Royalty Report: Semiconductors, Fabrication, Scientific & Technical Instruments – Collection: 134397

$150.00

Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 14

Description

This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 14

Primary Industries

  • Semiconductors
  • Fabrication
  • Scientific & Technical Instruments
  • Machinery
  • Lithography
  • Electrical & Electronics
  • X-ray
  • IC

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 134397

License Grant
The Licensor released the non-compete clause in the agreement for a royalty payment in the field of pre-owned equipment sales through January 2002.
License Property
The pre-owned equipment is semiconductor production equipment relating to semiconductor manufacturing tools and systems.
Field of Use
This agreement pertains to the semiconductor industry.

IPSCIO Record ID: 6873

License Grant
The Company of Israel  signed a technology-License Agreement, whereby the Company received a patent usage right as well as equipment from an undisclosed Licensor.
License Property
Metrology systems measure various thin film properties, critical circuit dimensions and layer-to-layer circuit alignment, known as overlay, during various steps in the semiconductor manufacturing process, allowing semiconductor manufacturers to increase quality, productivity and yields, lower their manufacturing costs and increase their profitability
Field of Use
The Licensee is a worldwide leading designer, developer and producer of integrated process control metrology systems used in the manufacture of semiconductors and a leading designer, manufacturer and producer of stand-alone process control metrology systems.

IPSCIO Record ID: 3598

License Grant
The Company entered into an additional Agreement acquiring an Exclusive License to manufacture, sell and provide services and parts support for certain reactive ion etch semiconductor manufacturing equipment for wafer sized up to 200mm now marketed under the ASI trade names Arista and Arista Dual.
License Property
Products as used herein shall mean certain reactive ion etch semiconductor manufacturing equipment for wafer sizes up to 200mm under the trade names Bobcat 209 or Cheetah (limited to such equipment that includes at least one reactive ion etch chamber) including software, components and parts therefor.
Field of Use
Dry strip semiconductor manufacturing equipment As part of the chip creation process, a light sensitive, polymer-based liquid, called photoresist, is spread in a uniformly thin film on the wafer in pattern creating a stencil effect. Photostabilization uses ultraviolet light to harden, or cure, the photoresist so that it is more effective in maintaining the desired pattern during the subsequent implant processes and etch steps (in which the top layer of the surface of the wafer not covered by photoresist is removed). After these steps, the photoresist is no longer.

IPSCIO Record ID: 6602

License Grant
Austrian Licensor hereby grants to Licensee a license under Infineon Background IPR to use the to make Licensed Products and to sell and offer to sell such Licensed Products to its customers. This agreement granted a non-exclusive License to incorporate the technology developed under the Development Agreement into Licensee products based on the Stratus S200 tool platform. The License does not commence until January 1, 2014.
License Property
Intellectual Property Rights” shall mean any patents, patent rights, trademarks, service marks, registered designs, applications for any of the foregoing, copyright, unregistered design right and any other similar protected rights in any country.

Licensed Product/s shall mean any product based on the tool platform of NEXX Stratus 5200.

Pursuant to the terms of the Development Agreement we entered into with Infineon in September 2008, we have agreed to carry out the development of customized tool features, based on our Stratus S200 tool platform, and to provide Infineon with the results of this development work for use in Infineon’s manufacturing process for logic and semiconductors. Infineon will own the results of the development work other than any enhancements to the tool platform, which shall belong to us.

Field of Use
The Licensee meets the demand for smaller, high performance packages in the electronics industry, by designing, manufacturing, selling, installing and servicing highly-engineered semiconductor process equipment that automates the packaging of semiconductor devices. Advanced packaging process solutions include electrochemical deposition (ECD) systems used to deposit metal layers to plate wafer bumps or copper pillars and redistribution layers as well as fill 3D TSVs.

