Royalty Report: Semiconductors, Fabrication, RAM – Collection: 223146

$150.00

Curated Royalty Rate Report
Created On: 2020-07-15, Record Count: 18

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Created On: 2020-07-15
Record Count: 18

Primary Industries

  • Semiconductors
  • Fabrication
  • RAM
  • Storage
  • IC
  • Computers & Office Equipment
  • Circuits
  • Electrical & Electronics
  • Scientific & Technical Instruments
  • Test/Monitoring

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 223146

License Grant
The Parties agree to have the Licensors license to the Israel Licensee an existing and/or future development of sub-micron memory compilers, including, but not limited to, the memory compilers set forth, which consists of: (i) object code versions of a set of executable software programs, (ii) libraries containing design elements of memory cell arrays and control logic, and (iii) all related documentation, used for generating memory configurations as supplied to Licensee by Licensor, based on Licensee 0.18um technology (the Compilers) for Licensees manufacturing services, and to have Licensor extend the Compilers to its customers.

As between the parties, Licensor exclusively shall have all right, title and interest including all patent rights, copyrights, trade secret rights, mask work rights and other rights throughout the world (collectively Intellectual Property Rights) in any inventions, intellectual property, trademarks, works-of-authorship, mask works, ideas or information made or conceived or reduced to practice by Licensor or by Licensor jointly with Licensee and/or third parties in the course of development of the Compilers.

As between the parties, Licensee exclusively shall have all Intellectual Property Rights in (a) any Licensee Deliverables that exist prior to the Effective Date and (b) any inventions, intellectual property, trademarks, works-of-authorship, mask works, ideas or information made or conceived or reduced to practice by Licensee or by Licensee jointly with Licensor and/or third parties in the course of development of the Licensee Deliverables.

License Property
The Compilers will be an integration of (but not limited to) Licensee-specific memory compilers, which contain bit cells developed by Licensor.

ASAP Products:
2 Port Register File
Single Port SRAM (High Density)
Dual Port SRAM (High Density)
ROM (via 2/3)
Single Port SRAM (High Speed)
Dual Port SRAM (High Speed)

STAR Products:
STAR HD-4M
STAR HS-512k Single Port
STAR HS-512k Dual Port
STAR Memory System

Miscellaneous Products:
NetCAM T-32K
NOVeA

Licensee Deliverables. Licensee agrees to provide Licensor early access to the technical information for use by Licensor solely in connection with developing the Compilers as set forth in this Agreement.

Field of Use
The agreement enables Licensor to develop and license to Licensee, and it's customers, the NOVeA family of non-volatile embedded memories on Licensee's 0.18-micron technology.

NOVeA, which can be reprogrammed numerous times, is designed for integration into system-on-chip (SoC) applications. It is the first non-volatile, electrically alterable embedded memory solution that can be produced using standard logic processes. Most embedded non-volatile memory solutions require special process technology that adds steps and photomasks to fabrication, which increases costs and delivery time. Since NOVeA can be manufactured by using a standard logic process, additional process steps and masks are not necessary, thereby reducing costs and delivery time. By employing sub-micron geometries, NOVeA technology can help reduce overall system size, lower power consumption and increase performance.

IPSCIO Record ID: 223147

License Grant
Licensor grants to the Israel Customer a non-transferable, non-exclusive, royalty-bearing license, for the License Agreement Term, to:
(A) Use the Licensed Product(s);
(B) reproduce the Licensed Product(s);
(C) distribute the Front-End Views to third party entities
(D) distribute the Back-End Views to third party entities
License Property
Licensed Products means the products, and any Updates thereto, whether in object code, re-configurable binary, ASCII data, binary data or any other form. Licensed Product(s) includes the Back-End Views, Front-End Views and Internal Use Documentation.

Licensors products are standard cells, I/O cells and embedded memories which it licenses to end users such as Customers customers for use in designing and manufacturing semiconductors.

