Category: Technology Licenses
Created On: 2022-04-28
Record Count: 3
IPSCIO Report Record List
Below you will find the records curated into this collection. This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs. The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms. For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report
IPSCIO Record ID: 1205
IPSCIO Record ID: 291104
Licensor extends the license rights granted in the C-4 Agreements for Licensee to perform Bumping on 300mm semiconductor wafers solely for Licensee only in the Dresden Facility, manufacture Licensed Products solely for Licensee only in the Dresden Facility using Bumping on 300mm semiconductor wafers, use solely for Licensee Licensed Products only in the Dresden Facility using Bumping on 300mm semiconductor wafers, sell and have sold worldwide solely under the Licensee brand name Licensed Products manufactured using Bumping on 300mm semiconductor wafers, and manufacture only in the Dresden Facility and have manufactured by Another Manufacturer for Licenseeâ€™s internal use only, any apparatus designed or modified to implement Bumping of 300mm semiconductor wafers.
Licensor grants the right to use the Licensed Technology to perform Bumping of 200mm semiconductor wafers for third parties.
The license rights extended to Licensee are nonexclusive, nontransferable and revocable.
IPSCIO Record ID: 28876