker and supplier of ceramics and metal coated foils, films, and fabrics desires to be licensed under the Licensor's patented technology for depositing various metals on metal foils and on polyester film in a vacuum in order to further develop the technology and to market products generated by this technology according to the terms of this Agreement.

IPSCIO Record ID: 153750

License Grant
Licensor grants to Licensee an exclusive, nontransferable, worldwide right and License to use the Licensor Industrial Property Rights solely for the  manufacture, sale, lease, or other disposition of products incorporating the Licensed Technology.  Licensor further grants to Licensee an exclusive, nontransferable right to (i) modify and make derivative works from the Licensor Industrial Property and (ii) subject to the prior written consent of Licensor, which shall not be unreasonably withheld, sublicense the Licensor Industrial Property rights solely for the purposes of manufacture, product development, distribution or related uses.
License Property
The Business shall mean the Intragene and related coating business acquired by Licensee pursuant to the terms of the Purchase Agreement and now operated by Licensee.

Licensor Industrial Property Rights shall mean all Confidential Information and, whether or not the following constitute Confidential Information, all of Licensors patents, licenses, trademarks, trade names, inventions, inventors notes, copyrights, formulea know-how, trade secrets, drawings and designs relating to the Business represented by the Licensed Technology.

Licensed Technology shall mean all of Licensors proprietary technology relating to the Business which has been licensed to Licensee hereunder including, but not limited to, the Patents and the Marks.

The Marks means the trademark 'Licensor Materials' and all trade or service mark registrations (and any applications therefor) associated therewith.

Patents shall mean the following patents (i) U.S. Patent 4,535,029 dated 8/13/85, (ii) U.S. Patent 4,426,423 dated 11/17/84, (iii) U.S. Patent 4,358,506 dated 11/9/82, (iv) U.S. Patent 4,376,806 dated 3/15/83 and (v) U.S. Patent 4,396,677 dated 8/2/83.

4,535,029 – Method of catalyzing metal depositions on ceramic substrates
4,426,423 – Ceramic, cermet or metal composites
4,358,506 – Metal and carbon composites thereof
4,376,806 – Highly adhesive coatings for beryllia
4,396,677 – Metal, carbon, carbide and other composites thereof

The Intragene-TM- process is a proprietary methodology developed by metallurgists and materials scientists at the Company and has been granted six U.S. patents as well as national phase patents based on two European patent applications and three Japanese patents. The Intragene-TM- process facilitates the ability to metallize, solder or braze a wide range of engineering ceramics, graphite and refractory metals.

The materials division product line consists of Intragene-TM–based sputtering target assemblies and electromagnet systems. The sputtering target assemblies have been sold into the rigid disk market since 1986 and are considered one of the most reliable such assemblies in the market today. Sputtering target assemblies are sold to end-users as source materials for coating other materials via a vacuum-based process called sputtering. Sputtering is employed as the primary method for depositing thin film functional and protective layers on rigid magnetic media (hard disks), as well as in many semiconductor-manufacturing operations. Once a target is made, it must usually be incorporated into the sputtering apparatus by joining it to a backing plate to make sound electrical, thermal and mechanical contact. The bonding of a target to the backing plate, which is usually made of copper, forms what is known as the 'bonded target assembly.'

Field of Use
This agreement pertains to the chemical industry relating to the coating technology.

IPSCIO Record ID: 28130

License Grant
Licensor grants to Licensee a non-sublicensable, worldwide, royalty-bearing License under the Licensed FLT Fine Line Technology Patents, to make or have made, use, offer for sale, sell, and import Licensed FLT Products.
License Property
Licensed FLT Products means capacitive touch sensors comprising fine lines of copper metal printed on flexible plastic film.