Front-End Views means the library element timing, simulation models, logical symbols, floor planning abstracts and related documentation deliverables as identified.

Back-End Views means the library element physical design and related documentation deliverables, whether in object code, reconfigurable binary, ASCII data, binary data, or any other form, as identified.

Field of Use
Licensor will provide Licensee with memory generators for single- and dual-port SRAM, one- and two-port register files, via programmable ROM, the SAGE-Xâ„¢ Standard Cell Library and a set of general-purpose I/Os.

IPSCIO Record ID: 202872

License Grant
Licensor agrees to grant twenty (20) compiler tokens to the Singapore Licensee.
License Property
The licensed property is wafer manufactured at Licensee that incorporates any Licensee/Licensor 0.35um/0.25um memory compilers or wafers.

The memory compilers included are:
• 0.35nm process:
(i) 1 port High density compiler
• 0.25nm process:
(i) 1 port High Density compiler (HD-Family)
(ii) 2 port High density compiler (HD-Family)
(iii) 1 port Register file
(iv) 2 port Register file

Field of Use
This agreement is for the semiconductor industry.

IPSCIO Record ID: 203510

License Grant
Licensor grants a non-exclusive, perpetual, worldwide, irrevocable license to use the Bulk CMOS Information and portions of Specific Results other than those portions which Licensee uses exclusively to produce the highest performing thirty percent (30%} of wafers manufactured in the applicable technology generation (e.g. 45nm, 32nm) in any given quarter for the purpose of researching, developing, engineering and manufacturing up to one thousand (1000) 300mm wafers, other than SOI Wafers, per week in 65nm, 45nm and/or 32 nm technology, including the right to sell, market, distribute or otherwise dispose of such wafers to Third Parties, provided that such licensed wafers manufactured using the aforementioned portions of Specific Results shall not include high performance microprocessors intended for use in high performance enterprise Servers.

After September 30, 2003, Licensee may exercise the sublicensing option. If Bump Technology is established as a Process Development Project,  Licensor grants Licensee the right to disclose and sublicense the process technology developed by Licensor and Licensee under this Agreement including SOI Device Information, High Performance Device Information and Bulk CMOS and Industry Standard CMOS Information and Pre-TO Information, subject to the following: AMO may sublicense no more than two (2) JMP for a maximum of a total of two (2) joint manufacturing facilities with a combined maximum of 20,000 300 mm wafers per month for such technology consumed by, or supplied to the Joint Manufacturing Partners (JMP).

License Property
The technology is leading edge semiconductor manufacturing processes.

The Licensed Product means Integrated Circuits that include Bulle CMOS Information, Industry Standard Information, High Performance Device Information (excluding eDRAM Technology), SOI Device Information (excluding eDRAM Technology), or any combination thereof, other than Foundry Products.

“Chip Design(s)” means any design of one or more Integrated Circuits and/or Semiconductor Products, including (by way of example and not limitation) random access memory (RAM)s, read only memory (ROM)s, microprocessors, ASICs and other logic designs, and analog circuitry; provided, however, that “Chip Designs” shall not include (i) alignment marks or test structures and associated layout and data used in the Process Development Projects for process development, (ii) process kerf test structures, layout, and data of the test chip(s) (including SRAM macro cells and eDRAM macros) as well as such test chips themselves used for the development work of the Process Development Projects unless specifically excluded (for the avoidance of doubt, this phrase means that such structures or macros that are specifically designated as owner proprietary shall not be considered Specific Results), (iii) other product designs (including eDRAM macros) as mutually agreed by the Parties to be used as qualification vehicles in the Process Development Projects, or (iv) ESD protection devices as used in the Project Test Sites and ESD groundrules and models as defined in the Design Manual. For the avoidance of doubt, all of (i) through (iv) above shall be treated as Specific Results to the extent utilized in a Process Development Project.

“CMOS 10S” means a 90 nanometer CMOS logic fabrication process.

