Royalty Report: Semiconductors, Fabrication, Material Composite – Collection: 151

$100.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 3

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 3

Primary Industries

  • Semiconductors
  • Fabrication
  • Material Composite
  • Electrical & Electronics
  • Storage
  • Coating

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 151

License Grant
This License is in consideration for the License rights to the proprietary technology of the Licensor.
License Property
The technology refers to the manufacturing of rigid-flex printed circuits using a patented manufacturing process ('HVR Flex Ô Process').
Field of Use
The Licensee provides prepaid international phone cards and prepaid wireless services and manufactures printed circuit boards for quick-turn, prototype market and the defense supplier markets.  The Licensor manufactures PCBs using the HVR Flex Ô Process.

IPSCIO Record ID: 178126

License Grant
The parties agree to amend certain terms and conditions set forth in the original agreement to license certain ferroelectric technology and to supply certain products incorporating such technology.
License Property
The ferroelectric technology is the erroelectric RFID semiconductor chips used in the Companys Smart Card System that involves direct wireless radio frequency communication between a ferroelectric random access memory ('FRAM') chip in the Smart Card and a terminal.

Ferroelectric Technology means the technology referred to in Recital A and all patents, semiconductor chip or circuit Layout rights, copyrights, utility models, designs, confidential or other proprietary rights and applications or rights for registration therefor, processes, formulae, drawings, trade secrets, know-how, technical data and other information relevant to the design and manufacture of Ferroelectric RF/ID Products (as hereinafter defined) based on the Technology referred to in Recital A made or developed by Ramtron as of the date of this Agreement together with the Improvements.

IPSCIO Record ID: 179826

License Grant
Licensor hereby grants to Licensee upon the terms as set forth herein, a royalty bearing license under the Licensed Patents solely for the purpose of providing to customers of Licensee a label license for use of Polyclad Cap Material in the fabrication of Permitted Products by such customers.

Licensor has issued and pending United States and foreign patents, which are hereinafter defined as 'Licensed Patents' relating to multi-layer circuit board construction and fabrication.

License Property
Permitted Products shall mean two dimensional, multi-layer printed circuit boards which are not designed nor intended to be folded or bent upon installation. Incidental flexibility of a product not to exceed 15 is permissible in an otherwise permitted product.

Excluded Products shall mean three-dimensional, multi-layer printed circuit boards which are designed or intended to be folded or bent upon installation, or multi-layer flexible circuit boards mountable on a flat rigidized heat sink, and including without limitation Type 3, Type 4 and Type 5 printed circuit or printed wiring boards as defined in MIL/STD- 2118 dated 4 May 1984, a copy of which is attached hereto.

Cap Material shall mean a copper layer having a C stage adhesive coating thereon over which a B stage adhesive coating is provided.  This agreement pertains to the electronics relating to multi-layer circuit board construction and fabrication.

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