Royalty Report: Semiconductors, Fabrication, X-ray – Collection: 1205


Curated Royalty Rate Report
Category: Technology Licenses, Created On: 2022-04-28, Record Count: 3


This collection of transactions and supporting information was developed using our AI algorithm to curate similar royalty reports into a cohesive collection to support your licensing, transfer pricing or other transaction scenarios where documented royalty rates and/or deal terms are important.
Category: Technology Licenses
Created On: 2022-04-28
Record Count: 3

Primary Industries

  • Semiconductors
  • Fabrication
  • X-ray

IPSCIO Report Record List

Below you will find the records curated into this collection.  This summary includes the complete licensed property description so that you can review and determine if this collection covers the topics, technology or transaction type that is relevant for your needs.  The full report will include all relevant deal data such as the royalty base, agreement date, term description, royalty rates and other deal terms.  For reference, here is a sample of a full IPSCIO curated royalty rate report: Sample Report

IPSCIO Record ID: 1205

License Grant
The Company entered into an Agreement and Plan of Merger by and among a Delaware corporation in the business of research, development and licensing of advanced technologies for semiconductor manufacturing, and a California corporation and wholly-owned subsidiary of the Delaware corporation formed for the purpose of acquiring the Company's business.

IPSCIO Record ID: 291104

License Grant
The Parties previously entered into three (3) technology license agreements relating to a technology known as C-4 plating technology in which certain license rights were granted to Licensee.  The Parties desire to extend the license rights previously granted.

Licensor extends the license rights granted in the C-4 Agreements for Licensee to perform Bumping on 300mm semiconductor wafers solely for Licensee only in the Dresden Facility, manufacture Licensed Products solely for Licensee only in the Dresden Facility using Bumping on 300mm semiconductor wafers, use solely for Licensee Licensed Products only in the Dresden Facility using Bumping on 300mm semiconductor wafers, sell and have sold worldwide solely under the Licensee brand name Licensed Products manufactured using Bumping on 300mm semiconductor wafers, and manufacture only in the Dresden Facility and have manufactured by Another Manufacturer for Licensee’s internal use only, any apparatus designed or modified to implement Bumping of 300mm semiconductor wafers.

Licensor grants the right to use the Licensed Technology to perform Bumping of 200mm semiconductor wafers for third parties.

The license rights extended to Licensee are nonexclusive, nontransferable and revocable.

License Property
Bumping shall have the meaning in the C-4 Plating Technology Transfer and Licensing Agreement.  Typically, Wafer bumping is an essential to flipchip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where “bumps” or “balls” made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips.
Field of Use
The agreement relates to the semiconductor industry.

IPSCIO Record ID: 28876

License Grant
In a License Agreement with a related party the Licensee acquired the right to certain X-ray technology.
License Property
The Licensee develops, manufactures, services and supports state-of-the-art X-ray lithography steppers. This equipment is used in the research and development for future production of semiconductors
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