Royalty Report: Electrical & Electronics, Coating, Fabrication – Collection: 154265


Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 3


This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 3

Primary Industries

  • Electrical & Electronics
  • Coating
  • Fabrication
  • Circuits
  • Semiconductors
  • Material Composite
  • Computers & Office Equipment

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 154265

License Grant
The parties amended the agreement regarding royalties for the Cap Material for Permitted Products.
License Property
The Companys current flexible interconnect products include flexible circuits, laminated cables, flexible/cable hybrid circuits and flexible interconnect assemblies.
Field of Use
This agreement pertains to flexible interconnects that are used in most segments of the electronics industry.

IPSCIO Record ID: 179826

License Grant
Licensor hereby grants to Licensee upon the terms as set forth herein, a royalty bearing license under the Licensed Patents solely for the purpose of providing to customers of Licensee a label license for use of Polyclad Cap Material in the fabrication of Permitted Products by such customers.

Licensor has issued and pending United States and foreign patents, which are hereinafter defined as 'Licensed Patents' relating to multi-layer circuit board construction and fabrication.

License Property
Permitted Products shall mean two dimensional, multi-layer printed circuit boards which are not designed nor intended to be folded or bent upon installation. Incidental flexibility of a product not to exceed 15 is permissible in an otherwise permitted product.

Excluded Products shall mean three-dimensional, multi-layer printed circuit boards which are designed or intended to be folded or bent upon installation, or multi-layer flexible circuit boards mountable on a flat rigidized heat sink, and including without limitation Type 3, Type 4 and Type 5 printed circuit or printed wiring boards as defined in MIL/STD- 2118 dated 4 May 1984, a copy of which is attached hereto.

Cap Material shall mean a copper layer having a C stage adhesive coating thereon over which a B stage adhesive coating is provided.  This agreement pertains to the electronics relating to multi-layer circuit board construction and fabrication.

IPSCIO Record ID: 28594

License Grant
The Company is a plaintiff in a lawsuit captioned Licensor v. Licensee brought in the United States District Court of New Jersey during June 2007.
License Property
The Company claims that Licensee has infringed a patent covering certain integrated connector modules made by Licensee.

U.S. Patent Number 5,736,910 issued in 1998 and titled “Modular jack connector with a flexible laminate capacitor mounted on a circuit board.”

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