IPSCIO Record ID: 27456

License Grant
The Company licensed certain trademarks and technology, and granted to a company headquartered in Kanagawa Prefecture, Japan the exclusive right to manufacture and sell in Japan, Korea, Taiwan, Hong Kong, China, India, the Philippines, Thailand, Vietnam, Malaysia, Singapore and Indonesia, and such other countries as the parties may agree to from time to time, products similar to those manufactured and distributed by the Company.
License Property
The Company designs, develops, manufactures, markets and services chemical mechanical planarization, or CMP, systems used in the fabrication of semiconductor devices as well as other high throughput precision surface processing systems used in the fabrication of thin film memory disk media, semiconductor wafers and general industrial components; products include polishing, grinding and lapping equipment and systems; cleaning systems; other high precision surface processing equipment; and certain other products used in its customers’ manufacturing process, including slurries.

IPSCIO Record ID: 291104

License Grant
The Parties previously entered into three (3) technology license agreements relating to a technology known as C-4 plating technology in which certain license rights were granted to Licensee.  The Parties desire to extend the license rights previously granted.

Licensor extends the license rights granted in the C-4 Agreements for Licensee to perform Bumping on 300mm semiconductor wafers solely for Licensee only in the Dresden Facility, manufacture Licensed Products solely for Licensee only in the Dresden Facility using Bumping on 300mm semiconductor wafers, use solely for Licensee Licensed Products only in the Dresden Facility using Bumping on 300mm semiconductor wafers, sell and have sold worldwide solely under the Licensee brand name Licensed Products manufactured using Bumping on 300mm semiconductor wafers, and manufacture only in the Dresden Facility and have manufactured by Another Manufacturer for Licensee’s internal use only, any apparatus designed or modified to implement Bumping of 300mm semiconductor wafers.

Licensor grants the right to use the Licensed Technology to perform Bumping of 200mm semiconductor wafers for third parties.

The license rights extended to Licensee are nonexclusive, nontransferable and revocable.

License Property
Bumping shall have the meaning in the C-4 Plating Technology Transfer and Licensing Agreement.  Typically, Wafer bumping is an essential to flipchip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where “bumps” or “balls” made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips.
Field of Use
The agreement relates to the semiconductor industry.

IPSCIO Record ID: 28876

License Grant
In a License Agreement with a related party the Licensee acquired the right to certain X-ray technology.
License Property
The Licensee develops, manufactures, services and supports state-of-the-art X-ray lithography steppers. This equipment is used in the research and development for future production of semiconductors

IPSCIO Record ID: 29174

License Grant
The Licensor granted the Japanese Licensee, an exclusive, royalty bearing, nontransferable right and license during the term of this Agreement in the territory of Japan, to use Licensor's patents, copyrights, mask work rights and proprietary information with respect to the Product, a excimer laser, the primary market for which is for use in DUV photolithography equipment for manufacturing deep-submicron semiconductor devices.

Licensor hereby grants to Licensee the right to use Licensor's trademarks, provided that any use of Licensor's trademarks by Licensee shall be subject to prior approval of Licensor. Any use by Licensee shall be subject to revocation by Licensor if Licensor determines that the quality of Product manufactured by Licensee is not as good or better than that manufactured by Licensor.

License Property
The Licensor is the world's leading supplier of excimer laser illumination sources, the essential light source for deep ultraviolet (DUV) photolithography systems used in the manufacture of semiconductors.
Field of Use
Licensee is granted rights for use in DUV photolithography equipment for manufacturing deep-submicron semiconductor devices.

IPSCIO Record ID: 6727

License Grant
The Parties have agreed to the joint development of semiconductor apparatus and processes relating to plating technology for advanced packaging and integration solutions in semiconductor processing and manufacturing. The Licensor has granted a license under its intellectual property rights to develop, make, have made and sell certain products.
License Property
Packaging Technology means any process, procedure, software, or hardware tools used in the packaging of Integrated Circuit products into single-chip packages, multi-chip packages, or any other higher levels of assembly.

IPSCIO Record ID: 28421

License Grant
Japanese Parent hereby grants to Licensee a non-exclusive and non-transferable license under Parent Licensed Patents to make, have made, use, sell, offer to sell, lease, import or otherwise dispose of Licensed Products other than Manufacturing Apparatuses anywhere in the world.  

Licensed Product means any of the items described in the following clauses (a) through (d) and/or parts thereof (a) Semiconductive Material;(b) Auxiliary Part; (c) Semiconductor Product; or (d) Manufacturing Apparatus.