“Embedded DRAM” or “eDRAM” means a device that either (i) primarily carries out logic functions, and includes one or more dynamic random access memory (DRAM) cells embedded within logic circuitry on the same semiconductor substrate, or (ii) primarily carries out memory functions, and includes one or more DRAM cells in combination with a static random access memory (SRAM) array on the same semiconductor substrate (including an array of SRAM cells linked with bit lines, word lines, sense amplifiers and decoders).

“Integrated Circuit” means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, “Integrated Circuit” shall include charge-coupled devices (“CCDs”).

“Lithography” shall mean those aspects of Background Know-How and Specific Results directed to (a) process technology-dependent ground rules or process technology-dependent special rules for shapes replication as developed by the Parties for the generation of photomasks used for development and qualification of a semiconductor process technology in the Process Development Projects, (b) resolution enhancement techniques specifically created pursuant to the Process Development Projects to generate mask build data, (c) such photomasks themselves and the data files used therefor as are used in the Process Development Projects, (d) lithography process sequence as utilized in the Process Development Projects, and (e) mask data generation sequence as utilized in the Process Development Projects.

Field of Use
This agreement is for semiconductor industry.

IPSCIO Record ID: 25950

License Grant
The Canadian Licensee will acquire the joint ownership and exclusive world wide licensing rights (together the 'Territory') the following patents related to certain ferromagnetic memory technology known as VEMRAM (previously known as MAGRAM) and covered by U.S. Patent #5,295,097 and the related patent applications (the Vemram Patents) described in the Agreement.
License Property
a. US Patent File No. 5295097

b. EEC Patent File No. 939186441

c. Japan Patent File No. 505547/1994

Magram(TM) memory is the world's first memory to combine all the positive attributes of existing memory technologies w combine non-volatility (retains information even after being shut off) and random read/write access (fast speed), MAGRAM offers a superior memory solution for computers, diagnostic tools, medical equipment, automobiles, and a host of othositive attributes found in various other digital memory technologies including low power consumption, low ceing able to use your computer the instant you turn it on rather than having to wait for it to boot up.

IPSCIO Record ID: 26593

License Grant
The Canadian University hereby grants to the Canadian Company and its Affiliates an exclusive, world-wide, universal license to:

a) practice, develop, make, have made, use, sell, offer to sell, offer, have sold, transfer, dispose of, lease, import, export, market, promote, demonstrate, distribute, manufacture, and otherwise exploit Licensed Products, the Technology, the Developed Technology and the Patent Rights in any manner;

b) to use in any manner, develop, have developed, improve and modify the Technology or Developed Technology for any of the purposes set forth in (a) above;

c) use the Technology or Developed Technology for testing, demonstration, training, support and promotional purposes in connection with the marketing, promotion, demonstration, distribution, manufacture, offer, sale and use of Licensed Products.

License Property
The “Inventors” have conducted research at the University that, among other things, resulted in a U.S. patent application entitled “Magnetic memory composition and method of manufacture” (Filing date Dec 20, 2006).
The Inventors also have conducted research at the University of Toronto resulting in a “Tuneable Magnetic Switch”.

Magnetic Random Access Memory, MRAM is a non-volatile memory technology that uses magnetic, thin film elements on a silicon substrate to store information. The MRAM is currently under development and has not been proven to be commercially viable.

IPSCIO Record ID: 751

License Grant
The Licensor, on behalf of itself and its Affiliates, hereby grants to Licensee and its Affiliates the following separate and distinct licenses for each product that falls within the definition of a Licensed Product identified JEDEC-compliant memory controllers: a non-exclusive, non-transferable, royalty-bearing, worldwide license, without the right to sublicense, solely under the associated Licensor Applicable Patent Claims, to make including have made, use, Sell, offer for Sale, and/or import the corresponding Licensed Product during the Term.  