Fine Line Technology Patents. Technology – A conductive metal layer is used in the manufacture of printed circuit boards, aerials, and antennae such as those found in mobile telephones, radio frequency identification devices (RFIDs), smart cards, contacts for batteries and power supplies, arrays of contacts for flat screen technologies (liquidcrystal displays, light emitting polymer displays and the like), electrodes for biological and electrochemical sensors, smart textiles and decorative features.

US Patent No 8435603  Formation of solid layers on substrates
US Patent No 8519048  Formation of solid layers on substrates

Field of Use
Licensee wishes to use the Licensed FLT Patents to commercialize the Licensed FLT Products. A conductive metal layer is used in the manufacture of printed circuit boards, aerials, and antennae such as those found in mobile telephones, radio frequency identification devices (RFIDs), smart cards, contacts for batteries and power supplies, arrays of contacts for flat screen technologies (liquidcrystal displays, light emitting polymer displays and the like), electrodes for biological and electrochemical sensors, smart textiles and decorative features.

IPSCIO Record ID: 5328

License Grant
Pursuant to the Assignment Agreement entered for Patent No. 5,254,237 which is entitled, Plasma Arc Apparatus for Producing Thin Film Diamond Coatings, was granted on October 19, 1993 to Licensor, the inventor of the original titanium nitride and thin film diamond coating processes.
License Property
The Diamond Coating Process includes, but is not necessarily limited to, low temperature titanium nitride, cobalt nitride, chromium nitride, ferroelectric coatings, piezoelectric coatings, diamond hard coatings and diamond semi-conductor substrates.  Thus there has been disclosed a unique plasma arc deposition system for producing diamond, doped diamond or diamond-like coatings on a substrate by pulsed plasma technique.  These techniques do not require or produce temperature rise at the substrate, allowing normally temperature sensitive substrates to be utilized.  Typical of substrates which bond readily to the thin film diamond coatings without degradation are zinc sulfide (ZnS) or zinc selenide (ZnSe), which are useful in infrared windows or laser components.  The system disclosed and described can be used in the development of products and materials such as producing on junction diodes of crystalline carbon, so that rectifiers able to withstand temperatures in the neighborhood of 1000 to 1500 degrees Fahrenheit are also possible. Insulated gate field effect transistors that can handle high source to drain potentials and provide high gain without seriously loading the signal source, while operating at elevated temperatures beyond those achievable with silicon devices, can be produced with the system described.  Many other diamond-like integrated circuit chips, such as light emitting diodes or diodes used in solid state lasers are possible. Since thick diamond layers of good optical clarity can be produced by the process described herein, among the new devices that have become possible is an optical modulator that depends upon the polarizing effects of electric fields upon light beams through the crystal lattice.  This property leads to the entirely new family of high-power, opto-electronic coupling, modulating, scanning and/or sensing devices based upon diamond semiconductors.  Many other semiconductor devices that can utilize the enhanced properties of diamond-like films can be produced with the invention disclosed and described herein.
Field of Use
The rights granted apply for producing diamond-like coatings.

IPSCIO Record ID: 362466

License Grant
Licensor grants Licensee of South Korea an exclusive, non-transferable, non-sublicensable, license to use the Technology furnished to Licensee under this Agreement for Licensee to manufacture Product in South Korea and to sell and distribute Product to Customers in South Korea.

Licensor grants a non-exclusive, non-transferable, non-sublicensable, license to use the Technology furnished to Licensee for Licensee to sell and distribute Product to Customers in China, Japan and Taiwan, provided the Product is made by Licensee or its Affiliates in South Korea.

Licensor grants Licensee and its Affiliates permission to sell Product outside of South Korea for Licensee’s Customers Headquartered in South Korea based on orders for Product originating in South Korea.

For the Term of this Agreement, Licensor agrees that Licensor will not grant to a third party an exclusive license under the Technology to manufacture, sell and distribute Product in China.

License Property
Licensor is a company that engages in the discovery, development, and commercialization of electrically conductive hybrid plastics used primarily as raw materials in the production of industrial, commercial and consumer products and services worldwide.