Semiconductor Product means (a) a Semiconductive Element; or (b) a Semiconductive Element and one or more films of conductive, semiconductive or insulating materials formed on a surface or surfaces of such Semiconductive Element, said film or films comprising one or more conductors, active or passive electrical circuit elements or any combination thereof.

IPSCIO Record ID: 315856

License Grant
Licensor grants an exclusive license for the life of the patents to use, import, export, sell and offer to sell, but not to make, any Licensor Materials supplied or developed under this Agreement, only in the Field.
License Property
Photomasks are high-purity quartz or glass plates containing precision images of integrated circuits and are used as masters by semiconductor manufacturers to optically transfer these images onto semiconductor wafers. Photomasks are a necessary component in the production of semiconductors.

Licensor is currently the only photomask manufacturer in the world that also manufactures photoblanks and pellicles, the principal components of photomasks.

Field of Use
The field is the area of advanced photomask technology, such as photomasks, blanks and pellicles.  The technology is used in photolithography for microelectronic applications, including pellicles for optical markets, and specifically the semiconductor industry.

IPSCIO Record ID: 328

License Grant
Japanese Licensor hereby grants to Licensee the exclusive License under the Patents, Technical Information and Intellectual Property Rights to manufacture, use, offer for sale, sell, import and/or lease the Products in the territory; provided, however, Licensee agrees not to manufacture any of the three Products listed in this Agreement at any time on or prior to June 30, 2006; provided further, however, that Licensee may start on the effective date to manufacture, use, offer for sale, sell, import and/or lease in the territory all subsystems related to any Products, including, but not limited to, the Nison Vesper submodule. For the avoidance of doubt, Licensor acknowledges and agrees that the License granted to Licensee under this Agreement includes the right of the Licensee to subLicense to any purchaser of the Products the right to use (but not manufacture) the Patents, Technical Information and Intellectual Property Rights.
License Property
Licensor was incorporated to, among other things, manufacture and distribute certain products and systems of Licensee in Japan in accordance with a Shareholders Agreement dated June 5, 1991.  This license is a result of Licensor buying a portion of the business of a semiconductor manufacturing equipment business and licensing back rights to Licensee.

The parties agree that the definition of Products includes subsystems related to the products (e.g. the Nison Vesper submodule) only to the extent such subsystems are incorporated in Products sold by Licensee to end-users of the Products and not to original equipment manufacturers.  Three products are covered by this agreement Spin Processor CENOTE, a single wafer wet station; Best, a wafer backside3 etcher, and Wet Station, an immersion process system.

Patent

Title
No.
number

number
Country

1
Method of recirculation of high temperature etching solution
63–248757
02–096334

1653241
Japan

2
Cleaning/ rinsing vessel for semiconductor wafer
03–350731
05–166787

2013691
Japan

3
Method for refinig etchant
05–253672
07–086260

3072876
Japan

4
Single wafer spin etching method
07–104581
08–279485

3459137
Japan

5
Etching method with hot phosphoric acid
07–216528
09–045660

3459141
Japan

6
Composition measuring method for buffered hydrofluoric acid for semiconductor wafer etching
07–163075
08–334461

N/A
Japan

7
Regeneration treatment apparatus for etchant and etching apparatus using the same
10–095836
11–293479

N/A
Japan

8
Cleaning apparatus
11–199868
2001–028356

N/A
Japan

9
Filter device with bellows damper and chemical–circulation treatment device for semiconductor wafer using the same
11–222204
2001–046815