Licensor has also been subject to an investigation in the European Union. Licensee was not a party to that investigation, but has recently sought to intervene in the appeal of the investigation.

As a result of Licensor's commitments to resolve that investigation, for a period of five years from the date of the resolution, Licensor must now provide a License to memory controller manufacturers, sellers, and/or companies that integrate memory controllers into other products.

The parties have not signed a release of liability for past damages, nor dismissed any outstanding litigation between the parties.  The terms of the License Agreement are per the agreement that licensor offers as part of its commitment with the European Commission.

License Property
The License Agreement requires that licensee pay licensor royalties for certain specified SDR memory controllers and a higher royalty for certain other memory controllers, including DDR, DDR2, DDR3, LPDDR, LPDDR2, GDDR2, GDDR3, GDDR4, and portions of GDDR5 memory controllers.
Field of Use
Licensee is the world leader in visual computing technologies and the inventor of the GPU, a high-performance processor which generates breathtaking, interactive graphics on workstations, personal computers, game consoles, and mobile devices.  Licensee serves the entertainment and consumer market with its GeForce(R) products, the professional design and visualization market with its Quadro(R) products, and the high-performance computing market with its Tesla(TM) products.

IPSCIO Record ID: 211905

License Grant
Licensor grants to Licensee a non-transferable, non-exclusive, worldwide right and license under Licensors applicable trade secret, know-how and copyrights in the Licensed Products and Update(s)
to do any or all of the following:
-Use the Licensed Products and Updates to develop, derive or otherwise create one or more Designs and mask sets that embody such Designs, including but not limited to the right to execute, distribute internally, and reproduce the Licensed Products and Updates in support of such use, provided such Designs are manufactured at Licensees Manufacturing Site(s);
– lease, sell, or otherwise transfer semiconductor products instantiating such Designs in any form or level of assembly (by way of example, in wafer or single chip form as bare die, in chip packages, or on printed circuit boards) to third parties;
– Use the Licensed Products and Updates as reasonably necessary to carry out the activities set forth;
– distribute the Front-End Views/Back-End Views to third party entities to internally use the Front-End Views and internally use the Back-End Views.
License Property
Licensed Product(s) means the products described in the Product Schedule, and any Updates thereto, whether in object code, reconfigurable binary, ASCII data, binary data or any other form. Licensed Product(s) includes the Back-End Views, Front-End Views and Internal Use Documentation.

Required Data means semiconductor manufacturing processes.

Wafer shall mean a combination of die produced from a single manufactured semiconductor wafer, which die in whole or in part are made up of, incorporate or are based upon any portion of a Design.

Licensor is a leading developer of high performance, high density and low power embedded memory, standard cell and input/output intellectual property components used for the design and manufacture of complex integrated circuits.

Field of Use
This agreement is for the semiconductor and related device industry.

IPSCIO Record ID: 1732

License Grant
Licensor hereby grants Licensee an exclusive, worldwide for Licensor’s 6K/8K test systems, namely, the STS/6060, STS/6120, STS/6560, STS/6520, STS/7720, and STS/8256 test systems as well as all optional hardware and software products which relate to the use of these machines.  The optional hardware and software products include but are not limited to system configuration options, TesterTools software, off-line programming workstations, and off-line compilers.
License Property
The 'Licensor' designs, manufactures, sells and services automatic test equipment ('ATE') used in the production of semiconductors.

'Products' means Licensor's 6K/8K test systems, namely, the STS/6060, STS/6120, STS/6560, STS/6520, STS/7720, and STS/8256 test systems as well as all optional hardware and software products which relate to the use of these machines. The optional hardware and software products include but are not limited to system configuration options, TesterTools software, off-line programming workstations, and off-line compilers.

'Proprietary Rights' means patent rights, copyrights, trademark rights, mask work rights, trade secret rights, including without limitation, manufacturing rights, engineering rights, upgrade rights, and any and all other statutory and legal rights and protections available under applicable laws for the protection of intellectual property.