Product means moldable composite capsule made with nickel plated carbon fiber, stainless steel fiber or other conductive materials and thermoplastic resin based material, and made using Licensor’s Technology or Patents.

The technology is all trade secrets, knowledge, expertise, technology, methodology and technical information regarding the ElectriPlastTM capsule and use thereof.

Licensor has researched and developed an innovative, electrically-conductive resin-based material called “ElectriPlast®.” The ElectriPlast® polymer is a compounded formulation of resin-based materials that are conductively loaded, or doped, with a proprietary-controlled, balanced concentration of micron conductive materials, and then pelletized using our patented manufacturing process. The conductive loading or doping within this pellet is then homogenized using conventional molding techniques and conventional molding equipment. The end result is a product that can be molded into any of the infinite shapes and sizes associated with plastics and rubbers, is non-corrosive, and can serve as an electrically conductive alternative material to metal.

Field of Use
Licensee develops, manufactures and supplies a variety of thermoplastic and thermoset composites and components.

ElectriPlast®  is a family of non-corrosive, electrically-conductive resin-based materials whose properties allow it to be molded into any of the infinite shapes and sizes associated with plastics and rubbers, but which is as electrically conductive as if it were metal.

Various examples of applications for ElectriPlast® include antennas, shielding, lighting circuitry, switch actuators, resistors, medical devices, thermal management and cable connector bodies, among many others. We have been working to introduce these new applications and the ElectriPlast® technology on a global scale.

IPSCIO Record ID: 4164

License Grant
The Licensor licensed to us TCP-related technology and intellectual property rights.
License Property
Tape Carrier Package Technology (TCP) offer a high number of inputs and outputs, a thin package profile and a smaller footprint on the circuit board, without compromising performance. Key package features include surface mount technology design, fine-pitch tape format and slide carrier handling. Because of their flexibility and high number of inputs and outputs, TCPs are primarily employed either for STN-LCD or TFT-LCD driver semiconductors.
Testing of tape carrier packages. We conduct full function testing of LCD and other flat-panel display driver semiconductors with a specially designed probe handler to ensure reliable contact to the test pads on the TCP tape. We can test STN-LCD or TFT-LCD driver semiconductors with frequencies of up to 750 MHz and at voltages up to 40V. The test is performed in a temperature-controlled environment with the device in tape form. The assembled and tested LCD and other flat-panel display driver semiconductors in tape form are packed between spacer tapes together with a desiccant in an aluminum bag to avoid contact during shipment.

Assembly of tape carrier packages. TCPs use a tape-automated bonding process to connect die and tape. The printed circuit tape is shipped with a reel. The reel is then placed onto an inner lead bonder, where the LCD or other flat-panel display driver semiconductor is configured onto the printed circuit tape. The resulting TCP component consists of the device interconnected to a three-layer tape, which includes a polyamide-down carrier film, an epoxy-based adhesive layer and a metal layer. The tape metallization area of the interconnections is tin plated over a metal layer. The silicon chip and inner lead area is encapsulated with a high temperature thermoset polymer after inner lead bonding. The back face of the chip is left un-sealed for thermal connection to the printed circuit board.

Field of Use
The Licensee provides gold bumping, testing and assembly services for LCD and other flat-panel display driver semiconductors by employing tape carrier package, or TCP, chip-on-film, or COF, and chip-on-glass, or COG, technologies.

IPSCIO Record ID: 107

License Grant
The UNIVERSITY grants to Licensee an exclusive License to the Licensor's interest in valuable intangible property rights in Patent Rights and technical information to make, have made, import, have imported, use, market, sell, and distribute Licensed Product, and practice Licensed Method..
License Property
U.S. Patent No. 7,015,052, issued on March 21, 2006, entitled 'Screen-Printing Techniques for the Fabrication of Organic Light-Emitting Diodes.'  Accordingly, an object of the present invention is to provide a fast, simple, and inexpensive method for fabricating OLEDs, organic light-emitting diodes.
Field of Use
Licensed Field Organic Light-Emitting Diodes in printed electronic displays and all other printed electronic components.

