Category: Technology Licenses
Created On: 2022-04-28
Record Count: 3
- Electrical & Electronics
- Material Composite
- Computers & Office Equipment
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 154265
IPSCIO Record ID: 179826
Licensor has issued and pending United States and foreign patents, which are hereinafter defined as 'Licensed Patents' relating to multi-layer circuit board construction and fabrication.
Excluded Products shall mean three-dimensional, multi-layer printed circuit boards which are designed or intended to be folded or bent upon installation, or multi-layer flexible circuit boards mountable on a flat rigidized heat sink, and including without limitation Type 3, Type 4 and Type 5 printed circuit or printed wiring boards as defined in MIL/STD- 2118 dated 4 May 1984, a copy of which is attached hereto.
Cap Material shall mean a copper layer having a C stage adhesive coating thereon over which a B stage adhesive coating is provided. This agreement pertains to the electronics relating to multi-layer circuit board construction and fabrication.
IPSCIO Record ID: 28594
U.S. Patent Number 5,736,910 issued in 1998 and titled â€œModular jack connector with a flexible laminate capacitor mounted on a circuit board.â€