N/A
Japan

10
Semiconductor wafer cleaning system
11–234855
2001–060574

N/A
Japan

11
Method of etching semiconductor wafer
11–271065
2001–093876

N/A
Japan

12
Device and method for etching semiconductor wafer
11–314794
2001–135611

N/A
Japan

13
Scrub cleaning device
2000–044343
2001–237209

N/A
Japan

14
Cleaning Equipment of wafer
2000–274592
2002–093764

N/A
Japan

15
Equipment and method for processing solution for semiconductor wafer
2001–009915
2002–217165

N/A
Japan

16
Wafer–cleaning device
2001–158580
2002–353183

N/A
Japan

17
The apparatus and the method of etching wafer
2002–42120
2003–243353

N/A
Japan

18
The apparatus of reclaiming etching liquid and method and apparatus of etching
2002–269405
N/A

N/A
Japan

19
The method of controlling the boiling chemical
2002–318730
2004–153164

N/A
Japan

20
The apparatus and the method of floating wafer chuck
2002–108651
2003–303871

N/A
Japan

21
The apparatus of wafer treatment and shaft
2003–47148
N/A

N/A
Japan

22
Etching method and equipment
2002–324795
2004–158746

N/A
Japan

23
Processing method and processing device before wafer inspection
2001–266653
2003–75312

N/A
Japan

24
Processing method and processing device before wafer inspection
2002–156835
2003–344243

N/A
Japan

25
Method for recirculating high–temperature etching soluthin
412444
N/A

4980017
USA

26
Method for purification of etching solution
305334
N/A

5470421
USA

Trademarks

Class of

NO
Trademark
goods
Designated goods

1 NISON
7
The apparatus of filtering recirculation etching liquid and other chemical machines and instruments

2 NISON
9
Automatic fluid– composition control machines and instruments

3 CENOTE
7
The apparatus of wafer etching, chemical machines and instruments

4 Stelna
7
The machines of chemical reaction and machines of separation, the chemical reclaiming etching apparatus, and other chemical machine and instruments.

Remark An application shall designate one or more items of goods on which the trademark is to be used, in one class of the classification of goods, prescribed by Cabinet Order.

Product
Product Name

Description

Spin Processor CENOTE
Single Wafer Wet Station

Best

                Wafer Backside Etcher

Wet Station

Immersion Process System

Field of Use
Products means any and all products, systems and subsystems now or hereafter produced by or under control of Licensee based upon the Technical Information given under this Agreement which are in the field of surface conditioning, cleaning, etch and stripping technology such as the Technical Information used in the products to this Agreement and any products, systems and subsystems to be used in the Field which will be developed, designed or invented, or otherwise acquired by Licensor in the future during the term of this Agreement.

IPSCIO Record ID: 293482

License Grant
The Parties wish to settle, dismiss, and terminate the Pending Proceedings and grant each other certain rights and releases under their respective patents pursuant to the terms and conditions of this Agreement.

The Dutch Licensor grants to the Japanese Licensee, under the Licensor Licensed Patents, retroactive to the Effective Application Date of each Licensor Licensed Patent, a non-exclusive, non-sublicensable, non-transferable license, only during the Term, to (a) make, use, including use with patterns or masks for processing substrates such as wafers, Sell, offer to Sell, import and export Licensee Licensed Products anywhere in the world, (b) have Licensee Licensed Products made by its manufacturers anywhere in the world, provided that, solely for purposes of this clause (b) and such have made right is conditioned upon (i) such manufacturers making the Licensee Licensed Products in accordance with specifications provided by a Licensee Grantee Entity, and (ii) such Licensee Licensed Products not being off the shelf products offered for Sale by or on behalf of such manufacturer to Persons other than Licensee Grantee Entities, (c) practice any method or process anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold, and (d) make, have made, and use, including use with patterns or masks for processing substrates such as wafers, any tool, software, machine, or other apparatus anywhere in the world in connection with the design, manufacture, installation, assembly, operation, adjustment, measurement, qualification, maintenance, support, repair, or diagnosis of Licensee Licensed Products designed, made, used and/or Sold.

License Property
Licensee Licensed Products means
(a) Lithography Equipment and Lithography Components, and, in each case, all applications therefor, and
(b) Digital Cameras and all applications therefor; provided, however, that Licensee Licensed Products exclude (i) Licensee Excluded Products and (ii) Components that are solely for use in Licensee Excluded Products. For the avoidance of doubt, Lithography Equipment, Lithography Components, and Digital Cameras are licensed in their entirety, including any Third Party Components thereof. Without limiting the generality of the foregoing, as of the Effective Date, Licensee Licensed Products include Licensee’s and its Grantee Entities’ products within the following product lines NSR series, FX series, LithoBooster, D series, Z series, COOLPIX series, and KeyMission series.