IPSCIO Record ID: 480

License Grant
The Licensor  hereby grants a sole and exclusive, worldwide, royalty-bearing right and license under the Licensed Patent Applications and the Licensed Patents to make, have made, use, sell, offer for sale, lease and otherwise dispose of Licensed Products in the Licensed Territory in the Licensed Field of Use.  Licensee accepts the terms and conditions required for sublicensees as outlined in the UC License.
License Property
Licensed Product, singular or plural, shall mean any Atmospheric Pressure Plasma Jet Technology wherein the manufacture, use, offer for sale, sale or importation of Atmospheric Pressure Plasma Jet Technology by Licensee would, but for the rights and license granted herein, constitute an infringement of a valid and enforceable claim of a subsisting Licensed Patent and shall not include Licensee's standard power delivery equipment (i.e., stand alone Licensee's power supplies and match networks) but includes power generation and delivery equipment which is designed specifically as an integral and indivisible part of the Atmospheric Pressure Plasma Jet Technology.

'Deposition Process Technology' means processes for depositing compositions of matter, including Deposition Precursor Technology, onto substrates using Deposition Plasma Jet Technology.  Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks.

Surface cleaning is a fundamental requirement for many industrial processes. It is also important for decontamination of objects. Traditionally, surface cleaning has been accomplished using solvent-based methods, technologies which have been available for more than 100 years. Increasing concerns about ground water and air pollution, greenhouse gases, and related health and safety issues have severely restricted the use of common volatile organic solvents, and even many of the recently-adapted, less hazardous chemical substitutes.  Plasmas have been used extensively in a wide variety of industrial and high technology applications, from semiconductor fabrication to coatings of reflective films for window panels and compact disks. Plasmas ranging in pressure from high vacuum (<0.1 mTorr) to several Torr are most common, and have been used for film deposition, reactive ion etching, sputtering and other forms of surface modification. The primary advantage of plasma cleaning is that it is an 'all-dry' process, generates minimal effluent, does not require hazardous pressures, and is applicable to a wide variety of vacuum-compatible materials, including silicon, metals, glass, and ceramics.

Field of Use
'Licensed Field of Use shall mean all fields in which Licensee can demonstrate that it is one of the top three leading vendors in market share in each of such fields, as demonstrated by dollar volume of sales in the preceding year, including but not limited to Semiconductor Processing, Data Storage (including but not limited to magnetic and optical), Flat Panel and Electronic Displays, and Architectural Glass, and in any other field mutually agreed upon.

IPSCIO Record ID: 4456

License Grant
The Licensee has an exclusive worldwide license and rights to sublicense any and all intellectual property conceived or developed under its sponsorship at the University.
License Property
Currently, research and development of the licensee's flexible, thin-film organic photovoltaic (OPV) and inorganic Gallium Arsenide (GaAs) technologies is being conducted at University's (Licensor's) research facility under the seven year 2013 Research Agreement dated December 20, 2013.

OPV are Organic semiconductors made from carbon-rich compounds with a structure tailored to optimize a particular function, such as responsiveness to a particular range of visible light. The use of organic compounds as semiconductors for commercial applications is very new.

Field of Use
Licensee is using it in organic semiconductor based photovoltaic cell technology.

