Description
This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 6
Primary Industries
- Fabrication
- Semiconductors
- Material Composite
- Coating
- Electrical & Electronics
- Circuits
- Chemicals
- Computers & Office Equipment
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 179826
License Grant
Licensor hereby grants to Licensee upon the terms as set forth herein, a royalty bearing license under the Licensed Patents solely for the purpose of providing to customers of Licensee a label license for use of Polyclad Cap Material in the fabrication of Permitted Products by such customers.
Licensor has issued and pending United States and foreign patents, which are hereinafter defined as 'Licensed Patents' relating to multi-layer circuit board construction and fabrication.
License Property
Permitted Products shall mean two dimensional, multi-layer printed circuit boards which are not designed nor intended to be folded or bent upon installation. Incidental flexibility of a product not to exceed 15 is permissible in an otherwise permitted product.
Excluded Products shall mean three-dimensional, multi-layer printed circuit boards which are designed or intended to be folded or bent upon installation, or multi-layer flexible circuit boards mountable on a flat rigidized heat sink, and including without limitation Type 3, Type 4 and Type 5 printed circuit or printed wiring boards as defined in MIL/STD- 2118 dated 4 May 1984, a copy of which is attached hereto.
Cap Material shall mean a copper layer having a C stage adhesive coating thereon over which a B stage adhesive coating is provided. This agreement pertains to the electronics relating to multi-layer circuit board construction and fabrication.
IPSCIO Record ID: 154265
License Grant
The parties amended the agreement regarding royalties for the Cap Material for Permitted Products.
License Property
The Companys current flexible interconnect products include flexible circuits, laminated cables, flexible/cable hybrid circuits and flexible interconnect assemblies.
Field of Use
This agreement pertains to flexible interconnects that are used in most segments of the electronics industry.
IPSCIO Record ID: 151
License Grant
This License is in consideration for the License rights to the proprietary technology of the Licensor.
License Property
The technology refers to the manufacturing of rigid-flex printed circuits using a patented manufacturing process ('HVR Flex Ô Process').
Field of Use
The Licensee provides prepaid international phone cards and prepaid wireless services and manufactures printed circuit boards for quick-turn, prototype market and the defense supplier markets. The Licensor manufactures PCBs using the HVR Flex Ô Process.
IPSCIO Record ID: 28059
License Grant
In this agreement, Licensor grants an exclusive Worldwide License, with the right to sub license, under proprietary MPECVD Technology and Improvement Inventions to use the MPECVD Technology and Improvement Inventions and make, use and sell the Products.
License Property
The proprietary technology is relating to microwave plasma enhanced chemical vapor deposited or MPECVD, multi-layered optical coatings.
Field of Use
The Products produced for sale as coatings in display applications (CRT’s, Flat Panel Displays, Digitizers, Touch panels, etc) and coatings for flexible substrate applied to automotive and building glass and decorative and reflector applications, and for non low emissivity coatings on automotive and building glass, decorative and reflector glass applications.
IPSCIO Record ID: 26969
License Grant
Licensor grants to Licensee an exclusive license with respect to Liquid Polymer Material and SurgeTape, both within the Territory, and both to use (i) the Licensed Intellectual Property Rights; and (ii) the Technical Information, solely to manufacture, use, and sell these as Licensed Products provided, however, that, except as provided in the Agreement, Licensee shall have no right to manufacture the Liquid Polymer Material and SurgeTape unless the parties enter into a trade secret agreement permitting manufacture of the Liquid Polymer Material or SurgeTape by Licensee.
License Property
Liquid Polymer Material means a polymeric provided in a solvated liquid form that can be used to provide electrical overstress (EOS) or electrostatic discharge (ESD) protection for integrated circuits (IC’s). The Liquid Polymer Material can be applied between signal lines and the ground plane of an electrical board assembly, a connector and other applications where it can be positioned between signal lines and ground. The Liquid Polymer Material has a high impedance, and low leakage state during normal circuit operation. During an EOS or an ESD event, the Liquid Polymer Material has a low impedance state that shunts the offending charge to the ground plane. The capacitance of the devices using Liquid Polymer Material is typically less than I picofarad. The mechanical flexibility and the semiconducting characteristics of the Liquid Polymer Material allow for a wide variety of packaging concepts, including arrays in which a common ground is used with multiple signal lines.
SurgeTape means a flexible film of proprietary polymer-based material that can be applied between signal lines and a ground plane that has a high impedance and low leakage state during normal circuit operation. During an electrical overstress (EOS) or electrostatic discharge (ESD) event, the polymer has a low impedance state that shunts the offending charge to the ground plane.
Licensed Intellectual Property Rights shall mean, solely with respect to Licensed Products, Licensor’s interest in any patents, patent applications, inventions, the SurgX trademark, the SurgeTape trademark, Technical Information, and copyrights owned.
Licensed Marks shall mean solely the trademark SurgX' and the trademark SurgeTape(Trademark).
Field of Use
The term Licensed Products may include Discrete products to be mounted on printed circuit boards for the purpose of providing ESD protection, which discrete products are manufactured by depositing Liquid Polymer Material on a rigid substrate such as a FR-4 printed circuit board or a ceramic substrate. Examples of such discrete products include 1206, 0805, 0603 surface mount packages and board mounted network array packages. Such discrete products shall also include discrete arrays for placement on or in connectors such as RJ, D-subminiature and other connectors.
IPSCIO Record ID: 28130
License Grant
Licensor grants to Licensee a non-sublicensable, worldwide, royalty-bearing License under the Licensed FLT Fine Line Technology Patents, to make or have made, use, offer for sale, sell, and import Licensed FLT Products.
License Property
Licensed FLT Products means capacitive touch sensors comprising fine lines of copper metal printed on flexible plastic film.
Fine Line Technology Patents. Technology – A conductive metal layer is used in the manufacture of printed circuit boards, aerials, and antennae such as those found in mobile telephones, radio frequency identification devices (RFIDs), smart cards, contacts for batteries and power supplies, arrays of contacts for flat screen technologies (liquidcrystal displays, light emitting polymer displays and the like), electrodes for biological and electrochemical sensors, smart textiles and decorative features.
US Patent No 8435603 Formation of solid layers on substrates
US Patent No 8519048 Formation of solid layers on substrates
Field of Use
Licensee wishes to use the Licensed FLT Patents to commercialize the Licensed FLT Products. A conductive metal layer is used in the manufacture of printed circuit boards, aerials, and antennae such as those found in mobile telephones, radio frequency identification devices (RFIDs), smart cards, contacts for batteries and power supplies, arrays of contacts for flat screen technologies (liquidcrystal displays, light emitting polymer displays and the like), electrodes for biological and electrochemical sensors, smart textiles and decorative features.
Disclaimer: The information gathered from RoyaltySource® database was sourced from the U.S. Securities and Exchange Commission EDGAR Filings and other public records. While we believe the sources to be reliable, this does not guarantee the accuracy or completeness of the information provided. Further, the information is supplied as general guidance and is not intended to represent or be a substitute for a detailed analysis or professional judgment. This information is for private use only and may not be resold or reproduced without permission.