'Technology' shall mean all technology comprising of Licensor's '6K/8K' test system family, as set forth and described in Attachment A hereto, including, without limitation, all patents and patent applications, related inventions (whether or not patentable), ideas, processes, formulas, designs, works of authorship, technology, computer programs, source and object code, firmware, software, microcode, mask works, processes, techniques, information and know-how, owned or controlled by Licensor as of the date of this Agreement, together with reasonable documentation provided therewith to Licensee by Licensor.

IPSCIO Record ID: 215225

License Grant
The parties previously entered a foundry agreement where Licensee brought up the wafer process technology equivalent to Licensors 0.22um DRAM CM72 wafer process technology.  Licensee desires to make better use of the technology.

The Japanese Licensor grants to Chinese Licensee a non-transferable, non-exclusive, worldwide license to use Licensors Process Technology, Licensors Product Design and Licensors IPR incorporated or embodied in Licensors Process Technology and Licensors Product Design, to manufacture Licensed Products at Licensees own facilities and to market and sell such manufactured Licensed Products.

License Property
Licensors Process Technology shall mean the front-end manufacturing process technology of 0.22-micron what Licensor calls CM72 for manufacturing Licensed Products and Foundry Products which is owned or developed by Licensor, which Licensor has the right to grant a license to Licensee without payment of any compensation to third parties, and which is described in the Deliverables and has been brought up by Licensee under the Foundry Agreement.

Licensor Product Design shall mean the product design data for Licensed Products which is owned or developed by Licensor, which Licensor has the right to grant a license to Licensee without payment of any compensation to third parties, and which is described in the Deliverables.

The Licensed Products shall mean certain 64Mbit synchronous dynamic random-access memory (SDRAM) devices using Licensor Process Technology and Licensor Product Design whether in a die form or in a wafer form.

Field of Use
Licensee is in the semiconductor manufacturing industry.

IPSCIO Record ID: 27308

License Grant
The Company grants worldwide, nontransferable, nonexclusive and royalty-free license to Japanese Licensee of the ProASIC Technology for the development, modification, manufacturing, use and sale by Rohm of Standard ProASIC Products down to 0.35 micron with no limitation on density.
License Property
The Company has developed proprietary ProASIC Technology and has applied this ProASIC Technology in the design, manufacture, marketing and selling of its Standard ProASIC Products and licensing the ProASIC Technology.

'ASICMAKER' means the proprietary hardware programmer developed by Gatefield for programming GateField ProASIC Products. 'EMBEDDED APPLICATIONS' means the integration of GateField's ProASIC Technology as a subset of a silicon device in the same chip.

'GATEFIELD PROASIC TECHNOLOGY' or 'PROASIC TECHNOLOGY' means the proprietary ProASIC technology developed and owned by GateField including the architecture, switch cell design and operation, programming logic, analog and high voltage circuit design, simulation, verification and testing, and methodologies, but excluding all software except for the architectural file generation software which shall be included.

'GATEFIELD'S CURRENT PROASIC PRODUCTS' means GateField's standard field programmable gate array GF100K, GF250F and GF260F Product families utilizing GateField ProASIC technology as specified in GateField's current product list.

ProASIC Product or ProASIC Technology means the proprietary ProASIC technology developed and owned by Licensor including the architecture, switch cell design and operation, programming logic, analog and high voltage circuit design, simulation, verification and testing, and methodologies, but excluding all software except for the architectural file generation software which shall be included.

ProASIC Chip on Chip Products means the application of Licensor's Standard ProASIC Products with other silicon products directly placed on the mother chip utilizing Rohm's Chip on Chip packaging technology as developed by Rohm including, but not limited to the drawing attached hereto as Attachment A, as an example.

ProASIC Technology on the chip to the total chip area for any Embedded Applications; application specific integrated circuit ('ASIC') technology; ProASIC–are based on two proprietary and patented technologies: a flash-based switching element and a fine-grained, gate array-like ProASIC architecture.