OPV are Organic semiconductors made from carbon-rich compounds with a structure tailored to optimize a particular function, such as responsiveness to a particular range of visible light. The use of organic compounds as semiconductors for commercial applications is very new.  The Licensee is using it in organic semiconductor based photovoltaic cell technology. A particular advantage of OPV technologies is the low cost of the materials used for the solar energy generating layers. Additionally, all of the fabrication temperatures are low and environmentally “green”, greatly reducing the ancillary costs required in conventional solar cell production.  Furthermore, the growth of the thin film layers can be accomplished directly onto the plastic or metal foils and therefore is no need for energy-intensive and expensive epitaxial growth required by inorganic semiconductors such as silicon or GaAs. Rather, there is the opportunity to “print” organic solar cells onto continuous rolls of plastic in an ultra-high-speed manufacturing process. The potential for printed electronics – making solar cells “by the kilometer” rather than on one substrate at a time – makes OPV a potentially revolutionary step in the widespread acceptance and deployment of solar energy. Since the organic films are see-through, lightweight and extremely thin (in this case the entire structure is only 0.1% the thickness of a human hair), they can be made semitransparent and adjusted to any desirable color. As a result, there are significant opportunities to achieve heretofore unrealizable applications such as car paint that allows vehicle coating to act as a source of power for an electric car; windows that can be coated with a clear semi-transparent film that captures photons from the sun to provide power for inside of the building, and fabric that can be made coated in order to make clothes, tents, flags, or lightweight roll-out power mats.

Since the organic films are see-through, lightweight and extremely thin (in this case the entire structure is only 0.1% the thickness of a human hair), they can be made semitransparent and adjusted to any desirable color. As a result, there are significant opportunities to achieve heretofore unrealizable applications such as car paint that allows vehicle coating to act as a source of power for an electric car; windows that can be coated with a clear semi-transparent film that captures photons from the sun to provide power for inside of the building, and fabric that can be made coated in order to make clothes, tents, flags, or lightweight roll-out power mats.

IPSCIO Record ID: 282935

License Grant
The English Licensor grants to the Japanese Licensee, and the Licensee accepts, a non-exclusive licence under the Patents and any Know-how, upon and subject to the provisions of this Agreement
(a)
to make or manufacture LEP Devices, which devices may implement the TMA architecture and/or use the TMA algorithm (but not to manufacture or have manufactured LEP material or Total Matrix Addressing Driver Chips, or any other semiconductor device).
(b)
to make or manufacture Finished Products incorporating LEP Devices manufactured under the licensed rights granted;
(c)
to use, sell and otherwise deal in the LEP Devices and Finished Products made or manufactured in accordance with the licensed rights granted and (b) in any and all countries of the world;
(d)
to sublicense (either in whole or in part) its licensed rights to manufacture LEP Devices (as granted to a sub-contractor, for the sole purpose of having LEP Devices manufactured on Licensee’s behalf, provided that, in respect of those sub-contractors which are located outside the geographical region of Japan.
License Property
LEP means light emitting polymer material formed from an Electroluminescent Polymer.

Electroluminescent Polymer means any material deposited by solution processing that is electroluminescent and where at least one ingredient is a polymer.

LEP Device means an electronic device (which device is covered by one or more Valid Claim) in which light is generated by LEP to produce (i) a visible representation comprising Glass, a Passive Matrix Module or an Active Matrix Module, as the case may be, and (ii) backlighting to, and solely to the extent the same is necessary for, such visible representation (but excluding any lighting device intended for use primarily as a source of area illumination), which devices may be driven by a TMA Driver Chip and shall be of any resolution and shall have a viewable diagonal dimension which is either (a) equal to or in excess of Ten (10') inches, or (b) equal to less than Twenty Seven (27') inches, whichever the Licensee shall have elected prior to entering into Commercial Production, by serving prior written election on CDT in accordance with this agreement.

TMA means Total Matrix Addressing.

Patent means the patents and patent applications listed; all future patents and patent applications that may be filed by or on behalf of Licesor or a Licensor Group member which are related to LEP display architecture and/or manufacture and which Licensor or a Licensor Group member exclusively owns or jointly owns, has an unrestricted right and ability to grant licenses thereto and such right to grant licences is not conditional upon Licensor or a Licensor Group member making any form of payment or other form of compensation to any relevant third party; and any extension of any such patent and any patent obtained in pursuance of any such application.