Licensor Licensed Products means Lithography Equipment and Lithography Components, and, in each case, all applications therefor; provided, however, that Licensor Licensed Products exclude (a) Licensor Excluded Products and (b) Components that are solely for use in Licensor Excluded Products.

Lithography Components means, individually and collectively, Components for use in Lithography Equipment, including (a) separately installed Components of any Lithography Equipment, (b) any optical elements, modules and systems, including illumination optical systems, projection optical systems, manipulation devices and mounting means of any Lithography Equipment, (c) any Components integrated in any Lithography Equipment, (d) materials for use in, and solely to the extent they are for use in, the operation of any Lithography Equipment, such as fluids and gases, (e) any software installed in such Lithography Equipment that is used to operate or control such Lithography Equipment, solely to the extent it is for use in the operation or control of Lithography Equipment; including where such Lithography Equipment uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers; and (f) processes, materials and devices for designing, manufacturing, assembling, adjusting and qualifying any of the items described above; provided, however, that Lithography Components shall not include masks, resists, or substrates themselves. Notwithstanding the foregoing, Lithography Components include any entire standalone assembly of a tool or machine, where a standalone assembly of a tool or machine means an assembly that is not included in any Lithography Equipment, solely for (i) measuring either or both alignment marks on a wafer and the topography of a wafer, and (ii) using such measurements solely to calculate feedforward corrections for wafer stage positioning in an Immersion Lithography System, which, for the avoidance of doubt, includes Licensee’s LithoBooster Standalone Alignment Station as and in the form marketed by Licensee as of the Effective Date. For the avoidance of doubt, Lithography Components does not include, by way of examples only, the products of Licensor’s Applications Business Lines, including Licensor’s Yieldstar line of products and including the products of Licensor’s HMI and Brion businesses, in each case, as and in the form such products are marketed by Licensor and its Grantee Entities as of the Effective Date.

Lithography Equipment means any tool or machine for forming or transferring a pattern on or onto a substrate by Lithography for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements to any of the foregoing, including where such tool or machine uses and/or incorporates masks, or uses, incorporates and/or processes resists or substrates, including wafers, or performs maskless Lithography; provided, however, that Lithography Equipment shall not include masks, resists, or substrates themselves. For the avoidance of doubt, except where expressly indicated otherwise in this Agreement, Lithography Equipment includes EUV Lithography Equipment and FPD/Large Area Substrate Equipment.

“Digital Camera” means a complete digital camera or digital camera body for personal or professional photography (including video) use. “Digital Camera” does not include microscopes, medical imaging equipment, or stand-alone lenses.

“EUV Lithography Equipment” means Lithography Equipment that performs Lithography using radiation with wavelengths of 20 nanometers or less, and all Components thereof.

“FPD/Large Area Substrate Equipment” means Lithography Equipment (a) for the manufacture of flat panel displays, or (b) for exposing large area substrates, other than semiconductor wafers, having a dimension greater than 500 mm along any dimension.

Field of Use
The field of use is Lithography and optical equipment  for use in the fabrication of integrated circuits, thin film heads, flat panel displays, micromachines, and other applications with similar requirements.

IPSCIO Record ID: 5826

License Grant
Licensor hereby grants to the Licensee and its Affiliates a worldwide, exclusive, non-sublicensable or transferable, irrevocable, license to utilize Licensed Technology to manufacture, use, sell, maintain and service the Products.
License Property
Products as used herein shall mean certain dry strip semiconductor manufacturing equipment under the trade names System One and System Ten, including software, components and parts therefor.  

  US Patent No.      Filed Date                   Title

    5,209,803          5/11/93     Parallel plate reactor and method of use

    5,015,331          8/10/90     Method of plasma etching with parallel plate reactor having a grid

    4,971,653         11/20/90     Temperature controlled chuck for elevated temperature etch processing

Field of Use
The rights granted apply to dry strip semiconductor manufacturing equipment.
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