The Company believes that the principal advantages of its products over alternative SRAM-based and antifuse devices are: smaller chip size for the same geometries; reprogrammability and non-volatility; and the ability to use a standard electronic design automation (EDA) ASIC design flow.

Field of Use
Licensee shall have the right to market and sell the Standard ProASIC Products, Version 4p2 ASICmaster Software Licenses and ASICmaker under the ProASIC trademark.  Licensee agrees to use the ProASIC trademark on all Standard ProASIC Products, ASICmaker, Embedded Applications, ProASIC Chip on Chip Products and copies of the Version 4p2  ASICmaster Software, including all documentation and collateral material.

IPSCIO Record ID: 230774

License Grant
The Parties agree to jointly develop semiconductor manufacturing process technology based on Licensor’s “S” high performance technology roadmap on commercially available wafers that meet the requirements (referred to as Strategic Technology Objectives) in accordance with the schedule (hereinafter referred to as Development Schedule). The Parties agree that the process technology so developed, shall be high performance, leading edge technology and, to the extent consistent with the Strategic Technology Objectives, shall be cost efficient. Any modification to such Strategic Technology Objectives or Development Schedule requires the mutual agreement of the Parties. For the avoidance of doubt, none of the Process Development Projects shall include the development of i) Proprietary Tools, ii) Packaging Technology, iii) Mask Fabrication and Photoresist Technology, iv) Memory, v) SiGe Technology, vi) Chip Designs, or vii) Post-Silicon Devices.
License Property
Semiconductor Product means a component that contains an Integrated Circuit on a single or multichip module that incorporates a means of connecting those Integrated Circuits with other electronic elements (active or passive) and/or means to make external electrical connections to such elements, but which excludes any means for a user to operate the functions therein (e.g., buttons, switches, sensors).

Licensed Product means Integrated Circuits that include Bulk CMOS Information, Industry Standard Information, High Performance Device Information, SOI Device Information, or any combination thereof, other than Foundry Products.

Integrated Circuit means an integral unit formed on a semiconductor substrate including a plurality of active and/or passive circuit elements formed at least in part of semiconductor material. For clarity, Integrated Circuit shall include charge-coupled devices (“CCDs”).

Bulk CMOS Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, and/or (ii) selected by Licensor either for incorporation into an Licensor Bulk CMOS process or otherwise pursuant to this agreement.

Industry Standard Information means those aspects of Background Know-How and Specific Results that are (i) directed to Lithography and BEOL, or (ii) applicable to Industry Standard CMOS and selected by Licensor either for incorporation into an Licensor Industry Standard CMOS process or otherwise selected pursuant to this agreement.

High Performance Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on substrates, not including SOI Device Information. Bulk CMOS Information or Industry Standard Information.

SOI Device Information means Background Know-How and Specific Results pertaining to all process methods, steps, and structures created on commercially available SOI Wafers other than Bulk CMOS or Industry Standard Information.

Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 211831

License Grant
With this addendum, the Parties wish to enhance their cooperation, such that the Israeli Licensor shall grant the Licensee of Taiwan a license under Licensors MLC Technology according to the terms and conditions of this Second Addendum.  In addition, Licensor shall further assist Licensee in designing, developing and implementing MLC Flash Products.

The Israeli Licensor grants to the Licensee of Taiwan a non-exclusive, non-transferable, worldwide license, without right to sub-license, under the Licensor MLC Patents, MLC Technology, and MLC Improvements to use, make to use, make, without sub-contracting or have made, design, co-design and have designed by a Subsidiary, develop, sell and offer to sell, and otherwise dispose of MLC Products.

License Property
MLC Flash products shall mean a flash product based on or incorporating Licensors MLC Technology.