4,923,288 – Optical modulators based on polymers
5,247,190 – Electroluminescent devices
5,399,502 – Method of manufacturing of electrolumineschent devices

Finished Product means any article (whether or not complete) produced by or for the Licensee or any member of the Licensee’s Group which incorporates an LEP Device and additional components.

Total Matrix Addressing Driver Chips means row and column driver chips interfacing with either a separate or integrated processor chip capable of running any non-negative matrix factorisation algorithm (or any other algorithm that gives positive values) such that the said row and column driver chips can drive more than one row and column at a time within one subframe. (“TMA Driver Chips” shall be construed accordingly). Total Matrix Addressing is a a form of passive matrix driving where more than one row is addressed at a time, resulting in reduced power consumption and extended panel lifetime.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 270831

License Grant
Israelite University transferred technology to Israelite Licensee for a joint research program.
License Property
The technology with respect to the intellectual property developed under such agreement for any product, component, device or material that is used in the preparation of coated substrates meeting certain specifications (Licensed Film) and services resulting from the license.
Field of Use
Conductive films (in the nanometric or micrometric range), in particular transparent and conductive films are vastly used in the electronic, solar cells and optoelectronic industries and there is a continuous demand for films with improved features, i.e., conductivity, durability, flexibility as well as transparency and scaled down films.

IPSCIO Record ID: 179826

License Grant
Licensor hereby grants to Licensee upon the terms as set forth herein, a royalty bearing license under the Licensed Patents solely for the purpose of providing to customers of Licensee a label license for use of Polyclad Cap Material in the fabrication of Permitted Products by such customers.

Licensor has issued and pending United States and foreign patents, which are hereinafter defined as 'Licensed Patents' relating to multi-layer circuit board construction and fabrication.

License Property
Permitted Products shall mean two dimensional, multi-layer printed circuit boards which are not designed nor intended to be folded or bent upon installation. Incidental flexibility of a product not to exceed 15 is permissible in an otherwise permitted product.

Excluded Products shall mean three-dimensional, multi-layer printed circuit boards which are designed or intended to be folded or bent upon installation, or multi-layer flexible circuit boards mountable on a flat rigidized heat sink, and including without limitation Type 3, Type 4 and Type 5 printed circuit or printed wiring boards as defined in MIL/STD- 2118 dated 4 May 1984, a copy of which is attached hereto.

Cap Material shall mean a copper layer having a C stage adhesive coating thereon over which a B stage adhesive coating is provided.  This agreement pertains to the electronics relating to multi-layer circuit board construction and fabrication.

IPSCIO Record ID: 28132

License Grant
The Licensor grants the Licensee an exclusive royalty-bearing, worldwide License, with the right to sub License, under the Licensor's proprietary MPECVD Technology and Improvement Inventions to use the MPECVD Technology and Improvement Inventions and make, use and sell the Products in the Field for the period of time covered by the Exclusivity Period.
License Property
Products shall mean any and all products incorporating one or more multilayered optical coatings in which at least one layer of a multilayer stack is deposited by the Licensor's MPECVD Technology.

ECD Microwave Plasma Enhanced Chemical Vapor Deposition (MPECVD) technology is use to produce other thin film coatings.

Licensor is involved in research, development and commercialization of proprietary technology relating to microwave plasma enhanced chemical vapor deposited multilayered optical coatings and the manufacturer of products that incorporate such coating.

Field of Use
The Field includes Products produced for sale as coatings in display applications (CRT’s, Flat Panel Displays, Digitizers, Touchpanels, etc) and coatings for flexible substrate applied to automotive and building glass and decorative and reflector applications, and for non low emissivity coatings on automotive and building glass, decorative and reflector glass applications.

The Licensee is involved in research, development and manufacture of sputtered multilayered coatings on substrates.

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