Licensors MLC Technology shall mean Licensors NROM, or nitride-read-only memory, Technology, or any part thereof, which allows storing 4 bits of information per memory cell.  Unlike volatile semiconductor memory devices which lose stored information after electrical power is turned off, non-volatile semiconductor memory devices retain stored information even without a power source.

Field of Use
This agreement is for the semiconductor industry.

IPSCIO Record ID: 26500

License Grant
The Italian Licensor agrees to sell and transfer to Licensee.
License Property
The Licensor is the owner of all patent rights of Patent No. AL2003A000002 relating to Tunneling Magnetoresistance Structure and the Method of its Production, and has the right to grant licenses under said Patent Rights, and; an exclusive license to use the Know-How in the Territory and; (b) an exclusive license of Licensors Patent Rights in the Territory to make, use and sell, offer to sell and import any Licensed Products derived from Patent No. AL2003A000002.

Patent relates to the nanotechnology concept known as tunneling magnetoresistance.  Tunneling magnetoresistance (TMR) is a large change in the electrical resistance upon the application of a magnetic field of two magnetic layers separated by an insulating layer. In practical terms, TMR and the other fields of giant magnetoresistance and ballistic magnetoresistance may revolutionize the way that electronic data is stored.  

TMR technology allows thin magnetic films to be layered to make complex structures with unique magnetic properties.  Such layered magnetic structures have applications in magnetic sensors and storage media like computer disks and random access memories.  Magnetic random access memories (MRAMs) based on structures of magnetic metallic films interspersed with nonmagnetic metallic or insulating interlayers may be the next generation in magnetic storage technology, replacing the semiconductor-based dynamic random access memories that are now standard.  The advantages of MRAMs include high storage density, low energy consumption and the retention of information when a computer is turned off.

Field of Use
Licensee is interested in licensing and further developing the Patent Rights for commercial applications.

IPSCIO Record ID: 2069

License Grant
The Company grants to the Licensee, a Japanese joint venture,  a non-exclusive right and license to use its patented Ferroelectric RF/ID Technology, and all Improvements, for the limited right to design, development and/or manufacture of Ferroelectric RF/ID Products for sale and use in Japan only.  RJ may sublicense Ferroelectric Technology for the limited right to design, development, manufacture and sell Ferroelectric RF/ID Products to Japanese based parties each of whom shall be appointed by RJ and approved in writing by RS, with such approval not to be unreasonably withheld (collectively, the Permitted Sublicensees).
License Property
Ferroelectric Technology means the patented technology licensed for the design and manufacture of RF/ID Products.

Ferroelectric RF/ID Products means a device that Monolithically Incorporates the patented Ferroelectric Technology and is remotely powered by electromagnetic waves or sound waves in which data can be retained in such device and/or altered using electromagnetic waves or sound waves without electrical or physical contact; this may include a device containing a Microprocessor (as specifically provided herein), commonly known as a smart card.

Field of Use
Field: For RF/ID and smart card applications.

IPSCIO Record ID: 203311

License Grant
The Israeli Licensor grants to each of the Licensee Parties, one of the United States and one of Japan, a non-exclusive, world-wide, license under the Licensor Patents and Technology to make, have made, use, offer to sell, sell, lease, import and otherwise dispose of, anywhere in the world, any Licensee Licensed Product.
License Property
The Licensed Products means any and all semiconductor products.

Licensor has developed, owns or controls certain patents and applications for patents, with the right to grant licenses under those patents and applications for patents Licensor NROM Products means non-volatile memory products (in wafer, die, packaged or other form), that include memory cells having a non-conductive, charge trapping layer that stores charge in one or more localized regions.  (Licensor NROM Products do not include conventional, non-volatile floating gate products).

Field of Use
This agreement is for the non-volatile memory semiconductor industry.

IPSCIO Record ID: 280825

License Grant
Licensor grants a non-exclusive, indivisible, non-transferable license under Licensor Licensed Patents to make, have made pursuant to Licensees own specifications, use, sell, lease or otherwise dispose of Licensees Licensed Products within the Licensed Territory during the term of this Agreement.
License Property
The Licensed patents relate to Data Storage Apparatus and Method.

Licensed Controller means an Array Controller which, but for the license granted herein, the manufacture, use, or sale of which would constitute an infringement of one or more claims of EMC Licensed Patents. In the United States, infringement includes direct infringement, inducement to infringe, and contributory infringement as enacted in 35 USC 271(a)-(c), respectively, and also infringement under the Doctrine of Equivalents.

Licensed Subsystem means a Subsystem which, but for the license granted herein, the manufacture, use, or sale of which would constitute an infringement of one or more claims of EMC Licensed Patents. In the United States, infringement includes direct infringement, inducement to infringe, and contributory infringement as enacted in 35 USC 271(a)-(c), respectively, and also infringement under the Doctrine of Equivalents.

Subsystem means a data storage subsystem including one or more arrays of physical mass storage devices, and one or more Array Controllers associated therewith.

Array Controller means a single or multi-processor device or group of functionally inter-related devices operable to physically and/or logically configure a plurality of physical mass storage devices as one or more independently accessible arrays, and to control the communication of data between the array(s) and one or more Hosts or Clients in a predetermined format or formats.

Field of Use
The field of use is data storage.

IPSCIO Record ID: 211882

License Grant
Licensor grants to the Singapore Licensee a non-exclusive license under the Licensors Licensed Patents:
– to make Licensees Licensed Products only in Singapore and one Licensee Elected Country;
– to use, import, and lease, offer for sale, sell or otherwise transfer Licensees Licensed Products worldwide;
– to use any apparatus in the manufacture or testing of Licensee Licensed Products and to practice any method or process in such manufacture or testing of Licensees Licensed Products; and
– to have Licensees Licensed Products made in whole or in part by another manufacturer for the use and/or lease, offer for sale, sale or other transfer by Licensee only when the designs and specifications for such Licensees Licensed Products were provided by Licensee to the other manufacturer, whether developed by Licensee or received by Licensee from customers to whom the Licensed Products are to be sold.
License Property
The Licensed Products shall mean Semiconductor Apparatus.

Semiconductor Apparatus shall mean Semiconductor Material, Semiconductor Device, Semiconductor Circuit, Integrated Circuit and/or Semiconductor Memories and any combination of such apparatus with other such apparatus.

'Integrated Circuit' shall mean an integral unit including a plurality of active and/or passive circuit elements formed at least in part of Semiconductor Material and associated on, or in, one substrate comprising the first level of packaging for such elements; such unit forming or contributing to the formation of a circuit for performing electrical or electronic functions.

'Semiconductor Circuit' shall mean a circuit in which one or more Semiconductor Devices are interconnected in one or more paths (including passive circuit elements, if any) for performing fundamental electrical or electronic functions and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Device' shall mean a device and any material therefor, including but not limited to device structures such as transistors, diodes, capacitors, resistors, conductors and dielectrics, comprising a body of one or more Semiconductor Materials and one or more electrodes associated therewith and, if provided therewith, housing and/or supporting means therefor.

'Semiconductor Material' shall mean any material whose conductivity is intermediate to that of metals and insulators at room temperature and whose conductivity, over some temperature range, increases with increases in temperature. Such materials shall include, but not be limited to, refined products, reaction products, reduced products, mixtures and compounds.

'Semiconductor Memory' shall mean any instrumentality or aggregate of instrumentalities, which instrumentality or aggregate is designed only for storing digital information, intelligence or data by selectively setting or presetting detectable states in Semiconductor Material forming at least a part of such instrumentality or aggregate, such instrumentality or aggregate may include powering means and auxiliary and/or support circuits (such as regeneration means, true-complement generations means, address decoding means, sensing means and selection means) to control the flow of such information, intelligence or data into and out of such Semiconductor Memory.

Field of Use
This agreement is for the semiconductor industry.
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